Multilayer Ceramic Chip Capacitors FEATURES • CLASS I DIELECTRIC, TEMPERATURE COMPENSATING • HIGH STABILITY OVER TIME, VOLTAGE AND TEMPERATURE CHANGES • LOW DIELECTRIC LOSS • NICKEL BARRIER TERMINATIONS AND EXCELLENT MECHANICAL STRENGTH NMC Series NPO Expanded Value Range Up to 0.1mF SPECIFICATIONS NPO Capacitance Range Capacitance Tolerance 0.3pF to 0.1µF <5pF: ±0.1pF(B), ± 0.25pF(C) >5pF to <10pF: ±0.1pF(B), ± 0.25pF(C), ±0.5pF(D) 10pF and above: ±1%(F), ±2%(G), ±5% (J) -55°C ~ +125°C 0 ± 30ppm/°C 10Vdc, 16Vdc, 25Vdc, 35Vdc, 50Vdc, 100Vdc (see NMC-H Series for higher voltages) For values >30pF 0.1% @ 25°C; For values < 30pF Q=400+20 x C (C in pF) 10,000Megohms min. or 500Megohm/µF (min.), whichever is less @ +25°C 250% of Rated Voltage for 5 ±1 seconds, 50mA maximum current <1000pF; 1MHz, 1.2Vrms max. or >1000pF; 1KHz, 1.2Vrms max. Operating Temperature Range Temperature Characteristics Rated Voltages Dissipation Factor insulation Resistance Dielectric Withstanding Voltage Test Conditions (EIA-198-2E) Typical NPO Temperature Coefficient 0.4 0.3 0.2 0.1 0.0 -0.1 -0.2 -0.3 -0.4 -55 Voltage Coefficient of Capacitance - NPO 0.2 10,000 0.1 Minimum Insulation Resistance vs Temperature 1000 0.0 100 -0.1 -25 0 25 50 75 100 Temperature (Degrees Celsius) 125 -0.2 Impedance vs. Frequency NPO 1000 10 10 0 10 20 30 40 50 60 70 80 90 100 DC Volts Applied Aging Rate - NPO 0.2 100 25 100 150 Temperature (Degrees C) 0.1 1000pF 10 100pF 0.0 1 -0.1 0.1 -0.2 0.01 1 10 100 Frequency (MHz) 1000 1 10 100 Hours 1000 10000 PART NUMBER SYSTEM NMC 0805 NPO 101 J 50 TRP or TRPLP 3K F Series RoHS Compliant "3K" denotes optional reel quantity or "4" denotes optional 4mm carrier width (01005 case size only) Tape & Reel (Embossed Plastic Carrier) Tape & Reel (Punched carrier) Voltage (Vdc) Capacitance Tolerance Code (see chart) Capacitance Code, expressed in pF, first 2 digits are significant, 3rd digit is no. of zeros, “R” indicates decimal for under 10pF Temperature Characteristic Size Code (see chart) ® 1 NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com Specifications are subject to change www.SMTmagnetics.com Multilayer Ceramic Chip Capacitors EIA Case Size Length (L) Width (W) Thickness max. (T) Termination Width (P) Capacitance 01005 0.4±0.02 0.2±0.02 0.22 0.10 +0.04/-0.03 Working Voltage (Vdc) 16 0.5pF 0.6pF 0.7pF 0.8pF 0.9pF 1.0pF 1.1pF 1.2pF 1.3pF 1.5pF 1.6pF 1.8pF 2.0pF 2.2pF 2.4pF 2.5pF 2.7pF 3.0pF 3.3pF 3.6pF 3.9pF 4.0pF 4.7pF 5.0pF 5.6pF 6.0pF 6.2pF 6.8pF 7.0pF 7.5pF 8.0pF 8.2pF 9.0pF 9.1pF 10pF 12pF 15pF 18pF 22pF 27pF 33pF 39pF 47pF 56pF 68pF 82pF 100pF Highlighted values available on 4mm carrier, 40K pieces per reel. (CONSULT FACTORY FOR CAPACITANCE VALUES NOT LISTED) EIA Case Size Length (L) Width (W) Thickness max. (T) Termination Width (P) Capacitance NMC Series NPO 0201 0.6±0.03 0.3±0.03 0.33 0402 1.0±0.05 0.5±0.05 0.6 0603 1.6±0.15 0.8±0.15 1.0 0805 2.0±0.2 1.25±0.2 1.35 0.15±0.05 0.2±0.1 0.12 ~ 0.51 0.25 ~ 0.71 Working Voltage (Vdc) 10 16 25 50 16 25 50 100 16 25 50 100 16 25 50 100 0.3pF & 0.4pF 0.47pF ~ 22pF 24pF 27pF 30pF 33pF 36pF 39pF 43pF 47pF 51pF 56pF 62pF 68pF 75pF 82pF 91pF 100pF 110pF 120pF 130pF 150pF 160pF 180pF 200pF 220pF 240pF 270pF 300pF 330pF 360pF 390pF 430pF 470pF 510pF 560pF 620pF 680pF 750pF 820pF 910pF 0.001µF 0.0012µF 0.0015µF 0.0018µF 0.0022µF 0.0027µF 0.0033µF 0.0039µF 0.0047µF 0.0056µF 0.0068µF 0.0082µF 0.01µF * * * * * * * * * * * * * * *1.45mm maximum thickness ® 2 NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com Specifications are subject to change www.SMTmagnetics.com Multilayer Ceramic Chip Capacitors EIA Case Size Length (L) Width (W) Thickness max. (T) Termination Width (P) Capacitance 0.47pF ~ 9.1pF 10pF ~ 22pF 24pF ~ 0.001µF 0.0012µF 0.0015µF 0.0018µF 0.0022µF 0.0027µF 0.0033µF 0.0039µF 0.0047µF 0.0056µF 0.0068µF 0.0075µF 0.0082µF 0.0091µF 0.01µF 0.012µF 0.015µF 0.018µF 0.022µF 0.027µF 0.033µF 0.039µF 0.047µF 0.056µF 0.068µF 0.082µF 0.1µF 0805 2.0±0.2 1.25±0.2 1.45 0.25 ~ 0.71 NMC Series NPO 1206 3.2±0.2 1.6±0.2 1.80 0.25 ~ 0.71 1210 3.2±0.2 2.5±0.2 1.80 0.25 ~ 0.71 Working Voltage (Vdc) 16 25 50 100 10 16 25 50 100 10 16 25 50 100 1812 4.5±0.3 3.2±0.25 1.80 0.25 ~ 0.76 25 50 100 2225 5.70±0.4 6.35±0.25 1.80 0.25 ~ 1.02 50 100 See the previous page ** ** ** ** *1.90mm maximum thickness, **2.60mm maximum thickness See NMC High Capactiance datasheet for higher capacitance values or NMC-H High Voltage datasheet for higher voltage ratings W T P P L 100% Sn over Ni barrier ® 3 NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com Specifications are subject to change www.SMTmagnetics.com Multilayer Ceramic Chip Capacitors REEL Taping Specifications REEL DIMENSIONS (mm) Reel Diameter (A) B C 7” (178 ± 2.0) 50 min. 13.0 10” (250 ± 2.0) 100 ± 1.0 ± 0.5 13” (330 ± 2.0) 100 ± 1.0 B D D T max. 4mm Carrier: 5.0 ± 1.5 8mm Carrier: 8.4 ± 1.0 12mm Carrier: 12.8 ± 0.5 21.0 ± 1.0 CARRIER TAPE MATERIAL C Parts with a thickness of >1mm will be taped on embossed plastic carrier. Parts with a thickness of less then 1mm will be taped on paper carrier T A 7 INCH REEL QUANTITIES* Size Tape Size Min. Qty Per Reel Max. Qty Per Reel 4mm 01005 8mm 0201 8mm 0402 8mm 0603 8mm 0805 8mm 1206 8mm 1210 8mm 1812 12mm 2225 12mm 40,000 20,000 20,000 10,000 4,000 4,000 4,000 2,000 1,000 400 40,000 20,000 20,000 10,000 4,000 5,000 5,000 5,000 2,000 1,000 *Quantity dependent on chip thickness. Contact NIC for reel quantities on larger diameter reels. 8MM & 12MM EMBOSSED PLASTIC CARRIER TAPE DIMENSIONS (mm) Carrier Width W F 8mm 8.0 ± 0.2 3.5 ± 0.05 12mm 12 ± 0.2 5.5 ± 0.05 E P0 P2 D K max. 1.75 ± 0.10 4.0 ± 0.1 2.0 ± 0.5 1.5 +0.1-0.0 3.0 T max. P 2.0 4.0 ± 0.1 4.5 8.0 ± 0.1 Notes: 1. Specifications are in compliance with EIA RS481-1-A “Taping of surface Mount Components for Automatic Placement” 2. Dimensions Ao (max.) equals component width dimension plus 0.5mm 3. Dimension Bo (max.) equals component length dimension plus 0.5mm D Po T E P2 F Bo W Ao P K See notes 2 & 3 regarding dimensions Ao and Bo ® 4 NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com Specifications are subject to change www.SMTmagnetics.com Multilayer Ceramic Chip Capacitors Taping Specifications 4MM (01005 CASE SIZE) EMBOSSED PLASTIC CARRIER TAPE DIMENSIONS (mm) Carrier Width A0 4mm 0.23 ± 0.02 B0 W F E P P1 P2 D 0.43 ± 0.02 4.0 ± 0.05 1.8 ± 0.02 0.90 ± 0.05 2.0 ± 0.04 1.0 ± 0.02 1.0 ± 0.02 1.5 +0.1-0.0 D K max. T max. 0.50 0.15 ~ 0.40 P T E P2 F Bo W Ao P1 K PUNCHED CARRIER TAPE DIMENSIONS (mm) Type Ao Bo 01005 0.25 ± 0.04 0.45 ± 0.04 0201 0.37 ± 0.03 0.67 ± 0.05 0402 0.65 ± 0.05 1.15 ± 0.05 0603 1.1 ± 0.2 1.9 ± 0.2 0805 1.65 ± 0.2 2.4 ± 0.2 1206 2.0 ± 0.2 3.6 ± 0.2 W F E P1 P0 D0 4.0 ± 0.1 1.5 +0.1/-0.0 2.0 ± 0.05 8.0 ± 0.3 3.5 ± 0.05 1.75 ± 0.1 4.0 ± 0.10 T1 max. 0.27 0.45 T2 max. 0.36 0.80 1.1 1.4 Mounting Hole Angular Punch Hole PUNCHED CARRIER TAPE D Po t1 E F Bo t2 Ao W P1 Component Pitch ® 5 NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com Specifications are subject to change www.SMTmagnetics.com