±60V Fault Protected, 5V, RS-485/RS-422 Transceivers with ±25V CMR and ESD Protection ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E The ISL32490E, ISL32492E, ISL32493E, ISL32495E, Features ISL32496E, ISL32498E are fault protected, 5V powered, differential transceivers that exceed the RS-485 and RS-422 standards for balanced communication. The RS-485 transceiver pins (driver outputs and receiver inputs) are fault protected up to ±60V and are protected against ±16.5kV ESD strikes without latch-up. Additionally, the extended common mode range allows these transceivers to operate in environments with common mode voltages up to ±25V (>2x the RS-485 requirement), making this fault protected RS-485 family one of the most robust on the market. Transmitters (Tx) deliver an exceptional 2.5V (typical) differential output voltage into the RS-485 specified 54Ω load. This yields better noise immunity than standard RS-485 ICs or allows up to six 120Ω terminations in star network topologies. • Fault Protected RS-485 Bus Pins . . . . . . . . . . . . . . Up to ±60V • Extended Common Mode Range . . . . . . . . . . . . . . . . . . . ±25V More than Twice the Range Required for RS-485 • ±16.5kV HBM ESD Protection on RS-485 Bus Pins • 1/4 Unit Load for Up to 128 Devices on the Bus • High Transient Overvoltage Tolerance . . . . . . . . . . . . . . . ±80V • Full Fail-Safe (Open, Short, Terminated) RS-485 Receivers • High Rx IOL for Opto-Couplers in Isolated Designs • Hot Plug Circuitry; Tx and Rx Outputs Remain Three-State During Power-Up/Power-Down • Choice of RS-485 Data Rates. . . . . . . . . 250kbps to 15Mbps Receiver (Rx) inputs feature a “Full Fail-Safe” design that ensures a logic high Rx output if Rx inputs are floating, shorted, or on a terminated but undriven (idle) bus. Rx outputs have high drive levels; typically, 15mA @ VOL = 1V (for opto-coupled, isolated applications). • Low Quiescent Supply Current . . . . . . . . . . . . . . . . . . . 2.3mA Half duplex (Rx inputs and Tx outputs multiplexed together) and full duplex pinouts are available. See Table 1 on page 2 for key features and configurations by device number. • High Node Count RS-485 Systems For fault protected or wide common mode range RS-485 transceivers with cable invert (polarity reversal) pins, please see the ISL32483E data sheet. • Ultra Low Shutdown Supply Current . . . . . . . . . . . . . . . . 10µA Applications • Utility Meters/Automated Meter Reading Systems • PROFIBUS™ and RS-485 Based Field Bus Networks, and Factory Automation • Security Camera Networks • Building Lighting and Environmental Control Systems • Industrial/Process Control Networks 30 VID = ±1V B A 20 VOLTAGE (V) 25 COMMON MODE RANGE 25 15 10 5 RO 0 0 -7 -12 -20 -25 -5 STANDARD RS-485 TRANSCEIVER TIME (20ns/DIV) FIGURE 1. EXCEPTIONAL Rx OPERATES AT >15Mbps EVEN WITH A ±25V COMMON MODE VOLTAGE January 18, 2011 FN7786.0 12 1 CLOSEST COMPETITOR ISL3249xE FIGURE 2. ISL3249xE DELIVERS SUPERIOR COMMON MODE RANGE vs STANDARD RS-485 DEVICES CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2011. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners. ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E TABLE 1. SUMMARY OF FEATURES HALF/FULL DUPLEX DATA RATE (Mbps) SLEW-RATE LIMITED? EN PINS? HOT PLUG? QUIESCENT ICC (mA) LOW POWER SHDN? PIN COUNT ISL32490E Full 0.25 Yes Yes Yes 2.3 Yes 14 ISL32492E Half 0.25 Yes Yes Yes 2.3 Yes 8 ISL32493E Full 1 Yes Yes Yes 2.3 Yes 14 ISL32495E Half 1 Yes Yes Yes 2.3 Yes 8 ISL32496E Full 15 No Yes Yes 2.3 Yes 14 ISL32498E Half 15 No Yes Yes 2.3 Yes 8 PART NUMBER Ordering Information PART NUMBER (Notes 1, 2, 3) PART MARKING TEMP. RANGE (°C) PACKAGE (Pb-Free) PKG. DWG. # ISL32490EIBZ ISL32490 EIBZ -40 to +85 14 Ld SOIC M14.15 ISL32492EIBZ 32492 EIBZ -40 to +85 8 Ld SOIC M8.15 ISL32492EIUZ 2492E -40 to +85 8 Ld MSOP M8.118 ISL32493EIBZ ISL32493 EIBZ -40 to +85 14 Ld SOIC M14.15 ISL32495EIBZ 32495 EIBZ -40 to +85 8 Ld SOIC M8.15 ISL32495EIUZ 2495E -40 to +85 8 Ld MSOP M8.118 ISL32496EIBZ ISL32496 EIBZ -40 to +85 14 Ld SOIC M14.15 ISL32498EIBZ 32498 EIBZ -40 to +85 8 Ld SOIC M8.15 ISL32498EIUZ 2498E -40 to +85 8 Ld MSOP M8.118 NOTES: 1. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pbfree products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. For Moisture Sensitivity Level (MSL), please see device information pages for ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E. For more information on MSL please see techbrief TB363. Pin Configurations ISL32492E, ISL32495E, ISL32498E (8 LD MSOP, 8 LD SOIC) TOP VIEW RO 1 RE 2 DE 3 DI 4 R D ISL32490E, ISL32493E, ISL32496E (14 LD SOIC) TOP VIEW 8 VCC NC 1 7 B/Z RO 2 6 A/Y RE 3 5 GND DE 4 DI 5 14 VCC R 13 VCC 12 A 11 B D 10 Z GND 6 9 Y GND 7 8 NC NOTE: Evaluate creepage and clearance requirements at your maximum fault voltage before using small pitch packages (e.g., MSOP). 2 FN7786.0 January 18, 2011 ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E Truth Tables TRANSMITTING RECEIVING INPUTS OUTPUTS INPUTS RE DE DI Z Y X 1 1 0 1 X 1 0 1 0 0 0 X High-Z High-Z 1 0 X High-Z (see Note) High-Z (see Note) NOTE: Low Power Shutdown Mode (see Note 11 on page 9). OUTPUT RE DE Half Duplex DE Full Duplex A-B RO 0 0 X ≥ -0.01V 1 0 0 X ≤ -0.2V 0 0 0 X Inputs Open/Shorted 1 1 0 0 X High-Z (see Note) 1 1 1 X High-Z NOTE: Low Power Shutdown Mode (see Note 11 on page 9). Pin Descriptions PIN NAME 8 LD PIN # 14 LD PIN # RO 1 2 Receiver output. If A-B ≥ -10mV, RO is high; if A-B ≤ -200mV, RO is low; RO = High if A and B are unconnected (floating), shorted together, or connected to an undriven, terminated bus. RE 2 3 Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high. Internally pulled low. DE 3 4 Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high. They are high impedance when DE is low. Internally pulled high. DI 4 5 Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low. GND 5 6, 7 A/Y 6 - ±60V Fault and ±16.5kV HBM ESD Protected RS-485/RS-422 level, non-inverting receiver input and non-inverting driver output. Pin is an input if DE = 0; pin is an output if DE = 1. B/Z 7 - ±60V Fault and ±16.5kV HBM ESD Protected RS-485/RS-422 level, inverting receiver input and inverting driver output. Pin is an input if DE = 0; pin is an output if DE = 1. A - 12 ±60V Fault and ±15kV HBM ESD Protected RS-485/RS-422 level, non-inverting receiver input. B - 11 ±60V Fault and ±15kV HBM ESD Protected RS-485/RS-422 level, inverting receiver input. Y - 9 ±60V Fault and ±15kV HBM ESD Protected RS-485/RS-422 level, non-inverting driver output. Z - 10 ±60V Fault and ±15kV HBM ESD Protected RS-485/RS-422 level, inverting driver output. VCC 8 NC - FUNCTION Ground connection. 13, 14 System power supply input (4.5V to 5.5V). 1, 8 No internal connection. 3 FN7786.0 January 18, 2011 ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E Typical Operating Circuits +5V +5V + 8 0.1µF 0.1µF + 8 VCC 1 RO VCC R B/Z 7 3 DE A/Y 6 4 DI DI 4 D 2 RE RT RT 7 B/Z DE 3 6 A/Y RE 2 RO 1 R D GND GND 5 5 ISL32492E, ISL32495E, ISL32498E HALF DUPLEX EXAMPLE +5V +5V + 13, 14 VCC 2 RO R A 12 0.1µF 0.1µF RT + 13, 14 VCC 9 Y B 11 10 Z D DI 5 3 RE DE 4 4 DE RE 3 5 DI Z 10 Y 9 D RT 11 B R 12 A GND RO 2 GND 6, 7 6, 7 ISL32490E, ISL32493E, ISL32496E FULL DUPLEX EXAMPLE 4 FN7786.0 January 18, 2011 ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E Absolute Maximum Ratings Thermal Information VCC to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Input Voltages DI, DE, RE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC + 0.3V) Input/Output Voltages A/Y, B/Z, A, B, Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±60V A/Y, B/Z, A, B, Y, Z (Transient Pulse Through 100Ω, (Note 15 on page 9) . . . . . . . . . . . ±80V RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC +0.3V) Short Circuit Duration Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Indefinite ESD Rating . . . . . . . . . . . . . . . . . . . . see “ESD PERFORMANCE” on page 6 Latch-up (Tested per JESD78, Level 2, Class A) . . . . . . . . . . . . . . . +125°C Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) 8 Ld MSOP Package (Notes 4, 5) . . . . . . . . 140 40 8 Ld SOIC Package (Notes 4, 5) . . . . . . . . . 116 47 14 Ld SOIC Package (Notes 4, 5) . . . . . . . . 88 39 Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . . . . . . . . -65°C to +150°C Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Recommended Operating Conditions Supply Voltage (VCC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C Bus Pin Common Mode Voltage Range. . . . . . . . . . . . . . . . . . -25V to +25V CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 4. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 5. For θJC, the “case temp” location is taken at the package top center. Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C (Note 6). Boldface limits apply over the operating temperature range, -40°C to +85°C. SYMBOL TEMP (°C) MIN (Note 14) TYP MAX (Note 14) UNITS Full - - VCC V RL = 100Ω (RS-422) Full 2.4 3.2 - V RL = 54Ω (RS-485) Full 1.5 2.5 VCC V RL = 54Ω (PROFIBUS, VCC ≥ 5V) Full 2.0 2.5 RL = 21Ω (Six 120Ω terminations for Star Configurations, VCC ≥ 4.75V) Full 0.8 1.3 - V Full - - 0.2 V RL = 60Ω, -7V ≤ VCM ≤ 12V Full 1.5 2.1 VCC V RL = 60Ω, -25V ≤ VCM ≤ 25V (VCC ≥ 4.75V) Full 1.7 2.3 RL = 21Ω, -15V ≤ VCM ≤ 15V (VCC ≥ 4.75V) Full 0.8 1.1 - V RL = 54Ω or 100Ω Full -1 - 3 V RL = 60Ω or 100Ω, -20V ≤ VCM ≤ 20V Full -2.5 - 5 V PARAMETER TEST CONDITIONS DC CHARACTERISTICS VOD1 Driver Differential VOUT (No load) VOD2 Driver Differential VOUT (Loaded, Figure 3A) ΔVOD Change in Magnitude of Driver RL = 54Ω or 100Ω (Figure 3A) Differential VOUT for Complementary Output States VOD3 Driver Differential VOUT with Common Mode Load (Figure 3B) VOC Driver Common-Mode VOUT (Figure 3) ΔVOC Change in Magnitude of Driver RL = 54Ω or 100Ω (Figure 3A) Common-Mode VOUT for Complementary Output States Full - - 0.2 V IOSD Driver Short-Circuit Current DE = VCC, -25V ≤ VO ≤ 25V (Note 8) Full -250 - 250 mA IOSD1 At First Fold-back, 22V ≤ VO ≤ -22V Full -83 83 mA IOSD2 At Second Fold-back, 35V ≤ VO ≤ -35V Full -13 13 mA VIH Logic Input High Voltage DE, DI, RE Full 2.5 - - V VIL Logic Input Low Voltage DE, DI, RE Full - - 0.8 V 5 FN7786.0 January 18, 2011 ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C (Note 6). Boldface limits apply over the operating temperature range, -40°C to +85°C. (Continued) SYMBOL IIN1 IIN2 IIN3 IOZD TEMP (°C) MIN (Note 14) TYP MAX (Note 14) UNITS DI Full -1 - 1 µA DE, RE Full -15 6 15 µA DE = 0V, VIN = 12V VCC = 0V or 5.5V VIN = -7V Full - 110 250 µA Full -200 -75 - µA VIN = ±25V Full -800 ±240 800 µA VIN = ±60V (Note 16) Full -6 ±0.5 6 mA Full - 90 125 µA VIN = -7V Full -100 -70 - µA VIN = ±25V Full -500 ±200 500 µA VIN = ±60V (Note 16) Full -3 ±0.4 3 mA Full - 20 200 µA Full -100 -5 - µA VIN = ±25V Full -500 ±40 500 µA VIN = ±60V (Note 16) Full -3 ±0.1 3 mA PARAMETER Logic Input Current Input/Output Current (A/Y, B/Z) Input Current (A, B) (Full Duplex Versions Only) TEST CONDITIONS VCC = 0V or 5.5V VIN = 12V VIN = 12V Output Leakage Current (Y, Z) RE = 0V, (Full Duplex Versions Only) DE = 0V, V = -7V VCC = 0V or 5.5V IN V TH Receiver Differential Threshold Voltage -25V ≤ VCM ≤ 25V Full -200 -100 -10 mV ΔV TH Receiver Input Hysteresis -25V ≤ VCM ≤ 25V 25 - 25 - mV VOH Receiver Output High Voltage IO = -2mA, VID = -10mV Full VCC - 0.5 4.75 - V IO = -8mA, VID = -10mV Full 2.8 4.2 - V VOL Receiver Output Low Voltage IO = 6mA, VID = -200mV Full - 0.27 0.4 V IOL Receiver Output Low Current VO = 1V, VID = -200mV Full 15 22 - mA IOZR Three-State (High Impedance) 0V ≤ VO ≤ VCC Receiver Output Current Full -1 0.01 1 µA IOSR Receiver Short-Circuit Current 0V ≤ VO ≤ VCC Full ±12 - ±110 mA SUPPLY CURRENT ICC ISHDN No-Load Supply Current (Note 7) DE = VCC, RE = 0V or VCC, DI = 0V or VCC Full - 2.3 4.5 mA Shutdown Supply Current DE = 0V, RE = VCC, DI = 0V or VCC Full - 10 50 µA RS-485 Pins (A, Y, B, Z, A/Y, B/Z) 1/2 Duplex Human Body Model, From Bus Full Duplex Pins to GND 25 - ±16.5 - kV 25 - ±15 - kV All Pins Human Body Model, per JEDEC 25 - ±8 - kV Machine Model 25 - ±700 - V No CM Load Full - 320 450 ns -25V ≤ VCM ≤ 25V Full - - 1000 ns No CM Load Full - 6 30 ns -25V ≤ VCM ≤ 25V Full - - 50 ns ESD PERFORMANCE DRIVER SWITCHING CHARACTERISTICS (250kbps Versions; ISL32490E, ISL32492E) tPLH, tPHL tSKEW Driver Differential Output Delay RD = 54Ω, CD = 50pF (Figure 4) Driver Differential Output Skew RD = 54Ω, CD = 50pF (Figure 4) 6 FN7786.0 January 18, 2011 ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C (Note 6). Boldface limits apply over the operating temperature range, -40°C to +85°C. (Continued) SYMBOL tR, tF PARAMETER TEMP (°C) MIN (Note 14) TYP MAX (Note 14) UNITS No CM Load Full 400 650 1200 ns -25V ≤ VCM ≤ 25V Full 300 - 1200 ns TEST CONDITIONS Driver Differential Rise or Fall RD = 54Ω, Time CD = 50pF (Figure 4) Maximum Data Rate CD = 820pF (Figure 6) Full 0.25 1.5 - Mbps tZH Driver Enable to Output High SW = GND (Figure 5), (Note 9) Full - - 1200 ns tZL Driver Enable to Output Low SW = VCC (Figure 5), (Note 9) Full - - 1200 ns tLZ Driver Disable from Output Low SW = VCC (Figure 5) Full - - 120 ns tHZ Driver Disable from Output High SW = GND (Figure 5) Full - - 120 ns Time to Shutdown (Note 11) Full 60 160 600 ns tZH(SHDN) Driver Enable from Shutdown to Output High SW = GND (Figure 5), (Notes 11, 12) Full - - 2500 ns tZL(SHDN) Driver Enable from Shutdown to Output Low SW = VCC (Figure 5), (Notes 11, 12) Full - - 2500 ns No CM Load Full - 70 125 ns -25V ≤ VCM ≤ 25V Full - - 350 ns No CM Load Full - 4.5 15 ns -25V ≤ VCM ≤ 25V Full - - 25 ns No CM Load Full 70 170 300 ns -25V ≤ VCM ≤ 25V Full 70 - 400 ns fMAX tSHDN DRIVER SWITCHING CHARACTERISTICS (1Mbps Versions; ISL32493E, ISL32495E) tPLH, tPHL tSKEW tR, tF Driver Differential Output Delay RD = 54Ω, CD = 50pF (Figure 4) Driver Differential Output Skew RD = 54Ω, CD = 50pF (Figure 4) Driver Differential Rise or Fall RD = 54Ω, Time CD = 50pF (Figure 4) Maximum Data Rate CD = 820pF (Figure 6) Full 1 4 - Mbps tZH Driver Enable to Output High SW = GND (Figure 5), (Note 9) Full - - 350 ns tZL Driver Enable to Output Low SW = VCC (Figure 5), (Note 9) Full - - 300 ns tLZ Driver Disable from Output Low SW = VCC (Figure 5) Full - - 120 ns tHZ Driver Disable from Output High SW = GND (Figure 5) Full - - 120 ns Time to Shutdown (Note 11) Full 60 160 600 ns tZH(SHDN) Driver Enable from Shutdown to Output High SW = GND (Figure 5), (Notes 11, 12) Full - - 2000 ns tZL(SHDN) Driver Enable from Shutdown to Output Low SW = VCC (Figure 5), (Notes 11, 12) Full - - 2000 ns No CM Load Full - 21 45 ns -25V ≤ VCM ≤ 25V Full - - 80 ns No CM Load Full - 3 6 ns -25V ≤ VCM ≤ 25V Full - - 7 ns No CM Load Full 5 17 30 ns -25V ≤ VCM ≤ 25V Full 5 - 30 ns fMAX tSHDN DRIVER SWITCHING CHARACTERISTICS (15Mbps Versions; ISL32496E, ISL32498E) tPLH, tPHL tSKEW tR, tF Driver Differential Output Delay RD = 54Ω, CD = 50pF (Figure 4) Driver Differential Output Skew RD = 54Ω, CD = 50pF (Figure 4) Driver Differential Rise or Fall RD = 54Ω, Time CD = 50pF (Figure 4) 7 FN7786.0 January 18, 2011 ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C (Note 6). Boldface limits apply over the operating temperature range, -40°C to +85°C. (Continued) SYMBOL fMAX PARAMETER TEST CONDITIONS TEMP (°C) MIN (Note 14) TYP MAX (Note 14) UNITS Maximum Data Rate CD = 470pF (Figure 6) Full 15 25 - Mbps tZH Driver Enable to Output High SW = GND (Figure 5), (Note 9) Full - - 100 ns tZL Driver Enable to Output Low SW = VCC (Figure 5), (Note 9) Full - - 100 ns tLZ Driver Disable from Output Low SW = VCC (Figure 5) Full - - 120 ns tHZ Driver Disable from Output High SW = GND (Figure 5) Full - - 120 ns Time to Shutdown (Note 11) Full 60 160 600 ns tZH(SHDN) Driver Enable from Shutdown to Output High SW = GND (Figure 5), (Notes 11, 12) Full - - 2000 ns tZL(SHDN) Driver Enable from Shutdown to Output Low SW = VCC (Figure 5), (Notes 11, 12) Full - - 2000 ns -25V ≤ VCM ≤ 25V (Figure 7) Full 0.25 5 - Mbps Receiver Input to Output Delay -25V ≤ VCM ≤ 25V (Figure 7) Full - 200 280 ns Receiver Skew |tPLH - tPHL | (Figure 7) Full - 4 10 ns tZL Receiver Enable to Output Low RL = 1kΩ, CL = 15pF, SW = VCC (Figure 8), (Note 10) Full - - 50 ns tZH Receiver Enable to Output High RL = 1kΩ, CL = 15pF, SW = GND (Figure 8), (Note 10) Full - - 50 ns tLZ Receiver Disable from Output RL = 1kΩ, CL = 15pF, SW = VCC (Figure 8) Low Full - - 50 ns tHZ Receiver Disable from Output RL = 1kΩ, CL = 15pF, SW = GND (Figure 8) High Full - - 50 ns Time to Shutdown (Note 11) Full 60 160 600 ns tZH(SHDN) Receiver Enable from Shutdown to Output High RL = 1kΩ, CL = 15pF, SW = GND (Figure 8), (Notes 11, 13) Full - - 2000 ns tZL(SHDN) Receiver Enable from Shutdown to Output Low RL = 1kΩ, CL = 15pF, SW = VCC (Figure 8), (Notes 11, 13) Full - - 2000 ns -25V ≤ VCM ≤ 25V (Figure 7) Full 1 15 - Mbps Receiver Input to Output Delay -25V ≤ VCM ≤ 25V (Figure 7) Full - 90 150 ns Receiver Skew |tPLH - tPHL | (Figure 7) Full - 4 10 ns tZL Receiver Enable to Output Low RL = 1kΩ, CL = 15pF, SW = VCC (Figure 8), (Note 10) Full - - 50 ns tZH Receiver Enable to Output High RL = 1kΩ, CL = 15pF, SW = GND (Figure 8), (Note 10) Full - - 50 ns tLZ Receiver Disable from Output RL = 1kΩ, CL = 15pF, SW = VCC (Figure 8) Low Full - - 50 ns tHZ Receiver Disable from Output RL = 1kΩ, CL = 15pF, SW = GND (Figure 8) High Full - - 50 ns Time to Shutdown (Note 11) Full 60 160 600 ns Receiver Enable from Shutdown to Output High RL = 1kΩ, CL = 15pF, SW = GND (Figure 8), (Notes 11, 13) Full - - 2000 ns tSHDN RECEIVER SWITCHING CHARACTERISTICS (250kbps Versions; ISL32490E, ISL32492E) fMAX tPLH, tPHL tSKD tSHDN Maximum Data Rate RECEIVER SWITCHING CHARACTERISTICS (1Mbps Versions; ISL32493E, ISL32495E) fMAX tPLH, tPHL tSKD tSHDN tZH(SHDN) Maximum Data Rate 8 FN7786.0 January 18, 2011 ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C (Note 6). Boldface limits apply over the operating temperature range, -40°C to +85°C. (Continued) TEMP (°C) MIN (Note 14) TYP MAX (Note 14) UNITS Full - - 2000 ns -25V ≤ VCM ≤ 25V (Figure 7) Full 15 25 - Mbps Receiver Input to Output Delay -25V ≤ VCM ≤ 25V (Figure 7) Full - 35 70 ns Receiver Skew |tPLH - tPHL | (Figure 7) Full - 4 10 ns tZL Receiver Enable to Output Low RL = 1kΩ, CL = 15pF, SW = VCC (Figure 8), (Note 10) Full - - 50 ns tZH Receiver Enable to Output High RL = 1kΩ, CL = 15pF, SW = GND (Figure 8), (Note 10) Full - - 50 ns tLZ Receiver Disable from Output RL = 1kΩ, CL = 15pF, SW = VCC (Figure 8) Low Full - - 50 ns tHZ Receiver Disable from Output RL = 1kΩ, CL = 15pF, SW = GND (Figure 8) High Full - - 50 ns Time to Shutdown (Note 11) Full 60 160 600 ns tZH(SHDN) Receiver Enable from Shutdown to Output High RL = 1kΩ, CL = 15pF, SW = GND (Figure 8), (Notes 11, 13) Full - - 2000 ns tZL(SHDN) Receiver Enable from Shutdown to Output Low RL = 1kΩ, CL = 15pF, SW = VCC (Figure 8), (Notes 11, 13) Full - - 2000 ns SYMBOL tZL(SHDN) PARAMETER Receiver Enable from Shutdown to Output Low TEST CONDITIONS RL = 1kΩ, CL = 15pF, SW = VCC (Figure 8), (Notes 11, 13) RECEIVER SWITCHING CHARACTERISTICS (15Mbps Versions; ISL32496E, ISL32498E) fMAX tPLH, tPHL tSKD tSHDN Maximum Data Rate NOTES: 6. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. 7. Supply current specification is valid for loaded drivers when DE = 0V. 8. Applies to peak current. See “Typical Performance Curves VCC = 5V, TA = +25°C; Unless Otherwise Specified.” beginning on page 14 for more information. 9. Keep RE = 0 to prevent the device from entering SHDN. 10. The RE signal high time must be short enough (typically <100ns) to prevent the device from entering SHDN. 11. Transceivers are put into shutdown by bringing RE high and DE low. If the inputs are in this state for less than 60ns, the parts are guaranteed not to enter shutdown. If the inputs are in this state for at least 600ns, the parts are guaranteed to have entered shutdown. See “Low Power Shutdown Mode” on page 13. 12. Keep RE = VCC, and set the DE signal low time >600ns to ensure that the device enters SHDN. 13. Set the RE signal high time >600ns to ensure that the device enters SHDN. 14. Compliance to data sheet limits is assured by one or more methods: production test, characterization and/or design. 15. Tested according to TIA/EIA-485-A, Section 4.2.6 (±80V for 15µs at a 1% duty cycle). 16. See “Caution” statement below the “Latch-up (Tested per JESD78, Level 2, Class A) +125°C” section on page 5. 9 FN7786.0 January 18, 2011 ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E Test Circuits and Waveforms RL/2 DE VCC VCC Z DI Z DI VOD D VCM VOD D Y Y VOC VOC RL/2 375Ω RL/2 DE 375Ω RL/2 FIGURE 3A. VOD AND VOC FIGURE 3B. VOD AND VOC WITH COMMON MODE LOAD FIGURE 3. DC DRIVER TEST CIRCUITS 3V DI 1.5V 1.5V 0V VCC 375Ω* DE DI CD D RD Y VCM 375Ω* SIGNAL GENERATOR tPHL tPLH Z *USED ONLY FOR COMMON MODE LOAD TESTS OUT (Z) VOH OUT (Y) VOL 90% DIFF OUT (Y - Z) +VOD 90% 10% 10% tR -VOD tF SKEW = |tPLH - tPHL | FIGURE 4A. TEST CIRCUIT FIGURE 4B. MEASUREMENT POINTS FIGURE 4. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES DE Z DI 110Ω VCC D SIGNAL GENERATOR SW Y GND CL 3V DE 1.5V (Note 11) tZH, tZH(SHDN) (Note 11) PARAMETER OUTPUT RE DI SW CL (pF) tHZ Y/Z X 1/0 GND 50 tLZ Y/Z X 0/1 VCC 50 tZH Y/Z 0 (Note 9) 1/0 GND 100 tZL Y/Z 0 (Note 9) 0/1 VCC 100 tZH(SHDN) Y/Z 1 (Note 12) 1/0 GND 100 tZL(SHDN) Y/Z 1 (Note 12) 0/1 VCC 100 FIGURE 5A. TEST CIRCUIT 1.5V 0V tHZ OUTPUT HIGH VOH - 0.5V 2.3V OUT (Y, Z) VOH 0V tZL, tZL(SHDN) tLZ (Note 11) VCC OUT (Y, Z) 2.3V VOL + 0.5V OUTPUT LOW VOL FIGURE 5B. MEASUREMENT POINTS FIGURE 5. DRIVER ENABLE AND DISABLE TIMES 10 FN7786.0 January 18, 2011 ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E Test Circuits and Waveforms (Continued) VCC DE DI 3V + Z 54Ω D DI VOD CD Y 0V - SIGNAL GENERATOR +VOD DIFF OUT (Y - Z) 0V -VOD FIGURE 6A. TEST CIRCUIT FIGURE 6B. MEASUREMENT POINTS FIGURE 6. DRIVER DATA RATE B RE B R A VCM + 750mV 15pF RO VCM VCM VCM - 750mV A tPLH SIGNAL GENERATOR tPHL SIGNAL GENERATOR VCC 50% RO 50% VCM 0V FIGURE 7A. TEST CIRCUIT FIGURE 7B. MEASUREMENT POINTS FIGURE 7. RECEIVER PROPAGATION DELAY AND DATA RATE RE B A R 1kΩ RO SIGNAL GENERATOR 15pF (Note 11) VCC SW GND 3V RE 1.5V 0V tZH, tZH(SHDN) PARAMETER DE A 1.5V SW tHZ 0 +1.5V GND tLZ 0 -1.5V VCC tZH (Note 10) 0 +1.5V GND tZL (Note 10) 0 -1.5V VCC tZH(SHDN) (Note 13) 0 +1.5V GND tZL(SHDN) (Note 13) 0 -1.5V VCC FIGURE 8A. TEST CIRCUIT (Note 11) tHZ OUTPUT HIGH VOH - 0.5V 1.5V RO VOH 0V tZL, tZL(SHDN) tLZ (Note 11) VCC RO 1.5V VOL + 0.5V OUTPUT LOW VOL FIGURE 8B. MEASUREMENT POINTS FIGURE 8. RECEIVER ENABLE AND DISABLE TIMES Application Information RS-485 and RS-422 are differential (balanced) data transmission standards used for long haul or noisy environments. RS-422 is a subset of RS-485, so RS-485 transceivers are also RS-422 compliant. RS-422 is a point-to-multipoint (multidrop) standard, which allows only one driver and up to 10 (assuming one-unit load devices) receivers on each bus. RS-485 is a true multipoint standard, which allows up to 32 one-unit load devices (any combination of drivers and receivers) on each bus. To allow for multipoint operation, the RS-485 specification requires that 11 drivers must handle bus contention without sustaining any damage. Another important advantage of RS-485 is the extended common mode range (CMR), which specifies that the driver outputs and receiver inputs withstand signals that range from +12V to -7V. RS-422 and RS-485 are intended for runs as long as 4000 feet; thus, the wide CMR is necessary to handle ground potential differences, as well as voltages induced in the cable by external fields. The ISL3249xE is a family of ruggedized RS-485 transceivers that improves on the RS-485 basic requirements and thereby FN7786.0 January 18, 2011 ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E increases system reliability. The CMR increases to ±25V, while the RS-485 bus pins (receiver inputs and driver outputs) include fault protection against voltages and transients up to ±60V. Additionally, larger-than-required differential output voltages (VOD) increase noise immunity, while the ±16.5kV built-in ESD protection complements the fault protection. Receiver (Rx) Features These devices utilize a differential input receiver for maximum noise immunity and common mode rejection. Input sensitivity is better than ±200mV, as required by the RS-422 and RS-485 specifications. Receiver input (load) current surpasses the RS-422 specification of 3mA and is four times lower than the RS-485 “Unit Load (UL)” requirement of 1mA maximum. Thus, these products are known as “one-quarter UL” transceivers, and there can be up to 128 of these devices on a network while still complying with the RS-485 loading specification. The Rx functions with common mode voltages as great as ±25V, making them ideal for industrial or long networks where induced voltages are a realistic concern. All the receivers include a “full fail-safe” function that guarantees a high-level receiver output if the receiver inputs are unconnected (floating), shorted together, or connected to a terminated bus with all the transmitters disabled (i.e., an idle bus). Rx outputs feature high drive levels (typically 22mA @ VOL = 1V) to ease the design of optically coupled isolated interfaces. Receivers easily meet the data rates supported by the corresponding driver, and all receiver outputs are three-statable via the active low RE input. The Rx in the 250kbps and 1Mbps versions include noise filtering circuitry to reject high-frequency signals. The 1Mbps version typically rejects pulses narrower than 50ns (equivalent to 20Mbps), while the 250kbps Rx rejects pulses below 150ns (6.7Mbps). Driver (Tx) Features The RS-485/RS-422 driver is a differential output device that delivers at least 1.5V across a 54Ω load (RS-485) and at least 2.4V across a 100Ω load (RS-422). The drivers feature low propagation delay skew to maximize bit width and minimize EMI, and all drivers are three-statable via the active high DE input. The 250kbps and 1Mbps driver outputs are slew rate limited to minimize EMI and to minimize reflections in unterminated or improperly terminated networks. Outputs of the ISL32496E and ISL32498E drivers are not limited; thus, faster output transition times allow data rates of at least 15Mbps. High Overvoltage (Fault) Protection Increases Ruggedness NOTE: The available smaller pitch package (MSOP) may not meet the creepage and clearance (C&C) requirements for ±60V levels. The user is advised to determine his C&C requirements before selecting a package type. The ±60V (referenced to the IC GND) fault protection on the RS-485 pins makes these transceivers some of the most rugged 12 on the market. This level of protection makes the ISL3249xE perfect for applications where power (e.g., 24V and 48V supplies) must be routed in the conduit with the data lines, or for outdoor applications where large transients are likely to occur. When power is routed with the data lines, even a momentary short between the supply and data lines will destroy an unprotected device. The ±60V fault levels of this family are at least five times higher than the levels specified for standard RS-485 ICs. The ISL3249xE protection is active whether the Tx is enabled or disabled, and even if the IC is powered down. If transients or voltages (including overshoots and ringing) greater than ±60V are possible, then additional external protection is required. Widest Common Mode Voltage (CMV) Tolerance Improves Operating Range RS-485 networks operating in industrial complexes or over long distances are susceptible to large CMV variations. Either of these operating environments may suffer from large node-to-node ground potential differences or CMV pickup from external electromagnetic sources, and devices with only the minimum required +12V to -7V CMR may malfunction. The ISL3249xE’s extended ±25V CMR is the widest available, allowing operation in environments that would overwhelm lesser transceivers. Additionally, the Rx will not phase invert (erroneously change state), even with CMVs of ±40V or differential voltages as large as 40V. High VOD Improves Noise Immunity and Flexibility The ISL3249xE driver design delivers larger differential output voltages (VOD) than the RS-485 standard requires or than most RS-485 transmitters can deliver. The typical ±2.5V VOD provides more noise immunity than networks built using many other transceivers. Another advantage of the large VOD is the ability to drive more than two bus terminations, which allows for utilizing the ISL3249xE in “star” and other multi-terminated, nonstandard network topologies. Figure 10 on page 14 details the transmitter’s VOD vs IOUT characteristic and includes load lines for four (30Ω) and six (20Ω) 120Ω terminations. Figure 10 shows that the driver typically delivers ±1.3V into six terminations, and the “Electrical Specifications” on page 5 guarantees a VOD of ±0.8V at 21Ω over the full temperature range. The RS-485 standard requires a minimum 1.5V VOD into two terminations, but the ISL3249xE deliver RS-485 voltage levels with 2x to 3x the number of terminations. Hot Plug Function When a piece of equipment powers up, there is a period of time during which the processor or ASIC driving the RS-485 control lines (DE, RE) is unable to ensure that the RS-485 Tx and Rx outputs are kept disabled. If the equipment is connected to the bus, a driver activating prematurely during power-up may crash the bus. To avoid this scenario, the ISL3249xE devices incorporate a “Hot Plug” function. Circuitry monitoring VCC ensures that, during power-up and power-down, the Tx and Rx outputs remain disabled, regardless of the state of DE and RE, if VCC is less FN7786.0 January 18, 2011 ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E than ≈3.5V. This gives the processor/ASIC a chance to stabilize and drive the RS-485 control lines to the proper states. Figure 9 illustrates the power-up and power-down performance of the ISL3249xE compared to an RS-485 IC without the Hot Plug feature. RE = GND 3.5V 2.8V 2.5 VCC 0 5.0 RL = 1kΩ 2.5 0 A/Y ISL3249xE ISL83088E RL = 1kΩ RO ISL3249xE 5.0 2.5 0 RECEIVER OUTPUT (V) DRIVER Y OUTPUT (V) 5.0 VCC (V) DE, DI = VCC TIME (40µs/DIV) FIGURE 9. HOT PLUG PERFORMANCE (ISL3249xE) vs ISL83088E WITHOUT HOT PLUG CIRCUITRY ESD Protection All pins on these devices include class 3 (>8kV) Human Body Model (HBM) ESD protection structures that are good enough to survive ESD events commonly seen during manufacturing. Even so, the RS-485 pins (driver outputs and receiver inputs) incorporate more advanced structures, allowing them to survive ESD events in excess of ±16.5kV HBM (±15kV for full-duplex version). The RS-485 pins are particularly vulnerable to ESD strikes because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins or connecting a cable can cause an ESD event that might destroy unprotected ICs. These new ESD structures protect the device whether or not it is powered up, and without interfering with the exceptional ±25V CMR. This built-in ESD protection minimizes the need for board-level protection structures (e.g., transient suppression diodes) and the associated, undesirable capacitive load they present. Data Rate, Cables, and Terminations RS-485/RS-422 are intended for network lengths up to 4000 feet, but the maximum system data rate decreases as the transmission length increases. Devices operating at 15Mbps may be used at lengths up to 150 feet (46m), but the distance can be increased to 328 feet (100m) by operating at 10Mbps. The 1Mbps versions can operate at full data rates with lengths up to 800 feet (244m). Jitter is the limiting parameter at these faster data rates, so employing encoded data streams (e.g., Manchester coded or Return-to-Zero) may allow increased transmission distances. The slow versions can operate at 115kbps or less at the full 4000-foot (1220m) distance or at 250kbps for lengths up to 3000 feet (915m). DC cable attenuation is the limiting parameter, so using better quality cables (e.g., 22 AWG) may allow increased transmission distance. 13 Twisted pair is the cable of choice for RS-485/RS-422 networks. Twisted pair cables tend to pick up noise and other electromagnetically induced voltages as common mode signals, which are effectively rejected by the differential receivers in these ICs. Proper termination is imperative, when using the 15Mbps devices, to minimize reflections. Short networks using the 250kbps versions need not be terminated; however, terminations are recommended unless power dissipation is an overriding concern. In point-to-point or point-to-multipoint (single driver on bus, like RS-422) networks, the main cable should be terminated in its characteristic impedance (typically 120Ω) at the end farthest from the driver. In multi-receiver applications, stubs connecting receivers to the main cable should be kept as short as possible. Multipoint (multi-driver) systems require that the main cable be terminated in its characteristic impedance at both ends. Stubs connecting a transceiver to the main cable should be kept as short as possible. Built-In Driver Overload Protection As stated previously, the RS-485 specification requires that drivers survive worst-case bus contentions undamaged. These transceivers meet this requirement via driver output short circuit current limits and on-chip thermal shutdown circuitry. The driver output stages incorporate a double foldback, short circuit current limiting scheme, which ensures that the output current never exceeds the RS-485 specification, even at the common mode and fault condition voltage range extremes. The first foldback current level (≈70mA) is set to ensure that the driver never folds back when driving loads with common mode voltages up to ±25V. The very low second foldback current setting (≈9mA) minimizes power dissipation if the Tx is enabled when a fault occurs. In the event of a major short circuit condition, devices also include a thermal shutdown feature that disables the drivers whenever the die temperature becomes excessive. This eliminates the power dissipation, allowing the die to cool. The drivers automatically re-enable after the die temperature drops about +15°C. If the contention persists, the thermal shutdown/re-enable cycle repeats until the fault is cleared. Receivers stay operational during thermal shutdown. Low Power Shutdown Mode These BiCMOS transceivers all use a fraction of the power required by competitive devices, but they also include a shutdown feature that reduces the already low quiescent ICC to a 10µA trickle. These devices enter shutdown whenever the receiver and driver are simultaneously disabled (RE = VCC and DE = GND) for a period of at least 600ns. Disabling both the driver and the receiver for less than 60ns guarantees that the transceiver will not enter shutdown. Note that receiver and driver enable times increase when the transceiver enables from shutdown. Refer to Notes 9, 10, 11, 12 and 13, at the end of the “Electrical Specifications” table on page 9, for more information. FN7786.0 January 18, 2011 ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E Typical Performance Curves VCC = 5V, TA = +25°C; Unless Otherwise Specified. 3.6 RD = 20Ω 80 RD = 30Ω DIFFERENTIAL OUTPUT VOLTAGE (V) DRIVER OUTPUT CURRENT (mA) 90 +25°C 70 RD = 54Ω +85°C 60 50 40 RD = 100Ω 30 20 10 0 0 1 2 3 4 DIFFERENTIAL OUTPUT VOLTAGE (V) RECEIVER OUTPUT CURRENT (mA) DE = VCC, RE = X 2.35 ICC (mA) 2.30 2.25 DE = GND, RE = GND 2.20 2.15 2.10 2.05 -25 0 25 50 TEMPERATURE (°C) 75 RD = 54Ω 2.4 -25 0 25 50 TEMPERATURE (°C) 75 85 60 VOL, +25°C 50 VOL, +85°C 40 30 20 10 0 -10 VOH, +85°C -20 VOH, +25°C 0 85 1 2 3 4 RECEIVER OUTPUT VOLTAGE (V) 5 FIGURE 13. RECEIVER OUTPUT CURRENT vs RECEIVER OUTPUT VOLTAGE 800 +85°C 600 100 Y OR Z = LOW BUS PIN CURRENT (µA) OUTPUT CURRENT (mA) 2.6 -30 FIGURE 12. SUPPLY CURRENT vs TEMPERATURE 50 +25°C 0 -50 Y OR Z = HIGH -100 2.8 70 2.40 150 3.0 FIGURE 11. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs TEMPERATURE 2.45 2.00 -40 RD = 100Ω 3.2 2.2 -40 5 FIGURE 10. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT VOLTAGE 3.4 +25°C +85°C -150 -60 -50 -40 -30 -20 -10 200 0 Y OR Z -200 -400 A/Y OR B/Z -600 0 10 20 30 40 50 OUTPUT VOLTAGE (V) FIGURE 14. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT VOLTAGE 14 400 60 -70 -50 -30 -10 0 10 30 BUS PIN VOLTAGE (V) 50 70 FIGURE 15. BUS PIN CURRENT vs BUS PIN VOLTAGE FN7786.0 January 18, 2011 ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E Typical Performance Curves VCC = 5V, TA = +25°C; Unless Otherwise Specified. (Continued) 340 8 RD = 54Ω, CD = 50pF RD = 54Ω, CD = 50pF 7 330 6 tPLH 325 5 SKEW (ns) PROPAGATION DELAY (ns) 335 320 315 tPHL 310 4 3 2 305 1 300 -40 0 -25 25 0 50 TEMPERATURE (°C) 75 -40 85 FIGURE 16. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL32490E, ISL32492E) |tPLH - tPHL| -25 0 50 25 TEMPERATURE (°C) 75 85 FIGURE 17. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE (ISL32490E, ISL32492E) 4.0 85 RD = 54Ω, CD = 50pF RD = 54Ω, CD = 50pF 3.5 75 SKEW (ns) PROPAGATION DELAY (ns) 80 70 tPLH 65 3.0 tPHL 60 2.5 55 50 -40 -25 0 25 50 75 2.0 -40 85 |tPLH - tPHL| -25 TEMPERATURE (°C) FIGURE 18. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL32493E, ISL32495E) 75 85 FIGURE 19. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE (ISL32493E, ISL32495E) 3.4 RD = 54Ω, CD = 50pF RD = 54Ω, CD = 50pF 3.2 25 3.0 23 SKEW (ns) PROPAGATION DELAY (ns) 27 0 50 25 TEMPERATURE (°C) tPLH 21 19 2.8 2.6 2.4 tPHL 17 2.2 15 -40 2.0 -40 -25 25 0 50 TEMPERATURE (°C) 75 FIGURE 20. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL32496E, ISL32498E) 15 85 |tPLH - tPHL| -25 0 50 25 TEMPERATURE (°C) 75 85 FIGURE 21. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE (ISL32496E, ISL32498E) FN7786.0 January 18, 2011 ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E Typical Performance Curves VCC = 5V, TA = +25°C; Unless Otherwise Specified. (Continued) A 5 0 5 0 -5 -10 -15 -20 -25 VID = ±1V RO RO A 25 20 15 10 A B B 5 0 VID = ±1V RO 5 0 -5 -10 -15 -20 -25 RO A B TIME (400ns/DIV) TIME (1µs/DIV) 5 0 -5 -10 -15 -20 -25 A B VID = ±1V RO RO A B TIME (20ns/DIV) FIGURE 24. RECEIVER PERFORMANCE WITH ±25V CMV (ISL32496E, ISL32498E) 16 RECEIVER OUTPUT (V) 25 20 15 10 5 0 FIGURE 23. RECEIVER PERFORMANCE WITH ±25V CMV (ISL32493E, ISL32495E) DRIVER OUTPUT (V) VOLTAGE (V) FIGURE 22. RECEIVER PERFORMANCE WITH ±25V CMV (ISL32490E, ISL32492E) RD = 54Ω, CD = 50pF DI 5 0 5 0 3 2 1 0 -1 -2 -3 RO DRIVER INPUT (V) B VOLTAGE (V) VOLTAGE (V) 25 20 15 10 A/Y - B/Z TIME (1µs/DIV) FIGURE 25. DRIVER AND RECEIVER WAVEFORMS (ISL32490E, ISL32492E) FN7786.0 January 18, 2011 ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E 5 RO 0 3 2 1 0 -1 -2 -3 A/Y - B/Z TIME (400ns/DIV) FIGURE 26. DRIVER AND RECEIVER WAVEFORMS (ISL32493E, ISL32495E) RD = 54Ω, CD = 50pF DI 5 0 5 0 3 2 1 0 -1 -2 -3 RO DRIVER INPUT (V) 0 RECEIVER OUTPUT (V) DI 5 DRIVER INPUT (V) RD = 54Ω, CD = 50pF DRIVER OUTPUT (V) DRIVER OUTPUT (V) RECEIVER OUTPUT (V) Typical Performance Curves VCC = 5V, TA = +25°C; Unless Otherwise Specified. (Continued) A/Y - B/Z TIME (20ns/DIV) FIGURE 27. DRIVER AND RECEIVER WAVEFORMS (ISL32496E, ISL32498E) Die Characteristics SUBSTRATE POTENTIAL (Powered Up): GND PROCESS: Si Gate BiCMOS 17 FN7786.0 January 18, 2011 ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you have the latest revision. DATE REVISION January 18, 2011 FN7786.0 CHANGE Initial Release Products Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks. Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a complete list of Intersil product families. *For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page on intersil.com: ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E To report errors or suggestions for this data sheet, please go to www.intersil.com/ask our staff FITs are available from our web site at http://rel.intersil.com/reports/search.php For additional products, see www.intersil.com/product_tree Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted in the quality certifications found at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 18 FN7786.0 January 18, 2011 ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E Package Outline Drawing M8.118 8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE Rev 3, 3/10 5 3.0±0.05 A DETAIL "X" D 8 1.10 MAX SIDE VIEW 2 0.09 - 0.20 4.9±0.15 3.0±0.05 5 0.95 REF PIN# 1 ID 1 2 B 0.65 BSC GAUGE PLANE TOP VIEW 0.55 ± 0.15 0.25 3°±3° 0.85±010 H DETAIL "X" C SEATING PLANE 0.25 - 0.036 0.08 M C A-B D 0.10 ± 0.05 0.10 C SIDE VIEW 1 (5.80) NOTES: (4.40) (3.00) 1. Dimensions are in millimeters. (0.65) (0.40) (1.40) TYPICAL RECOMMENDED LAND PATTERN 19 2. Dimensioning and tolerancing conform to JEDEC MO-187-AA and AMSEY14.5m-1994. 3. Plastic or metal protrusions of 0.15mm max per side are not included. 4. Plastic interlead protrusions of 0.15mm max per side are not included. 5. Dimensions are measured at Datum Plane "H". 6. Dimensions in ( ) are for reference only. FN7786.0 January 18, 2011 ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E Package Outline Drawing M14.15 14 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE Rev 1, 10/09 8.65 A 3 4 0.10 C A-B 2X 6 14 DETAIL"A" 8 0.22±0.03 D 6.0 3.9 4 0.10 C D 2X 0.20 C 2X 7 PIN NO.1 ID MARK 5 0.31-0.51 B 3 (0.35) x 45° 4° ± 4° 6 0.25 M C A-B D TOP VIEW 0.10 C 1.75 MAX H 1.25 MIN 0.25 GAUGE PLANE C SEATING PLANE 0.10 C 0.10-0.25 1.27 SIDE VIEW (1.27) DETAIL "A" (0.6) NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSEY14.5m-1994. 3. Datums A and B to be determined at Datum H. (5.40) 4. Dimension does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25mm per side. 5. The pin #1 indentifier may be either a mold or mark feature. (1.50) 6. Does not include dambar protrusion. Allowable dambar protrusion shall be 0.10mm total in excess of lead width at maximum condition. 7. Reference to JEDEC MS-012-AB. TYPICAL RECOMMENDED LAND PATTERN 20 FN7786.0 January 18, 2011 ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E Package Outline Drawing M8.15 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE Rev 2, 11/10 DETAIL "A" 1.27 (0.050) 0.40 (0.016) INDEX 6.20 (0.244) 5.80 (0.228) AREA 0.50 (0.20) x 45° 0.25 (0.01) 4.00 (0.157) 3.80 (0.150) 1 2 8° 0° 3 0.25 (0.010) 0.19 (0.008) SIDE VIEW “B” TOP VIEW 2.41 (0.095) SEATING PLANE 5.00 (0.197) 4.80 (0.189) 1.75 (0.069) 1.35 (0.053) 1 8 2 7 0.76 (0.030) 1.27 (0.050) 3 6 4 5 -C- 1.27 (0.050) 0.51(0.020) 0.33(0.013) SIDE VIEW “A 0.25(0.010) 0.10(0.004) 0.200 TYPICAL RECOMMENDED LAND PATTERN NOTES: 1. Dimensioning and tolerancing per ANSI Y14.5M-1982. 2. Package length does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 3. Package width does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 4. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 5. Terminal numbers are shown for reference only. 6. The lead width as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 7. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 8. This outline conforms to JEDEC publication MS-012-AA ISSUE C. 21 FN7786.0 January 18, 2011