MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DFN18 6x5, 0.5P CASE 505−01 ISSUE D 18 DATE 17 NOV 2006 1 SCALE 2:1 NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS IN MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A D B PIN 1 LOCATION E 2X DIM A A1 A3 b D D2 E E2 e K L 0.15 C 2X 0.15 C TOP VIEW (A3) 0.10 C A 18X 0.08 C A1 MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.18 0.30 6.00 BSC 3.98 4.28 5.00 BSC 2.98 3.28 0.50 BSC 0.20 −−− 0.45 0.65 C SIDE VIEW SEATING PLANE GENERIC MARKING DIAGRAM* D2 18X 18X L e 1 1 9 XXXXXXXX XXXXXXXX AWLYYWW E2 K 18 10 b 0.10 C A B 18X BOTTOM VIEW 0.05 C NOTE 3 SOLDERING FOOTPRINT 5.30 18X 0.75 1 XXXXX A WL YY WW G = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. 0.50 PITCH 4.19 18X 0.30 3.24 DIMENSIONS: MILLIMETERS DOCUMENT NUMBER: 98AON11920D © Semiconductor Components Industries,ON LLC,SEMICONDUCTOR 2002 STATUS: STANDARD 1 November, 2002 − Rev. 01A NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 http://onsemi.com 18 PIN DFN, 6X5 MM. 0.5 MM PITCH 1 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed Outline Number: versions are uncontrolled exceptCase when stamped 505 “CONTROLLED COPY” in red. Case Outline Number: PAGE 1 OFXXX 2 DOCUMENT NUMBER: 98AON11920D PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED TO PRODUCTION. REQ. BY P. CHAN 12 SEP 2002 A MODIFIED SIDE VIEW TO 9 LEAD INSTEAD OF 8. REQ. BY P. CHAN 20 NOV 2002 B CHANGED DIM b AND L. REMOVED DIM A3. CORRECTED MARKING DIAGRAM. REQ. BY P. CELAYA. 29 JUN 2002 C ADDED SOLDERING FOOTPRINT. REQ. BY S. CLARK. 31 MAY 2006 D CORRECTED PITCH DIMENSION IN SOLDERING FOOTPRINT TO 0.50. REQ. BY D. TRUHITTE. 17 NOV 2006 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2006 November, 2006 − Rev. 01D Case Outline Number: 505