INTERSIL X60003B-50

X60003B-50, X60003C-50, X60003D-50
®
Data Sheet
March 15, 2005
Precision 5.0V SOT-23 FGA™ Voltage
Reference
FN8137.0
DESCRIPTION
The X60003x-50 FGA™ voltage references are very
high precision analog voltage references fabricated in
Intersil’s proprietary Floating Gate Analog technology,
which achieves superior levels of performance when
compared to conventional band gap, buried zener, or
XFET™ technologies.
FEATURES
• Output Voltage: 5.000V
• Absolute Initial Accuracy Options:
±1.0mV, ±2.5mV, & ±5.0mV
• Ultra Low Power Supply Current: 500nA
• Low Temperature Coefficient Options:
10 & 20ppm/°C
• 10 mA Source & Sink Current Capability
• 10 ppm/1000hrs Long Term Stability
• Very Low Dropout Voltage: 100 mV @ no load
• Supply Voltage Range: 5.1V to 9.0V
• 5kV ESD (Human Body Model)
FGA™ voltage references feature very high initial
accuracy, very low temperature coefficient, excellent
long term stability, low noise and excellent line and
load regulation, at the lowest power consumption
currently available. These voltage references enable
advanced applications for precision industrial &
portable systems operating at significantly higher
accuracy and lower power levels than can be achieved
with conventional technologies.
• Standard Package: 3-lead SOT-23
• Temp Range: -40°C to +85°C
APPLICATIONS
• High Resolution A/Ds & D/As
• Precision Current Sources
• Smart sensors
• Digital Meters
• Precision Regulators
• Strain Gage Bridges
• Calibration Systems
• Precision Oscillators
• Threshold Detectors
• V-F Converters
• Battery Management Systems
• Servo Systems
TYPICAL APPLICATION
VIN = +6.5V
0.1µF
VIN
10µF
VOUT
0.001µF(*)
X60003x-50
GND
REF IN
Serial
Bus
Enable
SCK
SDAT
16 to 24-bit
A/D Converter
(*)Also see Figure 3 in Applications Information
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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Copyright Intersil Americas Inc. 2005. All Rights Reserved
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X60003B-50, X60003C-50, X60003D-50
PACKAGE DIAGRAM
X60003x-50
SOT-23
VIN 1
3 GND
VOUT 2
PIN CONFIGURATIONS
Pin Name
GND
VIN
VOUT
Description
Ground Connection
Power Supply Input Connection
Voltage Reference Output Connection
ORDERING INFORMATION
X 60003 X I G3 – 50
Logo
Device Part Number
60003 = Standard
Grade
B = ±1.0 mV, 10 ppm/°C
C = ±2.5 mV, 20 ppm/°C
D = ±5.0 mV, 20 ppm/°C
Temperature Range
I = -40°C to +85°C
Package
G3 = 3 lead SOT-23
VOUT Option
50 = 5.000V
PART MARKING
Order Part Number
Top Marking
X60003BIG3-50
AHA
X60003CIG3-50
AHB
X60003DIG3-50
AHC
2
FN8137.0
March 15, 2005
X60003B-50, X60003C-50, X60003D-50
ABSOLUTE MAXIMUM RATINGS
COMMENT
Storage Temperature Range............ -65°C to + 125°C
Voltage on any Pin
Referenced to Gnd.............................-0.5V to + 10V
Lead Temperature (soldering, 10 secs).......... + 225°C
Absolute Maximum Ratings indicate limits beyond
which permanent damage to the device and impaired
reliability may occur. These are stress ratings provided
for information only and functional operation of the
device at these or any other conditions beyond those
indicated in the operational sections of this specification are not implied.
RECOMMENDED OPERATING CONDITIONS
Temperature
Min.
Max.
Industrial
-40°C
+85°C
For guaranteed specifications and test conditions, see
Electrical Characteristics.
The guaranteed specifications apply only for the test
conditions listed. Some performance characteristics
may degrade when the device is not operated under
the listed test conditions.
ELECTRICAL CHARACTERISTICS
(Operating Conditions: VIN = 6.5V, IOUT = 0mA, COUT = 0.001µF, TA = -40 to +85°C unless otherwise specified.)
Symbol
Parameter
VOUT
Output Voltage
VOA
VOUT Accuracy
X60003B-50
X60003C-50
X60003D-50
IIN
Supply Current
VIN
Input Voltage Range
TC VOUT
Output Voltage
Temperature Coefficient(1)
∆VOUT/∆VIN
Conditions
Min
Typ
Max
5.000
Units
V
TA = 25°C
mV
-1.0
-2.5
-5.0
+1.0
+2.5
+5.0
900
nA
9.0
V
X60003B-50
X60003C-50
X60003D-50
10
20
20
ppm/°C
Line Regulation
+5.5V ≤ VIN ≤ +8.0V
150
µV/V
∆VOUT/∆IOUT
Load Regulation
0mA≤ ISOURCE ≤ 10mA
-10mA ≤ ISINK ≤ 0mA
10
20
50
100
µV/mA
∆VOUT/∆t
Long Term Stability
TA = 25°C
10
ppm/
1000Hrs
∆VOUT/∆TA
Thermal Hysteresis(2)
∆T = -40°C to +85°C
100
ppm
VDO
Dropout Voltage(3)
IOUT = 5mA, ∆VOUT = -0.01%
150
300
mV
ISC
Short Circuit Current(4)
TA = 25°C
50
80
mA
VN
Output Voltage Noise
0.1Hz to 10Hz
30
Note:
500
5.1
µVpp
1. Over the specified temperature range. Temperature coefficient is measured by the box method whereby the change in VOUT is divided
by the temperature range; in this case, -40°C to +85°C = 125°C.
2. Thermal Hysteresis is the change in VOUT created by package stress @ TA = 25°C after temperature cycling. VOUT is read initially at
TA = 25°C; the X60003x-50 is then cycled between Hot (85°C) and Cold (-40°C) before a second VOUT measurement is taken at 25°C.
The deviation between the initial VOUT reading and the second VOUT reading is then expressed in ppm.
3. Dropout voltage (VDO) is the minimum voltage (VIN) into the X60003x-50 which will produce the output voltage (∆VOUT) drop specified
in the Electrical Characteristics table.
4. Guaranteed by Device Characterization
3
FN8137.0
March 15, 2005
X60003B-50, X60003C-50, X60003D-50
TYPICAL PERFORMANCE CHARACTERISTIC CURVES
(VIN = 6.5V, IOUT = 0mA, TA = 25°C unless otherwise specified)
LINE REGULATION
150
Delta VOUT (µV)
(normailized to VIN = 6.5V)
125
100
75
50
+85°C
+25°C
25
0
-40°C
-25
-50
5
6
7
9
8
VIN (V)
LINE REGULATION
(3 Representative Units)
5.0003
Delta VOUT (V)
(normailized to 5V at VIN = 6.5V)
Unit 3, IIN = 700nA
5.0002
Unit 1, IIN = 350nA
5.0001
5
Unit 2, IIN = 500nA
4.9999
4.9998
4.9997
5
4
5.5
6
6.5
7
VIN (V)
7.5
8
8.5
9
FN8137.0
March 15, 2005
X60003B-50, X60003C-50, X60003D-50
TYPICAL PERFORMANCE CHARACTERISTIC CURVES
(VIN = 6.5V, IOUT = 0mA, TA = 25°C unless otherwise specified)
LOAD REGULATION
1.40
1.20
+85°C
1.00
+25°C
0.60
-40°C
0.40
0.20
0.00
-0.20
-0.40
0
-20
-15
SINKING
-10
-5
0
5
10
OUTPUT CURRENT (mA)
15
SOURCING
20
0.1Hz to 10Hz VOUT NOISE
Band Pass Filter with 1 zero at .1Hz and 2 poles at 10 Hz
10µV/div
DELTA Vout (mV)
0.80
+25°C
1 Sec/div
5
FN8137.0
March 15, 2005
X60003B-50, X60003C-50, X60003D-50
TYPICAL PERFORMANCE CHARACTERISTIC CURVES
(VIN = 6.5V, IOUT = 0mA, TA = 25°C unless otherwise specified)
VOUT vs TEMPERATURE
Normalized to 25°C
(3 Representative Units)
5.0025
5.002
Unit 3, IIN = 700nA
Unit 1, IIN = 350nA
5.0015
5.001
Unit 2,
IIN = 500nA
VOUT (V)
5.0005
5
4.9995
4.999
4.9985
4.998
-40
-15
10
35
60
85
TEMPERATURE (°C)
PSRR vs CAP Load
0
No Load
-10
1nF Load
-20
-30
PSRR (dB)
10nF Load
-40
100nF Load
-50
-60
-70
-80
-90
-100
1
10
100
1000
10000
100000
1000000
FREQUENCY (Hz)
6
FN8137.0
March 15, 2005
X60003B-50, X60003C-50, X60003D-50
TYPICAL PERFORMANCE CHARACTERISTIC CURVES
(VIN = 6.5V, IOUT = 0mA, TA = 25°C unless otherwise specified)
50µA LOAD TRANSIENT RESPONSE
10mA LOAD TRANSIENT RESPONSE
CL = .001µF
100mV/DIV
500mV/DIV
CL = .001µF
IIN = -10mA
IIN = +10mA
IIN = -50µA
IIN = +50µA
500µSEC/DIV
2mSEC/DIV
LINE TRANSIENT RESPONSE
LINE TRANSIENT RESPONSE
200mV/DIV
CL = .001µF
200mV/DIV
CL = 0
VIN = -500mV
VIN = +500mV
VIN = -500mV
500µSEC/DIV
VIN = +500mV
500µSEC/DIV
MINIMUM VIN to VOUT DIFFERENTIAL
vs. OUTPUT CURRENT
0.45
+85°C
VIN to VOUT DIFFERENTIAL (V)
0.4
0.35
+25°C
0.3
0.25
0.2
-40°C
0.15
0.1
0.05
0
0
2
4
6
8
10
OUTPUT CURRENT (Sourcing mA)
7
FN8137.0
March 15, 2005
X60003B-50, X60003C-50, X60003D-50
TYPICAL PERFORMANCE CHARACTERISTIC CURVES
(VIN = 6.5V, IOUT = 0mA, TA = 25°C unless otherwise specified)
ZOUT vs FREQUENCY
180
no Load
160
1nF Load
140
10nF Load
ZOUT (Ω)
120
100
100nF Load
80
60
40
20
0
1
10
100
1000
10000
100000
FREQUENCY (Hz)
IIN vs VIN
700
-40°C
600
25°C
85°C
I IN (nA)
500
400
300
200
100
0
5
5.5
6
6.5
7
7.5
8
8.5
9
9.5
VIN (V)
8
FN8137.0
March 15, 2005
X60003B-50, X60003C-50, X60003D-50
TYPICAL PERFORMANCE CHARACTERISTIC CURVES
(VIN = 6.5V, IOUT = 0mA, TA = 25°C unless otherwise specified)
IIN vs VIN
(3 Representative Units)
900
Unit 1
800
700
I IN (nA)
600
Unit 2
500
Unit 3
400
300
200
100
0
5.0
6.0
7.0
8.0
9.0
10.0
VIN (V)
TURN-ON TIME
6
IIN = 500nA
VIN & VOUT (V)
5
4
3
2
1
0
0
2
4
6
8
10
12
TIME (mSec)
9
FN8137.0
March 15, 2005
X60003B-50, X60003C-50, X60003D-50
APPLICATIONS INFORMATION
FGA Technology
The X60003x-50 voltage reference uses the floating
gate technology to create references with very low drift
and supply current. Essentially the charge stored on a
floating gate cell is set precisely in manufacturing. The
reference voltage output itself is a buffered version of
the floating gate voltage. The resulting reference device
has excellent characteristics which are unique in the
industry: very low temperature drift, high initial accuracy, and almost zero supply current. Also, the reference voltage itself is not limited by voltage bandgaps or
zener settings, so a wide range of reference voltages
can be programmed (standard voltage settings are provided, but customer-specific voltages are available).
The process used for these reference devices is a
floating gate CMOS process, and the amplifier circuitry
uses CMOS transistors for amplifier and output transistor circuitry. While providing excellent accuracy,
there are limitations in output noise level and load regulation due to the MOS device characteristics. These
limitations are addressed with circuit techniques discussed in other sections.
Nanopower Operation
Reference devices achieve their highest accuracy
when powered up continuously, and after initial stabilization has taken place.
The X60003x-50 is the first high precision voltage reference with ultra low power consumption that makes it
practical to leave power-on continuously in battery
operated circuits. The X60003x-50 consumes
extremely low supply current due to the proprietary
FGA technology. Supply current at room temperature
is typically 500nA which is 1 to 2 orders of magnitude
lower than competitive devices. Application circuits
using battery power will benefit greatly from having an
accurate, stable reference which essentially presents
no load to the battery.
In particular, battery powered data converter circuits
that would normally require the entire circuit to be disabled when not in use can remain powered up
between conversions as shown in figure 1. Data acquisition circuits providing 12 to 24 bits of accuracy can
operate with the reference device continuously biased
with no power penalty, providing the highest accuracy
and lowest possible long term drift.
Other reference devices consuming higher supply currents will need to be disabled in between conversions
to conserve battery capacity. Absolute accuracy will
10
suffer as the device is biased and requires time to settle to its final value, or, may not actually settle to a final
value as power-on time may be short.
Figure 1.
VIN = +6-9V
10µF
0.01µF
VIN
VOUT
X60003x-50
GND
0.001µF
REF IN
Serial
Bus
Enable
SCK
SDAT
12 to 24-bit
A/D Converter
Board mounting Considerations
For applications requiring the highest accuracy, board
mounting location should be reviewed. Placing the
device in areas subject to slight twisting can cause
degradation of the accuracy of the reference voltage
due to die stresses. It is normally best to place the
device near the edge of a board, or the shortest side,
as the axis of bending is most limited at that location.
Obviously mounting the device on flexprint or
extremely thin PC material will likewise cause loss of
reference accuracy.
Noise Performance and Reduction:
The output noise voltage in a 0.1Hz to 10Hz
bandwidth is typically 30µVp-p. This is shown in the
plot in the Typical Performance Curves. The noise
measurement is made with a bandpass filter made of
a 1 pole high-pass filter with a corner frequency at
.1Hz and a 2-pole low-pass filter with a corner
frequency at 12.6Hz to create a filter with a 9.9Hz
bandwidth. Noise in the 10KHz to 1MHz bandwidth is
approximately 400µVp-p with no capacitance on the
output, as shown in Fig. 2 below. These noise
measurements are made with a 2 decade bandpass
filter made of a 1 pole high-pass filter with a corner
frequency at 1/10 of the center frequency and 1-pole
low-pass filter with a corner frequency at 10 times the
center frequency. Figure 2 also shows the noise in the
10KHz to 1MHz band can be reduced to about 50µVpp using a .001µF capacitor on the output. Noise in the
1KHz to 100KHz band can be further reduced using a
0.1µF capacitor on the output, but noise in the 1Hz to
100Hz band increases due to instability of the very low
power amplifier with a 0.1µF capacitance load. For
FN8137.0
March 15, 2005
X60003B-50, X60003C-50, X60003D-50
load capacitances above .001µF the noise reduction
network shown in fig. 3 is recommended. This network
reduces noise sig-nificantly over the full bandwidth. As
shown in fig. 2, noise is reduced to less than 40µVp-p
from 1Hz to 1MHz using this network with a .01µF
capacitor and a 2kΩ resistor in series with a 10µF
capacitor.
Figure 2.
X60003x-50 NOISE REDUCTION
Turn-On Time
The X60003x-50 device has ultra-low supply current
and thus the time to bias up internal circuitry to final
values will be longer than with higher power references. Normal turn-on time is typically 7ms. This is
shown in the graph, Figure 4. Since devices can vary
in supply current down to 300nA, turn-on time can last
up to about 12ms. Care should be taken in system
design to include this delay before measurements or
conversions are started.
400
CL = .001µF
X60003 TURN-ON TIME (25°C)
(3 Representative Units)
CL = .1µF
300
CL = .01µF & 10µF + 2kΩ
7
250
6
200
VIN & VOUT (V)
NOISE VOLTAGE (µVp-p)
Figure 4.
CL = 0
350
150
100
50
IIN = 500nA
5
IIN = 700nA
4
IIN = 350nA
3
2
1
0
1
10
100
1000
10000
100000
0
0
2
4
6
8
10
12
TIME (mSec)
Figure 3.
Temperature Coefficient
VIN = 6.5V
10µF
.1µF
VIN
VO
X60003x-50
GND
2kΩ
.01µF
10µF
11
The limits stated for temperature coefficient (tempco)
are governed by the method of measurement. The
overwhelming standard for specifying the temperature
drift of a reference is to measure the reference voltage
at two temperatures, take the total variation, (VHIGH VLOW), and divide by the temperature extremes of
measurement (THIGH - TLOW). The result is divided
by the nominal reference voltage (at T = 25°C) and
multiplied by 106 to yield ppm/°C. This is the “Box”
method for determining temperature coefficient.
FN8137.0
March 15, 2005
X60003B-50, X60003C-50, X60003D-50
TYPICAL APPLICATION CIRCUITS
Precision 5V, 50mA Reference.
6V to 9V
R = 200Ω
2N2905
VIN
X60003x-50
VOUT
5.0V/50mA
0.001µF
GND
±5.0V Dual Output, High Accuracy Reference
5.5V to 9V
0.1µF
VIN
X60003x-50
VOUT
5.0V
0.001µF
GND
VIN
R1 =
X60003x-50
VOUT
5.0V - | VIN |
; IOUT ≤ 10mA
-(IOUT)
0.001µF
GND
VIN = -5.5V to -9.0V
-5.0V
R1
Kelvin Sensed Load
5.5V to 9V
0.1µF
VIN
VOUT
X60003x-50
GND
12
+
VOUT Sense
–
Load
FN8137.0
March 15, 2005
X60003B-50, X60003C-50, X60003D-50
TYPICAL APPLICATION CIRCUITS
Negative Voltage Reference
X60003x-50
VIN
VOUT
GND
CIN 0.001
COUT = 0.001µF
-5.0V
R1 = 800Ω
VIN = -9V
R1 Limits max load current
with RI = 800Ω, ILOAD MAX = 4mA
R1 =
5.0V - | VIN |
-(IOUT)
5V Full Scale Low-Drift 10-bit Adjustable Voltage Source
5.5V to 9V
0.1µF
VIN
VOUT
X60003x-50
GND
0.001µF
VCC RH
X9119
2-Wire Bus
13
+
SDA
SCL
VSS
VOUT
–
VOUT
(buffered)
RL
FN8137.0
March 15, 2005
X60003B-50, X60003C-50, X60003D-50
PACKAGING INFORMATION
3-Lead Plastic, SOT-23, Package Code G3
0.007 (0.20)
B 0.0003 (0.08)
B
0.093 (2.35) BSC
0.046 (1.18) BSC
0.055 (1.40)
0.047 (1.20)
CL
4X
0.35 H A-B D
0.35 C A-B D
2X N/2 TIPS
2
1
0.075 (1.90) BSC
12° REF.
TYP.
0.120 (3.04)
0.110 (2.80)
0.034 (0.88)
0.047 (1.02)
0.038 (0.95)
BSC
Parting Line
Seating Plane
0.10 R MIN.
0.20 in
0.0004 (0.01)
0.0040 (0.10)
0.10 R MIN.
0.035 (0.89)
0.044 (1.12)
SEATING PLANE
.024 (0.60)
.016 (0.40)
0 - 8°C
NOTES:
1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
2. PACKAGE DIMENSIONS EXCLUDE MOLDING FLASH
3. DIE AND DIE PADDLE IS FACING DOWN TOWARDS SEATING PLANE
4. THIS PART IS COMPLIANT WITH JEDEC SPECIFICATION TO-236AB
5. DIMENSIONING AND TOLERANCES PER ASME, Y14.5M-1994
0.575 REF.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
14
FN8137.0
March 15, 2005