751BQ

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC−10 NB
CASE 751BQ
ISSUE B
10
1
SCALE 1:1
DATE 26 NOV 2013
2X
0.10 C A-B
D
D
A
2X
F
0.10 C A-B
10
6
H
E
1
5
0.20 C
10X
B
2X 5 TIPS
L2
b
0.25
A3
L
C
DETAIL A
M
SEATING
PLANE
C A-B D
TOP VIEW
10X
h
0.10 C
0.10 C
X 45 _
M
A
e
A1
C
SIDE VIEW
SEATING
PLANE
DETAIL A
END VIEW
DIM
A
A1
A3
b
D
E
e
H
h
L
L2
M
10
1.00
PITCH
1
1
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98AON52341E
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
SOIC−10 NB
XXXXX
ALYWX
G
XXXXX = Specific Device Code
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
*This information is generic. Please refer
to device data sheet for actual part
marking. Pb−Free indicator, “G”, may
or not be present.
6.50
10X 1.18
MILLIMETERS
MIN
MAX
1.25
1.75
0.10
0.25
0.17
0.25
0.31
0.51
4.80
5.00
3.80
4.00
1.00 BSC
5.80
6.20
0.37 REF
0.40
0.80
0.25 BSC
0_
8_
GENERIC
MARKING DIAGRAM*
RECOMMENDED
SOLDERING FOOTPRINT*
10X 0.58
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.10mm TOTAL IN EXCESS OF ’b’
AT MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15mm
PER SIDE. DIMENSIONS D AND E ARE DETERMINED AT DATUM F.
5. DIMENSIONS A AND B ARE TO BE DETERMINED AT DATUM F.
6. A1 IS DEFINED AS THE VERTICAL DISTANCE
FROM THE SEATING PLANE TO THE LOWEST
POINT ON THE PACKAGE BODY.
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON52341E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY M. RAMOS.
06 JUL 2010
A
CHANGED DIMENSION A MIN FROM 1.35 TO 1.25. REQ. BY HB TAN.
25 APR 2011
B
CHANGED DIMENSION L MAX FROM 1.27 TO 0.80 MM. REQ. BY C. TAN.
26 NOV 2013
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2013
November, 2013 − Rev. B
Case Outline Number:
751BQ