REFERENCE REFERENCE 28-762 of 14 page Clsf. Standard Doc. PLASTIC Product Specifications No. Items 2 Insulation Resistance (IR) 3 Capacitance 4 5 6 FILM TYPE CHIP CAPACITOR ECWU(X) Specifications Revision Code 1-23 F 2/14 P . Test method (Refer to IEC 60384-20 [JIS C 5101-20]) 3000 MΩ or more (According to 4. 3. 4) Apply a voltage of as below at 20°C±2°C. DC100V±1.5V : 1min±5s Within a range of specified value. (According to 4. 3. 2) Measured at a frequency of 1 kHz ±0.2 kHz, at 20°C ±2°C and with voltage of 5 Vrms or less. Tangent of loss angle (tan δ) 0.6 % or less (According to 4. 3. 3) Measured at a frequency of 1 kHz ±0.2 kHz, at 20°C ±2°C and with voltage of 5 Vrms or less. Connection The connection of the element shall not open even instantaneously Apply a voltage of 100 mV p-p or less through specified resistance while a weak impact. Measured at a frequency of 10kHz to 1MHz. Appearance: No remarkable change Connection: Stable (No short circuit or open) (According to IEC 60000 [JIS C 5101-1] 4. 17) Sweep : 10Hz to 55Hz to 10Hz (1 min) Total amplitude : 1.5 mm max Vibration above-mentioned shall be applied to the capacitor mounted on the PCB (Printed Circuit Board) for a period of 2 h in each of 3 mutually perpendicular directions (total of 6 h). Vibration Resistance Test solder covers more than 90 % of immersed electrode surface. 7 No. Solderability (According to 4. 7) Rosin concentration: 25 wt% Composition of test solder: Sn-3.5Ag-0.5Cu Temperature: 245°C±3°C Immersion time : 2.5s±0.5s 0.2 mm Electrode surface is mentioned shaded area. A large-sized element examines by the cut part with electrode. Electrode development Film Capacitor Division Capacitor Business Division Panasonic Corporation 0.2 mm REFERENCE 28-763 of 14 page Clsf. Standard Doc. Product Specifications No. 8 PLASTIC Items Soldering Heat Resistance Appearance No remarkable change Voltage proof See 9-1 Change rate of Within ±3% of the value before capacitance the test. (∆C/C) tan δ Damp heat (I ) Damp heat (II) 1000 MΩ or more 0.66% or less at 1kHz Connection Stable Appearance No remarkable change applied Voltage proof No change, when applied 130% of rated voltage for 1 min. ∆C/C Within +8%/ -5% IR 100 MΩ or more tan δ 10 CHIP CAPACITOR ECWU(X) Specifications IR 9 FILM TYPE 1.5 or less at 1kHz Appearance No remarkable change applied Voltage proof No change, when applied 130% of rated %voltage for 1 min. ∆C/C IR tan δ Within ±10% 10 MΩ or more 2.0% or less at 1kHz Film Capacitor Division No. Revision Code 1-23 F 3/14 P . Test method (Refer to IEC 60384-20 [JIS C 5101-20]) (According to 4. 6) (1) Reflow method Peak temperature: 240°C Soldering : 220°C or more, 60s Pre-heating : 150°C to 180°C, 120s The heat history of reflow adjusted to the above-mentioned conditions is added. (2) Soldering iron method Wattage of soldering iron : 30 W Bit temperature : 250°C ±10°C Soldering time : 3.5s ±0.5s The soldering iron adjusted to the abovementioned conditions is contacted to electrode of a capacitor with a solder wire of 1mm diameter. Furthermore, it performs to another electrode. (According to 4. 10) Testing oven condition: Temperature : 40°C±2°C Humidity : 90 %RH to 95 %RH Load time : 1000 h +48/ -0 h Halogen concentration of flux : less than 0.1 wt%. After load, the capacitor kept at ordinary condition (ordinary temperature and humidity) for 1 h to 2 h. (According to 4. 10) Testing oven condition: Temperature : 60°C ±2°C Humidity : 90 %RH to 95 %RH Load time : 500 h +24/ -0 h Halogen concentration of flux : less than 0.1 wt%. After load, the capacitor kept at ordinary condition (ordinary temperature and humidity) for 1 h to2 h. Capacitor Business Division Panasonic Corporation REFERENCE 28-764 of 14 page Clsf. Standard Doc. Product Specifications No. PLASTIC Items FILM TYPE CHIP CAPACITOR ECWU(X) Specifications Appearance No remarkable change applied Voltage proof 11 Damp heat with Load (I ) No change, when applied 130% of rated voltage for 1 min. ∆C/C Within +8%/ -5% IR 100 MΩ or more tan δ 1.5% or less at 1kHz Appearance No remarkable change applied Voltage proof 12 Damp heat with Load (II) ∆C/C IR tan δ No change, when applied 130% of rated voltage for 1 min. Within ±10% 10 MΩ or more 2.0% or less at 1kHz Appearance No remarkable change applied Voltage proof 13 Damp heat with Load (III) ∆C/C IR tan δ No change, when applied rated voltage for 1 min. Within ±10% 10 MΩ or more 2.0% or less at 1kHz Appearance No remarkable change applied 14 Electrical endurance ∆C/C Within +1%/ -6% IR 1000 MΩ or more tan δ 1.1% or less at 1kHz Film Capacitor Division No. Revision Code 1-23 F 4/14 P . Test method (Refer to IEC 60384-20 [JIS C 5101-20]) (According to 4. 10) Testing oven condition: Temperature : 40°C ±2°C Humidity : 90 % RH to 95 % RH Applying voltage : rated voltage Load time : 1000 h +48/ -0 h Halogen concentration of flux : less than 0.1 wt %. After load, the capacitor kept at ordinary condition (ordinary temperature and humidity) for 1 h to 2 h. (According to 4. 10) Testing oven condition: Temperature : 60°C ±2°C Humidity : 90 % RH to 95 % RH Applying voltage : rated voltage Load time : 500 h +24/ -0 h Halogen concentration of flux : less than 0.1 wt %. After load, the capacitor kept at ordinary condition (ordinary temperature and humidity) for 1 h to 2 h. (According to 4. 10) Testing oven condition: Temperature : 85°C ±2°C Humidity : 85% RH +2% RH / -5% RH Applying voltage : rated voltage Load time : 500 h +24/ -0 h Halogen concentration of flux : less than 0.1 wt %. After load, the capacitor kept at ordinary condition (ordinary temperature and humidity) for 1 h to 2 h. (According to 4. 11) Testing oven condition: Temperature : 105°C ±2°C Applying voltage : 125 % of rated voltage (Apply through a series-connected resister of 20 Ω to 1000 Ω per 1 V) Load time : 1000 h +48/ -0 h After load, the capacitor kept at ordinary condition (ordinary temperature and humidity) for 1 h to 2 h. Capacitor Business Division Panasonic Corporation REFERENCE 28-765 of 14 page Clsf. Standard Doc. Product Specifications No. 15 16 PLASTIC Items Heat Resistance Cold Resistance FILM TYPE Specifications ∆C/C Within +3%/ -4% IR 900MΩ or more ∆C/C Within +1%/ -3% Appearance No remarkable change applied 17 ∆C/C Within +1%/-5% IR 1000MΩ or more Change of Temperature tan δ 1.1% or less at 1kHz Appearance No remarkable change applied Adhesion of electrode Connection Stable No. CHIP CAPACITOR ECWU(X) Revision Code P . Test method (Refer to IEC 60384-20 [JIS C 5101-20]) (According to 4. 9. 2) Testing oven condition: Temperature : 105°C ±2°C Time : 2 h +1/ -0 h Measure in the testing oven. (According to 4. 9. 4) Testing oven condition: Temperature : –55°C ±3°C Time : 2 h +1/ -0 h Measure in the testing oven. (According to 4. 8) Temperature cycle below-mentioned of 5 cycles shall be applied successively to the capacitor mounted on the 1.6 t glass-epoxy (FR-4) PCB in the testing oven. After the cycle, the capacitor shall be kept at the ordinary condition for 1 h to 2 h. Soldering conditions and land dimensions are recommended one. step 1 2 3 4 temp. RT 105°C±3°C RT -55°C ±3°C time 2min to 3min 30min ±3min 2min to 3min 30min ±3min (According to 4. 4) As shown in the following figure, the force of 5N is applied for 10s without a shock to the capacitor mounted on PCB. Land dimensions and soldering conditions are recommended one, especially thickness of solder paste is 0.15 mm. 18 F Hole F Film Capacitor Division 1-23 F 5/14 Capacitor Business Division Panasonic Corporation REFERENCE 28-766 of 14 page Clsf. Standard Doc. Product Specifications No. PLASTIC Items FILM TYPE CHIP CAPACITOR ECWU(X) Specifications Appearance No remarkable change applied Connection 19 Stable Core body strength No. Revision Code 1-23 F 6/14 P . Test method (Refer to IEC 60384-20 [JIS C 5101-20]) The equipment shall permit pressurizing. Apply a force to the center of specimen, using a pressurizing tool as blow mentioned. The pressure shall be 5N ±0.5N, and the holding duration, 10s±1s. F R=0.5 1/2L L 20 Resistance of Board to bending Appearance No remarkable change applied Connection Stable F (According to 4. 5) As shown in the following figure, it pressurizes to the capacitor mounted on PCB until it is bent by speed of 0.5mm/s and becomes the quantity of 3 mm, and it holds for 30s. Land dimensions and soldering conditions are recommended one. PC board Capacitor Fulcrum 45±2 Film Capacitor Division 45±2 Test stand Capacitor Business Division Panasonic Corporation REFERENCE 28-767 of 14 page Clsf. Standard Doc. Product Specifications Fig.1 PLASTIC FILM TYPE No. CHIP CAPACITOR ECWU(X) Revision Code 1-23 F 7/14 Standard surface temperature curve of the capacitor for reflow method Please confirm the test of the reflow method within the range of the under mentioned profile. TEST CONDITION 50×115, 0.8 mm thickness glass-epoxy board Thermocouple K Thermo electromotive force wire diameter 0.1 mmΦ dummy (Attach thermocouple on the parts top surface.) Temperature (°C) of parts surface 300 max 240°C 250 220°C or more, max 60s ――― Temperature (°C) ――― 200 150 100 50 40 s ~ 90 s 60 s ~ 150 s 20 s ~ 50 s max 40s 0 Time → Film Capacitor Division Capacitor Business Division Panasonic Corporation P . REFERENCE 28-768 of 14 page Clsf. Standard Doc. Product Specifications PLASTIC FILM TYPE CHIP CAPACITOR ECWU(X) No. Revision Code 1-23 F 8/14 P . 10. ! Caution about safety in use I . Operating range (voltage, current, operating temperature) Use the capacitor within the specified limits listed below (a to b). Over rated conditions might cause deterioration, damage, smoke and fire. Do not use capacitor beyond range of the condition. a) Permissible voltage • DC rated voltage of this product is 100V. Use the capacitor within DC rated voltage. • When used in AC applied circuit, less than 40Vrms should be applied. When used in a high frequency, less than 40Vrms should be applied and current applied should be less than the value of permissible current in Fig.2 in page 14. • Not to be in connected directly to Primary or AC line. • Use the peak of pulse voltage applied the capacitor within the DC rated voltage. b) Permissible current • The permissible current must be considered by dividing into pulse current (peak current) and continuous current (rms current). When using, therefore, make sure the both current are within the permissible values. In the case that a continuous current value is able not to be measured, use the capacitor within 7.5°C as the inherent temperature rise confirmed by the measuring method show in page 13. • Continuous current should be within specified figure in Fig.2. Contact us when the waveforms are totally different from the sine wave. • Pulse current should be within the figures calculated by Tab. 1. Use within 10000 cycles of pulse current. When pulse current applied more than 10000 cycles, please consult us before use. c) Operating temperature range • It must be noted, however the operating temperature range is the surface temperature of the capacitor, not the ambient temperature of the capacitor. • In actual use, make sure the sum of the ambient temperature + own temperature rise value (Within specified value), that is the capacitor surface temperature is within the rated operating temperature range. • If there is cooling plate of the other part of any resistance heated to high temperature near the capacitor, the capacitor may be locally heated by the radiation heat, exceeding the operating temperature range, and smoking or firing may be caused. Check the capacitor surface temperature at the heat source side. d) Protective means for safety should be provided in case the pulse and rms current may exceed the permissible values due to abnormal action of elsewhere in the circuit. Please consult in advance when capacitors are connected in parallel to supplement capacitance. Film Capacitor Division Capacitor Business Division Panasonic Corporation REFERENCE 28-769 of 14 page Clsf. Standard Doc. Product Specifications PLASTIC FILM TYPE CHIP CAPACITOR ECWU(X) No. Revision Code 1-23 F 9/14 P . II.Recommendable land dimensions For designing land size, refer to the following recommendable land size. unit: mm Size code Dimensions A B C H1, H2, H3 1.8 3.6 1.4 G1, G2, G3 1.8 3.6 2.3 <Note> • A recommended solder paste thickness is 0.10mm to 0.15mm. C A B III.Design of P. C. B. Do not use ceramic and metal board, because they have a large thermal expansion coefficient which is different from that of this capacitor, which are liable to cause a deterioration of thermal cycle endurance. IV.Soldering a) Soldering method This capacitor shall be used in reflow method only. b) Recommendable reflow soldering conditions Temperature of parts surface(°C) Recommendable reflow condition (parts surface) Soldering (235°C, 5s) 250 220°C or more, 20s to 30s 200 150 Pre-heating (150°C to 180°C) 100 60s to 120s 50 Time <Note> • The above figure is recommendable conditions. • Soldering frequency shall be maximum two times. Solder after capacitor body temperature returned for normal temperature soldering of a second time. • When further conditions except for the above, please obey the following conditions. Consult us before use when require further condition expect for the following. (Reflow) 240°C max. and 60 seconds max. at more than 220°C (temp. at cap. surface). • VPS’s heat effect to the capacitor is different in the reflow method, consult with our engineering section in advance when the capacitor is mounted in VPS. Film Capacitor Division Capacitor Business Division Panasonic Corporation REFERENCE 28-76 page 10 of 14 Clsf. Standard Doc. PLASTIC Product Specifications FILM TYPE CHIP CAPACITOR ECWU(X) No. Revision Code 1-23 F 10/14 c) Soldering conditions used in soldering iron Temperature Soldering time Other conditions 260°C maximum 4.0 seconds maximum Power of soldering iron:30W Pre-heating is not needed • In the case of sketch (a) Put a soldering iron to an electrode (for less than 4 sec) with solder like sketch (a) shows. *Put soldering iron lightly. *Soldering is allowed as one side by one side (without interval) or as both sides at the same time. • In the case of sketch (b) After a solder is melted on a soldering iron like sketch (b), put them to an electrode. (for less than 4sec) *Put soldering iron lightly. *Soldering is allowed as one side by one side (without interval) or as both sides at the same time. Sketch (b) Sketch (a) land land solder soldering iron melting solder soldering iron <Note> • Soldering frequency shall be maximum two times. Solder after capacitor body temperature returned for normal temperature soldering of a second time. • The above condition shall be applied also on re-working after flow or reflow soldering. Re-working with once. Because, there is heat career once when solder mounting. • When measuring temperature, it shall be operated with solder on soldering iron. • Please pay attention to the soldering iron not to touch a capacitor body (except electrode), especially not to touch cut edge side. • Consult with our engineering section in advance when require further conditions except for the above. d) Others • Solder a heat record of the case which soldering in others method with above-mentioned within b) and c). • About heat record of the case which soldering removal of the case which this product solders using hot air – blow the other part which approaches this product and a b) recommendable reflow conditions and note defend. • Light beam and laser beam which using solders this product case c) soldering conditions used in soldering iron and note defend. Film Capacitor Division Capacitor Business Division Panasonic Corporation P . REFERENCE 28-76 page 11 of 14 Clsf. Standard Doc. Product Specifications PLASTIC FILM TYPE CHIP CAPACITOR ECWU(X) No. Revision Code 1-23 F 11/14 P . V. Soldering flux • Solder paste shall be used flux which contains halogen within 0.1wt %. (In case of flow soldering, reflow soldering and using soldering iron.) • Consult with our engineering section in advance when using flux with more than 0.1wt % of the halogen content. VI. Cleaning a) Case of washfree Please use a recommended flux, like low residue flux ULF-500VS or inactivated flux AM-173. b) Applicable solvent Type Alcohol Halogenated hydrocarbon Cleaner IPA(isopropyl alcohol) AK-225AES Manufacturer General industrial use Asahi Glass co.,Ltd. Temperature Period Room temperature less than 50°C less than 50°C Within 5minutes Within 5minutes Within 5minutes c) Cleaning method Conditions Item Immersion Vaporized cleaning Ultrasonic cleaning <Note> • Do not wash it with water. • It is necessary to remove cleaner from P.C.B. by drying thoroughly after cleaning. • Cleaner shall contain halogen with less than 0.1wt%, because in case of cleaning after mounting, halogen in flux will dissolve into cleaner. • Consult with our engineering section in advance when further information for cleaning solvent, conditions are required. VII. Storage and preservation • It must be noted that the solderability of the external electrode may deteriorated when stored in an atmosphere filled with moisture, dust, or a reactive oxidizing gas (hydrogen chloride, hydrogen sulfide, sulfuric acid) . • Avoid location with particularly high temperature and high humidity, and store in conditions not exceeding 35°C and 85%RH. Storage period limit is 6 months (use within 6 months). • Consult with our engineering section in advance when require further conditions except for the above. VIII. Operating environment • Avoid to use in a place of corrosive and oxidizing gas atmosphere (hydrogen chloride, hydrogen sulfide, sulfuric acid etc.) • Avoid use under the environment where water is generated to deteriorated the characteristic of the capacitor when the adhesion of water (drop of water etc.) is generated in the capacitor. Film Capacitor Division Capacitor Business Division Panasonic Corporation REFERENCE 28-76 page 12 of 14 Clsf. Standard Doc. Product Specifications PLASTIC FILM TYPE CHIP CAPACITOR ECWU(X) No. Revision Code 1-23 F 12/14 P . Capacitance change (%) IX. Capacitance change due to humidity absorption In environment with humidity change, capacitance of this capacitor changes (increases and decreases). Because capacitor absorbing and dis-absorbing due to humidity of environment. Consult with our engineering section detail of this capacitance change. [ For example : The data shown below is capacitance change from dry condition to 40°C, 95%RH condition.] 40°C • 95%RH About 8 % Dry condition Time → X. In case of using resin for fixing the chip parts In case of using resin for fixing the chip parts, inquiring in advance of our engineering section is recommended. XI . Resin coating When capacitors are coated or embedded with resin, inquiring of our engineering section is recommended. XII. Handling of a element When handle an element of the capacitor with tweezers, use tweezers made of resign and applied stress should be less than 5N. XIII. Stress, damage Please pay attention to the following points, when stress or damage is applied to the capacitor it may become the cause of malfunction. • Do not apply more than 5N as pull, stress and pressure etc. • Do not apply strong stress to cut edge side of the capacitor and not give the damage of scratch etc. XIV. Singular using This capacitor is generally surface mount device. Do not use singular using. Film Capacitor Division Capacitor Business Division Panasonic Corporation REFERENCE 28-76 page 13 of 14 Clsf. Standard Doc. PLASTIC Product Specifications FILM TYPE CHIP CAPACITOR ECWU(X) No. Revision Code 1-23 F 13/14 Tab.1 Permissible pulse current (Max.10000cycles) Pulse current applied to this capacitor should be used within permissible pulse current (Max.10000cycles) shown in the following table. In case of pulse current is over the specified table, inquire of our engineering section. dV/dt (V/µs) ECWU1(X) Part No. (Rated Capacitance: µF) 102 122 152 182 222 272 332 392 472 562 682 822 103 (0.0010) (0.0012) (0.0015) (0.0018) (0.0022) (0.0027) (0.0033) (0.0039) (0.0047) (0.0056) (0.0068) (0.0082) (0.010) 1000 920 830 760 690 630 570 530 480 450 410 370 340 Measuring method of inherent temperature rise As shown in the drawing, attach a thermocouple to the capacitor surface with adhesive, and measure the surface temperature and capacitor surface temperature while avoiding radiation heat from peripheral parts. At this time, use a thermocouple with small thermal capacity (Φ0.1 T wire), and to avoid heat release to the board, lift the parts to be measure from the board by using lead wire or the like, and install as shown in the drawing. To avoid effects of convention and wind, put the capacitor into the box or the like, and measure in wind-free condition. Thermocouple Land Lead wire Temperature measurement instrument Film Capacitor Division Capacitor Business Division Panasonic Corporation P . REFERENCE 28-76 page 14 of 14 Clsf. Standard Doc. Product Specifications PLASTIC FILM TYPE CHIP CAPACITOR ECWU(X) No. Revision Code 1-23 F 14/14 Fig.2 Permissible Current Measuring condition : Sine wave ECWU1(X) 0.5 0.4 Permissible Current (Arms) 0.010 µF 0.3 0.0082 µF 0.0068 µF 0.0056 µF 0.0047 µF 0.2 0.0039 µF 0.0033 µF 0.0027 µF 0.0022 µF 0.0018 µF 0.0015 µF 0.1 0.0012 µF 0.0010 µF 0 10 100 Frequency (kHz) Film Capacitor Division Capacitor Business Division Panasonic Corporation 1000 P . REFERENCE