MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC20 NB LESS PINS 2, 4 & 19 CASE 751BS−01 ISSUE O DATE 28 APR 2011 SCALE 1:1 0.10 C A-B NOTE 4 D NOTE 5 20 NOTE 4 E1 0.10 C A-B D A 11 L2 ÇÇÇÇ ÇÇÇÇ 1 NOTE 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.10 TOTAL IN EXCESS OF THE b DIMENSION. DIMENSION b APPLIES TO THE FLAT PORTION OF THE LEAD AND SHALL BE MEASURED BETWEEN 0.13 AND 0.25 FROM THE TIP. 4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS BUT DO INCLUDE MOLD MISMATCH. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15mm PER SIDE. DIMENSIONS D AND E1 ARE DETERMINED AT DATUM H. 5. DATUMS A AND B ARE TO BE DETERMINED AT DATUM H. 6. A1 IS DEFINED AS THE VERTICAL DISTANCE FROM THE SEAT ING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY. 7. CHAMFER FEATURE IS OPTIONAL. IF NOT PRESENT, THEN A PIN ONE IDENTIFIER MUST BE LOCATED IN THIS AREA. L E SEATING PLANE C M DETAIL A 10 e 17X B b 0.25 0.20 C C A-B D M NOTE 3 NOTE 7 h 0.10 C h DIM A A1 b c D E E1 e h L L2 M H 0.10 C A A1 C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE c 17X 0.85 DETAIL A GENERIC MARKING DIAGRAM* 20 XXXXXXXXXXXXG XXXXXXXXXXXXX AWLYWW 11 20 6.30 1 10 17X 0.53 1.00 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: STATUS: 98AON56699E ON SEMICONDUCTOR STANDARD 1 © Semiconductor Components Industries, LLC, 2000 February, 2000 − Rev. 05F NEW STANDARD: http://onsemi.com SOIC20 NB LESS PINS 2, 4 & 19 1 © Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 MILLIMETERS MIN MAX --1.70 0.00 0.20 0.31 0.51 0.10 0.25 9.90 BSC 6.00 BSC 3.90 BSC 1.00 BSC 0.25 0.50 0.40 0.85 0.25 BSC 0_ 8_ 1 XXXXX A WL YY WW G = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled exceptCase when stamped Outline Number: 751D “CONTROLLED COPY” in red. Case Outline Number: PAGE 1 OFXXX 2 DOCUMENT NUMBER: 98AON56699E PAGE 2 OF 2 ISSUE O REVISION RELEASED FOR PRODUCTION. REQ. BY I. CAMBALIZA DATE 28 APR 2011 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2011 April, 2011 − Rev. 01O Case Outline Number: 751BS