MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DFN10, 3x3, 0.5P CASE 485C ISSUE E SCALE 2:1 DATE 11 FEB 2016 D PIN ONE REFERENCE 2X 2X 0.15 C A B L L1 ÎÎÎ ÎÎÎ ÎÎÎ 0.15 C L ALTERNATE A−1 E ALTERNATE TERMINAL CONSTRUCTIONS TOP VIEW A1 (A3) DETAIL B ALTERNATE A−2 DETAIL A ÏÏ ÏÏ ÎÎ A A1 ALTERNATE CONSTRUCTIONS C D2 DETAIL A 10X 1 SEATING PLANE L A3 A1 5 DETAIL B WETTABLE FLANK OPTION CONSTRUCTION E2 K 10 6 10X e b 0.05 C NOTE 3 SOLDERING FOOTPRINT* 2.64 PACKAGE OUTLINE MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.18 0.30 3.00 BSC 2.40 2.60 3.00 BSC 1.70 1.90 0.50 BSC 0.19 TYP 0.35 0.45 0.00 0.03 GENERIC MARKING DIAGRAM* XXXXX XXXXX ALYWG G *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. 10X 0.55 1.90 DIM A A1 A3 b D D2 E E2 e K L L1 XXXXX = Specific Device Code A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) 0.10 C A B BOTTOM VIEW MOLD CMPD ALTERNATE B−2 DETAIL B 0.08 C SIDE VIEW ÏÏ ÏÏ ÎÎ EXPOSED Cu ALTERNATE B−1 0.10 C 10X A3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 5. TERMINAL b MAY HAVE MOLD COMPOUND MATERIAL ALONG SIDE EDGE. MOLD FLASHING MAY NOT EXCEED 30 MICRONS ONTO BOTTOM SURFACE OF TERMINAL b. 6. FOR DEVICE OPN CONTAINING W OPTION, DETAIL A AND B ALTERNATE CONSTRUCTION ARE NOT APPLICABLE. WETTABLE FLANK CONSTRUCTION IS DETAIL B AS SHOWN ON SIDE VIEW OF PACKAGE. 3.30 10X 0.30 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: 98AON03161D Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed STATUS: ON SEMICONDUCTOR STANDARD versions are uncontrolled except when stamped “CONTROLLED COPY” in red. NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 Case Outline Number: http://onsemi.com DFN10, 3X3 MM, 0.5 MM PITCH1 DESCRIPTION: October, 2002 − Rev. 0 PAGE 1 OFXXX 2 http://onsemi.com 1 DOCUMENT NUMBER: 98AON03161D PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION. 30 AUG 2000 A CHANGED TITLE AND REDREW CASE OUTLINE FORMAT. ADDED DETAILS A AND B. REQ. BY P. CELAYA 27 OCT 2005 B CHANGED DIMENSIONS D2 AND E2. ADDED GENERIC MARKING INFORMATION. REQ. BY J. LETTERMAN. 12 AUG 2008 C ADDED NOTE 7. REQ. BY B. MARQUIS. 23 MAY 2012 D REMOVED NOTE 6. MODIFIED DETAILS A AND B AND SOLDERING FOOTPRINT VALUES. REQ. BY I. HYLAND. 16 JUN 2015 E ADDED DETAIL B WETTABLE FLANK OPTION. REQ. BY B. LOFTS. 11 FEB 2015 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2016 February, 2016 − Rev. E Case Outline Number: 485C