DC630V(C):(DC630V,0.022µF-0.033µF)

REFERENCE
REFERENCE
28-76
Clsf.
Standard Doc.
PLASTIC
Product
Specifications
No.
FILM
TYPE
Item
CHIP CAPACITOR
ECWUC2J
No.
1-37
B
P.
2/16
Testing method
JISC5101-23:2008
4.3.2
IEC60384-23:2005
4.3.2
JISC5101-23:2008
4.3.3
IEC60384-23:2005
4.3.3
JIS C 5102-1994
7.10
IEC 60384-1-1982
Revision Code
Performance
3.
Capacitance
Within a range of specified value.
(Measured at a frequency of 1 kHz± 0.2 kHz, at 20 ˚C
± 2 ˚C and a voltage of 5 V or less.)
4.
Dissipation
factor
1.0 % or less
(Measured at a frequency of 1 kHz± 0.2 kHz, at 20 ˚C
± 2 ˚C and a voltage of 5 V or less.)
5.
Connection
6.
Vibration proof
The connection of the element shall not open even
instantaneously when applied a voltage of 100 mV peak
or less and applied light force.
The capacitor shall be mounted on the PC board, and
the following vibration shall be applied to the capacitor.
Range of vibration frequency 10 Hz to 55 Hz total
amplitude 1.5 mm, rate of frequency vibration to be such
as to vary from 10 Hz to 55 Hz and return to 10 Hz in
JIS C 5101-1-2004
about 1 min and thus repeated.
4.17
Thus shall be conducted for 2 h each (total 6 h) in 3 mutually
IEC 60384-1-1982
perpendicular directions.
4.17
The connection shall not get short-circuit or open when
examined the connection of the element in compliance
with the previous item (connection of element) during
the last 30 min of the test.
The terminal shall be immersed in methanol solution of
resin (about 25 %) and the terminal shall be immersed
in the solder bath at a temperature of 255 ˚C± 3 ˚C for
2.5 s± 0.5 s. Composition of test solder: Sn-Ag-Cu.
After test immersion, the solder shall be slicked to more
than 90 % in the surface of the electrodes.
0.2 mm
7.
0.2 mm
Upper and lower surface
of electrode
Soldering
Property
Side surface of electrode
Development chart of electrode
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
JISC5101-23:2008
4.7
IEC60384-23:2005
4.7
REFERENCE
28-76
Clsf.
Standard Doc.
PLASTIC
Product
Specifications
No.
8.
9.
Item
FILM
TYPE
CHIP CAPACITOR
ECWUC2J
No.
Revision Code
Performance
The capacitor under test shall be put in the testing oven
and kept at condition of the temperature at 40˚C± 2˚C and
the relative humidity at 90% to 95% for 1000hours +48/-0
h and then shall be let alone at ordinary condition for 1.5
h± 0.5 h.
After the test, the capacitor shall be satisfied with the
following performance.
Moisture
resistance
Moisture
resistant
loading(I)
1-37
B
3/16
P.
Testing method
Appearance :
No remarkable change.
JISC5101-23:2008
Withstand voltage :
4.10
IEC60384-23:2005
Between terminals
4.10
Nothing abnormal shall be found, when applied a
voltage of 130 % of the rated voltage for 1 min.
(The capacitor shall be applied the voltage
through 2 kΩ or more when charge or discharge.)
Insulation resistance :
Between terminals 100 MΩ or more(at 100V)
Change rate of capacitance :
Within +8/-5 % of the value before the test.
Dissipation factor :
1.5 % or less (at 1 kHz)
The capacitor under test shall be applied the rated
voltage continuously for 1000 h +48/-0 h in the testing
oven and kept at condition of the temperature at 40 ˚C±2
˚C and the relative humidity at 90 % to 95 % and then
shall be let alone at ordinary condition for 1.5 h±0.5 h.
After the test, the capacitor shall be satisfied with the
following performance.
Appearance :
No remarkable change.
JISC5101-23:2008
Withstand voltage :
4.10
IEC60384-23:2005
Between terminals
4.10
Nothing abnormal shall be found, when applied a
voltage of 130 % of the rated voltage for 1 min.
(The capacitor shall be applied the voltage
through 2 kΩ or more when charge or discharge.)
Insulation resistance :
Between terminals 100 MΩ or more(at 100V)
Change rate of capacitance :
Within +8/-5 % of the value before the test.
Dissipation factor :
1.5 % or less (at 1 kHz)
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
REFERENCE
28-76
Clsf.
Standard Doc.
Product
Specifications
No.
10.
11.
PLASTIC
Item
FILM
TYPE
CHIP CAPACITOR
ECWUC2J
No.
Revision Code
Performance
The capacitor under test shall be applied DC 400 V±3 V
continuously for 500 h +24/-0 h in the testing oven and
kept at condition of the temperature at 60 ˚C±2 ˚C and
the relative humidity at 90 % to 95 % and then shall be
let alone at ordinary condition for 1.5 h±0.5 h.
After the test, the capacitor shall be satisfied with the
following performance.
Moisture
resistant
loading(II)
Moisture
resistant
loading(III)
1-37
B
4/16
P.
Testing method
Appearance :
No remarkable change.
JISC5101-23:2008
Withstand voltage :
4.10
IEC60384-23:2005
Between terminals
4.10
Nothing abnormal shall be found, when applied a
voltage of 130 % of the rated voltage for 1 min.
(The capacitor shall be applied the voltage
through 2 kΩ or more when charge or discharge.)
Insulation resistance :
Between terminals 10 MΩ or more(at 100V)
Change rate of capacitance :
Within ±10 % of the value before the test.
Dissipation factor :
2.0 % or less (at 1 kHz)
The capacitor under test shall be applied DC 400 V±2 V
continuously for 500 h +24/-0 h in the testing oven and
kept at condition of the temperature at 85 ˚C±2 ˚C and
the relative humidity at 85 %+2/-5 % and then shall be let
alone at ordinary condition for 1.5 h±0.5 h.
After the test, the capacitor shall be satisfied with the
following performance.
Appearance :
No remarkable change.
JISC5101-23:2008
Withstand voltage :
4.10
IEC60384-23:2005
Between terminals
4.10
Nothing abnormal shall be found, when applied a
voltage of 130 % of the rated voltage for 1 min.
(The capacitor shall be applied the voltage
through 2 kΩ or more when charge or discharge.)
Insulation resistance :
Between terminals 10 MΩ or more(at 100V)
Change rate of capacitance :
Within ±10 % of the value before the test.
Dissipation factor :
2.0 % or less (at 1 kHz)
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
REFERENCE
28-76
Clsf.
Standard Doc.
Product
Specifications
No.
12.
13.
PLASTIC
FILM
TYPE
Item
CHIP CAPACITOR
ECWUC2J
No.
Revision Code
Performance
1-37
B
5/16
P.
Testing method
High
temperature
loading(I)
The capacitor under test shall be applied the voltage of
125 % of rated voltage through a series-connected
resister of from 20 Ω to 1000 Ω per 1 V, continuously for
1000 h +48/-0 h in the testing oven and kept at condition
of the temperature at +85 ˚C±2 ˚C and then shall be let
alone at ordinary condition for 1.5 h±0.5 h.
After the test, the capacitor shall be satisfied with the
JISC5101-23:2008
following performance.
4.11
IEC60384-23:2005
Appearance :
4.11
No remarkable change.
Insulation resistance :
Between terminals 1000 MΩ or more(at 100V)
Change rate of capacitance :
Within +1/-6 % of the value before the test.
Dissipation factor :
1.1 % or less (at 1 kHz)
High
temperature
loading(II)
The capacitor under test shall be applied the voltage of
125 % of rated voltage derated by Fig.1 through a
series-connected resister of from 20 Ω to 1000 Ω per 1 V,
continuously for 1000 h +48/-0 h in the testing oven and
kept at condition of the temperature at +125 ˚C±2 ˚C and
then shall be let alone at ordinary condition for 1.5 h±0.5
h.
After the test, the capacitor shall be satisfied with the JISC5101-23:2008
following performance.
4.11
IEC60384-23:2005
4.11
Appearance :
No remarkable change.
Insulation resistance :
Between terminals 1000 MΩ or more(at 100V)
Change rate of capacitance :
Within +1/-6 % of the value before the test.
Dissipation factor :
1.1 % or less (at 1 kHz)
Capacitance measurements shall be made at -55℃±2℃,
after 2h +1/-0 h pass.
Change rate of capacitance :
Within +1/-3 % of the value before the test.
14.
Characteristics
depending on
temperature
And, capacitance measurements shall be made at 125℃
±2℃, after 2h +1/-0 h pass.
Change rate of capacitance :
Within +3/-4 % of the value before the test.
Insulation resistance :
Between terminals 90 MΩ or more(at 100V)
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
JIS C5101-1-2004
4.24.1
IEC 60384-1-2005
4.24.1
REFERENCE
28-76
Clsf.
Standard Doc.
Product
Specifications
No.
15.
PLASTIC
Item
FILM
TYPE
CHIP CAPACITOR
ECWUC2J
No.
Revision Code
Performance
1. Reflow method
Please be punctual for the ‘Period of soldering from
opening dry pack’(See page 13/16)
Test condition of the reflow oven shall be adjusted
that maximum temperature of the capacitor surface
shall be 247 ˚C±3 ˚C. (See Fig. 2.)
After the test, the capacitor shall be let alone at
ordinary temperature and humidity for 1 h± 0.5 h.
After this, the capacitor shall be satisfied with the
following performance.
Soldering
Heat
Resistance
1-37
B
6/16
P.
Testing method
2. Soldering iron method
The soldering iron of a 30 W shall be used and the
temperature of the soldering iron shall be adjusted at
270 ˚C± 10 ˚C.
The soldering iron together with a solder wire of 1 mm
diameter shall be put to each outer electrode of the JISC5101-23:2008
capacitor for 3.5 s± 0.5 s.
4.6
After this, the capacitor shall be satisfied with the IEC60384-23:2005
4.6
following performance.
Appearance :
No remarkable change.
Withstand voltage :
Between terminals
Nothing abnormal shall be found, when applied a
voltage of 150 % of the rated voltage for 1 min.
(The capacitor shall be applied the voltage
through 2 kΩ or more when charge or discharge.)
Insulation resistance :
Between terminals 1000 MΩ or more(at 100V)
Change rate of capacitance :
Within ±5 % of the value before the test.
Dissipation factor :
1.1 % or less (at 1 kHz)
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
REFERENCE
28-76
Clsf.
Standard Doc.
Product
Specifications
No.
16.
PLASTIC
Item
FILM
TYPE
CHIP CAPACITOR
ECWUC2J
No.
Revision Code
1-37
B
7/16
P.
Performance
Testing method
The capacitor under the test shall be kept in the testing
oven and kept at condition of the temperature of -55 ˚C±
3 ˚C for 30 min± 3 min. After this, the capacitor shall be
let alone at the ordinary temperature for 3 min or less.
After this, the capacitor under the test shall be kept in
the testing oven and kept at condition of the temperature
of +125 ˚C± 3 ˚C for 30 min± 3 min.
Then the capacitor shall be let alone at the ordinary
temperature for 3 min or less.
This operation shall be counted as 1 cycle, and it shall
JISC5101-23:2008
be repeated for 5 cycles successively.
4.8
After the test, the capacitor shall be let alone at the
IEC60384-23:2005
ordinary condition for 1.5 h± 0.5 h, and shall be satisfied
4.8
with the following performance.
Temperature
cycle
17.
dV/dt
18.
Robustness of
capacitor body
Appearance :
No remarkable change.
Insulation resistance :
Between terminals 1000 MΩ or more(at 100V)
Change rate of capacitance :
Within +1/-5 % of the value before the test.
Dissipation factor :
1.1 % or less (at 1kHz)
Permissible current to pulse current.
The pulse permissible current is generally obtained by
the product of dV/dt(V/µs) value and capacitance(µF) .
I=C•dV/dt
However, number of repetitions is 10,000 cycles or less.
Make sure the rms current is within the permissible
JISC5101-23:2008
value.
4.12
(See Tab.2)
IEC60384-23:2005
4.12
Insulation resistance :
Between terminals 500 MΩ or more(at 100V)
Change rate of capacitance :
Within ±3 % of the value before the test.
Dissipation factor :
1.2 % or less (at 1 kHz)
The equipment shall permit pressurizing.
Apply a force to the center of specimen, using a
pressurizing as shown in the drawing. The pressure shall
be 5 N±0.5 N, and the holding duration, 10 s±1 s.
JISC60068-2-77
F
:2002
IEC 60068-2-77
:1999
Appearance :
No remarkable change.
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
REFERENCE
28-76
Clsf.
Standard Doc.
PLASTIC
Product
Specifications
No.
19.
20.
Item
Adhesiveness
Resistance of
Board to bending
FILM
TYPE
Revision Code
1-37
B
8/16
JISC5101-23:2008
4.4
IEC60384-23:2005
4.4
F
Appearance
No remarkable change.
The bending stroke shall be 1 mm. Pressurizing shall be
carried out at the rate of 1 mm/s. After reaching the
specified bending, keep it for 5 s±1 s.
After the test no breaking of the terminal shall be found.
JISC5101-23:2008
4.5
IEC60384-23:2005
4.5
when
Testing method
applied
1500V
Withstand
Surge voltage
750V
10µs
700µs
Percentage to the rated voltage,permissible
current and permissible voltage(% )
Fig.1 Derating of rated voltage, permissible current and permissible voltage to operating temperature
100
80
60
40
20
0
-55
-40
P.
Performance
Mount the specimen to the testing wiring printed board.
Examine, with a magnifier of magnification of 10, the
appearance of specimen.
As shown in below, apply the pressurizing jig to the
center in the longitudinal direction of specimen.
Apply a force to the pressurizing jig gradually in the
horizontal direction with the testing printed wiring board.
The pressure shall be 5 N±0.5 N, and the holding
duration, 10 s±1 s.
After the test, use magnifier of magnification of 10, and
check for cracks of soldering position.
Between terminals:
Nothing abnormal shall be found,
1500Vo-p (10µs/700µs) for 5 times.
21.
No.
CHIP CAPACITOR
ECWUC2J
-20
0
20
40
60
85
105
125
Temperature of element surface(˚C)
Fig.2 Standard surface temperature curve of the capacitor for reflow method
Please be punctual for the ‘Period of soldering from opening dry pack’ (see page 13/16) strictly.
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
REFERENCE
28-76
Clsf.
Standard Doc.
PLASTIC
Product
Specifications
FILM
TYPE
CHIP CAPACITOR
ECWUC2J
No.
Revision Code
1-37
B
9/16
TEST CONDITION
50×115, 0.8 mm thickness
glass-epoxy board
Thermocouple K
Thermo electromotive force
wire diameter 0.1 mm Φ
dummy
(Attach thermocouple on the parts top surface.)
Temperature(℃) of parts surface
Tp：250℃ Max
250
Tp-5℃：30s Max
Temperature(℃)
200
150
Preheat
150∼200℃：
60∼120s
100
217℃ or more：
60∼150s
50
Max. 8min
0
0
60
Film Capacitor Division
120
Time (s)
180
Capacitor Business Division Panasonic Corporation
240
P.
REFERENCE
28-76
Clsf.
Standard Doc.
PLASTIC
Product
Specifications
11.
!
FILM
TYPE
CHIP CAPACITOR
ECWUC2J
No.
Revision Code
1-37
B
10/16
P.
Caution about safety in use
I. Operating range (voltage, current, operating temperature)
Use the capacitor within the specified limits listed below ((1) to (4)). Over rated conditions might cause
deterioration, damage, smoke and fire. Do not use capacitor beyond range of the condition.
(1) Permissible voltage
• Rated voltage of this product is DC 630 V. Use the capacitor within rated voltage.
• When used in AC applied circuit, less than 250 V(rms) should be applied. When used in a high
frequency, less than 250V(rms) should be applied and current applied should be less than the
value of permissible current in Fig.3 in page 16. Not to be in connected directly to Primary or AC
line.
• When used beyond 85˚C at temperature of capacitor surface, be in accordance with Fig.1.
• Use the peak of pulse voltage applied the capacitor within the DC rated voltage.
(2) Permissible current
• The permissible current must be considered by dividing into pulse current (peak current) and
continuous current (rms current). When using, therefore, make sure the both current are within the
permissible values.
In the case that a continuous current value is able not to be measured, use the capacitor within 7.5
˚C as the inherent temperature rise confirmed by the measuring method show in page 15.
• When used beyond 85 ˚C at temperature of capacitor surface, be in accordance with Fig.1.
• Continuous current should be within specified figure in Fig.3. Contact us when the waveforms are
totally different from the sine wave.
• Pulse current should be within the figures calculated by Tab. 2. Use within 10000 cycles of pulse
current. When pulse current applied more than 10000 cycles, please consult us before use.
(3) Operating temperature range
• It must be noted, however the operating temperature range is the surface temperature of the
capacitor, not the ambient temperature of the capacitor.
• In actual use, make sure the sum of the ambient temperature + own temperature rise value (Within
specified value), that is the capacitor surface temperature is within the rated operating temperature
range.
• If there is cooling plate of the other part of any resistance heated to high temperature near the
capacitor, the capacitor may be locally heated by the radiation heat, exceeding the operating
temperature range, and smoking or firing may be caused. Check the capacitor surface temperature
at the heat source side.
(4) Protective means for safety should be provided in case the pulse and rms current may exceed the
permissible values due to abnormal action of elsewhere in the circuit.
Please consult in advance when capacitors are connected in parallel to supplement capacitance.
II. Recommendable land size
For designing land size, refer to the following recommendable land size.
unit: mm
Dimensions
Size code
Y
A
B
C
4.5
9.0
5.7
C
A
B
<Note>
• A recommended solder paste thickness is between 0.10 mm and 0.15 mm.
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
REFERENCE
28-76
Clsf.
Standard Doc.
Product
Specifications
PLASTIC
FILM
TYPE
CHIP CAPACITOR
ECWUC2J
No.
Revision Code
1-37
B
11/16
P.
III. Design of P. W. B.
Do not use ceramic and metal board, because they have a large thermal expansion coefficient which
is different from that of this capacitor, which are liable to cause a deterioration of thermal cycle
endurance.
IV. Soldering
(1) Soldering method : This capacitor shall be used in reflow method only.
(2) Reflow soldering conditions
<Note>
• Please obey the within Fig.2 in page 9. Consult us before using when further condition shall be
required except Fig.2 in page 9.
• Maximum soldering frequency shall be two times. Please solder the second soldering after the
temperature of the capacitor body will return to the room temperature.
• VPS’s heat effect to the capacitor is different in the reflow method, consult with our engineering
section in advance when the capacitor is mounted in VPS.
(3)Soldering conditions used in soldering iron
Soldering
Temperature
time
280 ˚C maximum
4.0 s maximum
Other conditions
Power of soldering iron:30 W
Pre-heating is not needed
• In the case of sketch (1)
Put a soldering iron to an electrode (for less than 4 s) with solder like sketch (1) shows.
*Put soldering iron lightly.
*Soldering is allowed as one side by one side (without interval) or as both sides at the same time.
• In the case of sketch (2)
After a solder is melted on a soldering iron like sketch (2), put them to an electrode. (for less than 4
s)
*Put soldering iron lightly.
*Soldering is allowed as one side by one side (without interval) or as both sides at the same time.
Sketch (1)
Sketch (2)
land
land
melting solder
solder
soldering iron
soldering iron
<Note>
• Soldering frequency shall be maximum two times. Solder after capacitor body temperature
returned for normal temperature soldering of a second time.
• The above condition shall be applied also on re-working after reflow soldering. Readjust with once
after reflow soldering.
• When measuring temperature, it shall be operated with solder on soldering iron.
• Please pay attention to the soldering iron not to touch a capacitor body(except electrode),
especially not to touch cut edge side.
• Consult with our engineering section in advance when require further conditions except for the
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
REFERENCE
28-76
Clsf.
Standard Doc.
PLASTIC
Product
Specifications
FILM
TYPE
CHIP CAPACITOR
ECWUC2J
No.
Revision Code
1-37
B
12/16
P.
above.
(4)Others
• Solder a heat record of the case which soldering in others method with above-mentioned within (2)
and (3) .
• It is too much heat record that solders or solders removal this product or the other part which
approaches this product using hot air – blow. Consult us before use.
• Do not to use soldering this product by Light beam and laser beam. If used these method, consult
us before use.
• Consult us before use, when soldering in other method.
V. Warning about solder paste
• Solder paste shall be used which contains halogen with less than 0.1 wt%.(In case of reflow
soldering and using soldering iron.)
• Consult with our engineering section in advance when using flux with more than 0.1 wt% of the
halogen content.
VI. Cleaning
(1)Case of washfree
Please use a recommended flux ,like low residue flux ULF-500VS or inactivated flux AM-173.
(2)Applicable solvent
Type
Alcohol
Halogenated hydrocarbon
Cleaner
IPA(isopropyl alcohol)
AK-225AES
Manufacturer
General industrial use
Asahi Glass co.,Ltd.
Temperature
Period
Room temperature
less than 50 ˚C
less than 50 ˚C
Within 5 min
Within 5 min
Within 5 min
(3)Cleaning method
Conditions
Item
Immersion
Vaporized cleaning
Ultrasonic cleaning
<Note>
• When washing right after soldering, make sure the capacitor surface temperature is lower than 60
˚C.
• It is necessary to remove cleaner from P.W.B. by drying thoroughly after cleaning.
• Cleaner shall contain halogen with less than 0.1 wt%, because in case of cleaning after mounting,
halogen in flux will dissolve into cleaner.
• Consult with our engineering section in advance when further information for cleaning solvent,
conditions are required.
VII. Storage and preservation
• It must be noted that the solderability of the external electrode may deteriorated when stored in an
atmosphere filled with moisture, dust, or a reactive oxidizing gas (hydrogen chloride, hydrogen
sulfide, sulfuric acid) .
• Avoid location with particularly high temperature and high humidity, and store in conditions not
exceeding at temperature 35 ˚C and relative humidity 85 %.Storage period limit is 12 months (use
within 12 months).
• The unpacked products shall be kept in dry pack together of well-dried silica-gel (3 g, 4 packs) or
be kept in storage conditioned at a temperature less than 20 ˚C, a relative humidity less than 50 %.
Storage period limit is 12 months (use within 12 months).
• Consult with our engineering section in advance when require further conditions for the above..
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
REFERENCE
28-76
Clsf.
Standard Doc.
PLASTIC
Product
Specifications
FILM
TYPE
CHIP CAPACITOR
ECWUC2J
No.
Revision Code
1-37
B
13/16
P.
VIII. Period of soldering from opening dry pack.
• These capacitors are sensitive to the moisture. After opening dry pack, the products should be kept
in conditions a temperature less than 30 ˚C, a relative humidity less than 60 % and it should be
soldered within 168 h.
• In case of over 168 h, should be kept in dry pack together of well-dried silica-gel (3 g, 4 packs) or
be kept in storage conditioned at a temperature less than 20 ˚C, a relative humidity less than 50 %.
• If exceed 168h, please dry under the following condition, and soldering in the condition and time of
Tab.1.
<Baking Condition>
Temperature and time : 70 ˚C± 5 ˚C, 130 h ± 10 h
Method
: Removed the taping capacitor from the reel.
Note
: Please bake only taping capacitor because a reel might be transformed
by the heat. Please wind again in the reel after baking.
Please note the career-tape doesn't suffer mechanical damage when
removing from the reel, and winding.
Tab.1 Storage condition after baking and period of soldering
Storage condition
Period of soldering
Temperature
Humidity
1)
2)
3)
4)
30 ˚C or less
60 % or less
35 ˚C or less
85 % or less
Water vapor pressure 1.17 kPa or
less
Packed products in Aluminum dry
pack together 12 g or more of
well-dried silica-gel.
Within 22 hour
Within 16 hour
Within 6 month
(And within 1 year after
delivery)
Note
−
−
Period of soldering follows 1)
or 2) in this table.
IX. Operating environment
• Consult us when used for a long period in humid environments, because characteristic
deterioration as low insulation resistance and oxidized evaporated internal electrode may occur
due to humidity absorbed with the passing of the time.
• Avoid to use in a place of corrosive and oxidizing gas atmosphere (hydrogen chloride, hydrogen
sulfide, sulfuric acid etc.)
• Avoid use under the environment where water is generated to deteriorated the characteristic of the
capacitor when the adhesion of water (drop of water etc.) is generated in the capacitor.
• No dust should be permitted to remain on the surface of the product as this may cause electrical
leakage.
Rate of Capacitance
Change (%)
X. Capacitance change due to humidity absorption
In environment with humidity change, capacitance of this capacitor changes (increases and
decreases).
Because capacitor absorbing and dis-absorbing due to humidity of environment.
Consult with our engineering section detail of this capacitance change.
[ For example : The data shown below is capacitance change from dry condition to 40
˚C,95%(relative humidity) condition.]
about 8 %
40 ˚C,
relative humidity 95 %
Dry condition
Time ->
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
REFERENCE
28-76
Clsf.
Standard Doc.
Product
Specifications
PLASTIC
FILM
TYPE
CHIP CAPACITOR
ECWUC2J
No.
Revision Code
1-37
B
14/16
P.
XI. In case of using resin for fixing the chip parts
In case of using resin for fixing the chip parts, inquiring in advance of our engineering section is
recommended.
XII. Resin coating
When capacitors are coated or embedded with resin, inquiring of our engineering section is
recommended.
XIII. Handling of a element
When handle an element of the capacitor with tweezers, use tweezers made of resign and applied
stress should be less than 5 N.
XIV. Stress, damage
Please pay attention to the following points, when stress or damage is applied to the capacitor it may
become the cause of malfunction.
•Do not apply more than 5N as pull, stress and pressure etc.
•Do not apply strong stress to cut edge side of the capacitor and not give the damage of scratch
etc.
•Chip mounting consideration
In mounting the capacitors any bending and expanding force against them shall be kept minimum
to prevent them from bending damaged or cracked, following precautions and recommendations
shall be observed carefully in the process.
(1)Motion of vacuum nozzle or clamp shall be adjusted so that the capacitors shall not be
damaged by pushing force.
(2)Maximum stroke of the nozzle shall be adjusted to avoid damage so that the maximum
bending of PCB becomes not too much.
(3)The PCB shall be supported by means of adequate supporting pins.
XV. Appearance
•The gap among a film about 0.1 mm on the cut edge side may occur by structure and process. But
there is not a problem in reliability.
•We make assurance double sure about quality of the appearance. If it obstructs the reliability and
performance of the electronic equipment requested, we exchange the appearance boundary
sample.
gap
(maximum of gap is about 0.1 mm)
XVI. Singular using
This capacitor is generally surface mount device. Do not use singular using.
12. Life designed
This product is designed as its life time is more than 10 year (actual working hours of capacitor are
50,000 h) under the conditions that operating temperature is less than 85 ˚C and applied voltage is less
than rated voltage.
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
REFERENCE
28-76
Clsf.
Standard Doc.
Product
Specifications
PLASTIC
FILM
TYPE
CHIP CAPACITOR
ECWUC2J
No.
Revision Code
1-37
B
15/16
P.
Tab.2 Permissible pulse current (Max.10000 cycles)
•Pulse current applied to this capacitor should be used within permissible pulse current (Max.10000 cycles)
shown in table.
•The pulse current = C(µF) × dV/dt value(V/µs)
•Permissible pulse current may be lowered due to temperature change (heat shock) after mounting.
Permissible pulse current shown in table is supposed in case of use at a temperature from –20 ˚C to 60
˚C. In case of pulse current is over the specified table, inquire of our engineering section.
Item
Capacitance
(µF)
ECWUC2J223JV
0.022
ECWUC2J273JV
0.027
ECWUC2J333JV
0.033
dV/dt
(V/µs)
Pulse current
(Ao-p)
5.5
250
6.7
8.2
Measuring method of inherent temperature rise
As shown in the drawing, attach a thermocouple to the capacitor surface with adhesive, and measure
the surface temperature and capacitor surface temperature while avoiding radiation heat from
peripheral parts. At this time, use a thermocouple with small thermal capacity (Φ 0.1 T wire), and to
avoid heat release to the board, lift the parts to be measure from the board by using lead wire or the
like, and install as shown in the drawing. To avoid effects of convention and wind, put the capacitor
into the box or the like, and measure in wind-free condition.
Thermocouple
Land
Temperature measurement
instrument
Lead wire
（Solder Plated Copper wire (0.8Φ))
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
REFERENCE
28-76
Clsf.
Standard Doc.
PLASTIC
Product
Specifications
CHIP CAPACITOR
ECWUC2J
No.
Revision Code
1-37
B
16/16
Permissible Current
Measuring condition ••• Sine wave
1.6
1.4
1.2
333
1.0
273
許容電流 [Arms]
PERMISSIBLE CURRENT
PERMISSIBLE CURRENT (Arms)
Fig.3
FILM
TYPE
223
0.8
0.6
0.4
0.2
0.0
1
Film Capacitor Division
10
周波数 [kHz]
FREQUENCY
FREQUENCY (kHz)
100
Capacitor Business Division Panasonic Corporation
1000
P.
REFERENCE