MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSOP−6 CASE 318G−02 ISSUE V 1 SCALE 2:1 D H ÉÉ ÉÉ 6 E1 1 NOTE 5 5 2 L2 4 GAUGE PLANE E 3 L b DETAIL Z e C SEATING PLANE DIM A A1 b c D E E1 e L L2 M c A 0.05 M DATE 12 JUN 2012 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D AND E1 ARE DETERMINED AT DATUM H. 5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE. A1 DETAIL Z MIN 0.90 0.01 0.25 0.10 2.90 2.50 1.30 0.85 0.20 0° MILLIMETERS NOM MAX 1.00 1.10 0.06 0.10 0.38 0.50 0.18 0.26 3.00 3.10 2.75 3.00 1.50 1.70 0.95 1.05 0.40 0.60 0.25 BSC 10° − STYLE 1: PIN 1. DRAIN 2. DRAIN 3. GATE 4. SOURCE 5. DRAIN 6. DRAIN STYLE 2: PIN 1. EMITTER 2 2. BASE 1 3. COLLECTOR 1 4. EMITTER 1 5. BASE 2 6. COLLECTOR 2 STYLE 3: PIN 1. ENABLE 2. N/C 3. R BOOST 4. Vz 5. V in 6. V out STYLE 4: PIN 1. N/C 2. V in 3. NOT USED 4. GROUND 5. ENABLE 6. LOAD STYLE 5: PIN 1. EMITTER 2 2. BASE 2 3. COLLECTOR 1 4. EMITTER 1 5. BASE 1 6. COLLECTOR 2 STYLE 6: PIN 1. COLLECTOR 2. COLLECTOR 3. BASE 4. EMITTER 5. COLLECTOR 6. COLLECTOR STYLE 7: PIN 1. COLLECTOR 2. COLLECTOR 3. BASE 4. N/C 5. COLLECTOR 6. EMITTER STYLE 8: PIN 1. Vbus 2. D(in) 3. D(in)+ 4. D(out)+ 5. D(out) 6. GND STYLE 9: PIN 1. LOW VOLTAGE GATE 2. DRAIN 3. SOURCE 4. DRAIN 5. DRAIN 6. HIGH VOLTAGE GATE STYLE 10: PIN 1. D(OUT)+ 2. GND 3. D(OUT)− 4. D(IN)− 5. VBUS 6. D(IN)+ STYLE 11: PIN 1. SOURCE 1 2. DRAIN 2 3. DRAIN 2 4. SOURCE 2 5. GATE 1 6. DRAIN 1/GATE 2 STYLE 12: PIN 1. I/O 2. GROUND 3. I/O 4. I/O 5. VCC 6. I/O STYLE 13: PIN 1. GATE 1 2. SOURCE 2 3. GATE 2 4. DRAIN 2 5. SOURCE 1 6. DRAIN 1 STYLE 14: PIN 1. ANODE 2. SOURCE 3. GATE 4. CATHODE/DRAIN 5. CATHODE/DRAIN 6. CATHODE/DRAIN STYLE 15: PIN 1. ANODE 2. SOURCE 3. GATE 4. DRAIN 5. N/C 6. CATHODE STYLE 16: PIN 1. ANODE/CATHODE 2. BASE 3. EMITTER 4. COLLECTOR 5. ANODE 6. CATHODE STYLE 17: PIN 1. EMITTER 2. BASE 3. ANODE/CATHODE 4. ANODE 5. CATHODE 6. COLLECTOR GENERIC MARKING DIAGRAM* RECOMMENDED SOLDERING FOOTPRINT* 6X 0.60 XXXAYWG G 1 6X 3.20 XXX A Y W G 0.95 PITCH DIMENSIONS: MILLIMETERS STATUS: ON SEMICONDUCTOR STANDARD 1 NEW STANDARD: TSOP−6 XXX = Specific Device Code M = Date Code G = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. 98ASB14888C © Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 Rev. 0 = Specific Device Code =Assembly Location = Year = Work Week = Pb−Free Package STANDARD (Note: Microdot may be in either location) *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: 1 IC 0.95 XXX MG G http://onsemi.com 1 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. Case Outline Number: PAGE 1 OFXXX 2 DOCUMENT NUMBER: 98ASB14888C PAGE 2 OF 2 ISSUE REVISION DATE B ADDED STYLE 2. REQ.BY A. PATEL. 05 MAY 1997 C ADDED STYLE 3. REQ.BY D. BOLDT, ADDED STYLE 4. REQ.BY UKO. 14 APR 1998 D ADDED STYLE 5. REQ.BY D. BOLDT. 13 MAY 1998 E ADDED STYLE 6. REQ.BY M. ATANOVICH. 17 NOV 1999 F MOTOROLA WAS NOT REMOVED FROM (STATUS) PAGES. PAGES NOT NUMBERED CORRECTLY. REV PAGE WAS MISSING. REQ.BY F. BLAKLEY. 22 NOV 1999 G ADDED STYLE 7. REQ.BY M. ATANOVICH. 15 DEC 1999 H ADDED STYLE 8. REQ.BY D. TRUHITTE. 11 MAY 2001 J ADDED NOTE 4. REQ. BY S. RIGGS. 26 JUN 2003 K ADDED STYLE 9. REQ.BY S. BACHMAN. 09 SEP 2003 L ADDED STYLE 10. REQ. BY A. TAM. 25 FEB 2004 M ADDED STYLE 11 AND 12. REQ. BY L. ROBINSON. 07 JUN 2004 N CORRECTED STYLE 11, PIN 4 SOURCE 2. REQ. BY C. CHENG . 03 FEB 2005 P ADDED NOMINAL VALUES AND UPDATED GENERIC MARKING DIAGRAM. REQ. BY HONG XIAO. 27 MAY 2005 R ADDED STYLE 13. REQ. BY J. CARTER. 09 MAR 2006 S ADDED STYLE 14. REQ. BY A. SAM. 22 MAR 2006 T ADDED STYLE 15. REQ. BY S. WINSTON. 06 FEB 2008 U ADDED DETAIL Z, REMOVED INCH VALUES, ADDED L2, ADDED NOTE 5. REQ. BY J. LETTERMAN. 14 JAN 2010 V ADDED STYLES 16 & 17. REQ. BY Y. 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This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2012 June, 2012 − Rev. V Case Outline Number: 318G