5962-14223

REVISIONS
LTR
DESCRIPTION
A
DATE (YR-MO-DA)
APPROVED
15-06-23
Charles F. Saffle
Table I: For operating frequency test, correct min and max limits for
non RHA subgroup 4 from “270” and “330” kHz to “260” and “370”
kHz, and correct min and max limits for non RHA subgroups 5 and 6
from “270” and “330” kHz to “240” and “390” kHz. -gc
REV
SHEET
REV
SHEET
REV STATUS
REV
A
A
A
A
A
A
A
A
A
A
A
A
A
OF SHEETS
SHEET
1
2
3
4
5
6
7
8
9
10
11
12
13
PMIC N/A
PREPARED BY
Greg Cecil
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
CHECKED BY
Greg Cecil
http://www.landandmaritime.dla.mil/
APPROVED BY
Charles F. Saffle
DRAWING APPROVAL DATE
14-08-25
REVISION LEVEL
A
MICROCIRCUIT, HYBRID, HIGH VOLTAGE,
SYNCHRONOUS, SWITCHING REGULATOR
CONTROLLER
SIZE
CAGE CODE
A
67268
SHEET
DSCC FORM 2233
APR 97
1 OF
5962-14223
13
5962-E384-15
1. SCOPE
1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A
choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When
available, a choice of radiation hardness assurance levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962



Federal
stock class
designator
\
F



RHA
designator
(see 1.2.1)
14223
01



Device
type
(see 1.2.2)
/
K



Device
class
designator
(see 1.2.3)
X



Case
outline
(see 1.2.4)
A



Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices meet the MIL-PRF-38534 specified RHA levels
and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device types. The device types identify the circuit function as follows:
Device type
Generic number
01
MSK 5055-1
02
MSK 5055-2
Circuit function
Radiation hardened, reverse current mode disabled, high
voltage, switching regulator controller
Radiation hardened, reverse current mode enabled, high
voltage, switching regulator controller
1.2.3 Device class designator. This device class designator is a single letter identifying the product assurance level. All
levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and
E) or QML Listing (Class G and D). The product assurance levels are as follows:
Device class
Device performance documentation
K
Highest reliability class available. This level is intended for use in space
applications.
H
Standard military quality class level. This level is intended for use in applications
where non-space high reliability devices are required.
G
Reduced testing version of the standard military quality class. This level uses the
Class H screening and In-Process Inspections with a possible limited temperature
range, manufacturer specified incoming flow, and the manufacturer guarantees (but
may not test) periodic and conformance inspections (Group A, B, C, and D).
E
Designates devices which are based upon one of the other classes (K, H, or G)
with exception(s) taken to the requirements of that class. These exception(s) must
be specified in the device acquisition document; therefore the acquisition document
should be reviewed to ensure that the exception(s) taken will not adversely affect
system performance.
D
Manufacturer specified quality class. Quality level is defined by the manufacturers
internal, QML certified flow. This product may have a limited temperature range.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-14223
A
REVISION LEVEL
A
SHEET
2
1.2.4 Case outline. The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
X
Y
See figure 1
See figure 1
16
16
Package style
Flat pack with straight leads
Flat pack with gull wing leads
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 1/
Input voltage (VIN) .......................................................................................
Boost Voltage (BOOST)..............................................................................
SW Voltage .................................................................................................
SW-Boost differential voltage......................................................................
Sync, VC, VFB, CSS and SHDN pin voltages.............................................
SHDN pin current ........................................................................................
VCC voltage .................................................................................................
SENSE + SENSE - .....................................................................................
SENSE + SENSE – differential voltage ......................................................
Junction temperature (TJ) ...........................................................................
Thermal resistance, junction-to-case (TC = +125°C) ...................................
Storage temperature ...................................................................................
Lead temperature (soldering, 10 seconds) .................................................
65 V dc
80 V
65 V, -2 V 2/
24 V
5V
1 mA
24 V
40 V
+/- 1 V
+150°C
5.6º C/W
-65°C to +150°C
+300°C
1.4 Recommended operating conditions.
Input voltage range (VIN) .............................................................................
Case operating temperature range (TC) ......................................................
+4 V dc to +65 V dc
-55°C to +125°C
1.5 Radiation features. 3/ 4/
Maximum total dose available (dose rate = 50 - 300 rads(Si)/s).................
Neutron irradiation (1 MeV equivalent neutrons) ........................................
300 krads(Si)
5/
11
2
5 x 10 n/cm
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines.
1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ The -2 V SW rating is a transient condition only. It is guaranteed by design, but not tested.
3/ See 4.3.5 for the manufacturers radiation hardness assurance analysis and testing
4/ Devices on this SMD have not been characterized for Enhanced Low Dose Radiation Sensitivity (ELDRS).
5/ A representative device has been high dose rate tested using condition A of Method 1019 of MIL-STD-883 to 300 krads(Si)
to ensure RHA designator level “F”.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-14223
A
REVISION LEVEL
A
SHEET
3
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at http://quicksearch.dla.mil or from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The
manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as
defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not
affect the form, fit, or function of the device for the applicable device class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38534 and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Radiation exposure circuits. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the qualifying and acquiring activity upon request.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking of devices. Marking of devices shall be in accordance with MIL-PRF-38534. The device shall be marked with
the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample,
for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those
which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be
made available to the preparing activity (DLA Land and Maritime-VA) upon request.
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime-VA shall affirm that the
manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein.
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
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APR 97
SIZE
5962-14223
A
REVISION LEVEL
A
SHEET
4
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/ 2/
-55°C ≤ TC ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
type
Limits
Min
Minimum input start
voltage
VIN
1,2,3
01,02
Voltage input UVLO
threshold (falling)
VINUVLO
1, 2, 3
01,02
L,R 3/
1
L,R,F 3/
Unit
Max
7.5
V
3.6
4
V
3.55
4
3.45
4
VCC supply current
VCCsupply
1,2,3
01,02
VCC current limit
VCCLIMIT
1,2,3
01,02
40
Error amp reference
voltage
VREF
1
01,02
1.224
1.238
2, 3
1.215
1.245
1
1.200
1.238
1.173
1.238
1.3
1.4
1.25
1.4
90
115
90
115
84
115
260
370
5,6
240
390
L,R 3/
4
255
330
L,R,F 3/
4
250
330
VC = VFB
L,R 3/
L,R,F 3/
Shutdown enable
threshold (rising)
SHDN
1,2, 3
L,R,F 3/
Current limit sense
voltage
VSENSE
6.0
01,02
1
(VSENSE+) – (VSENSE-), VFB = 0 v
1,2,3
L,R 3/
01,02
1
L,R,F 3/
Operating frequency
FREQop
Reset = 49 KΩ
4
01,02
mA
mA
V
V
mV
kHz
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-14223
A
REVISION LEVEL
A
SHEET
5
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/ 2/
-55°C ≤ TC ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
type
Limits
Min
Unit
Max
Programmable
frequency range
FREQ
FSW ≤ 100 kHz at RSET = 232 KΩ
FSW ≥ 500 kHz at RSET = 22.1 KΩ
7,8a,8b
01,02
Pass
Pass/
Fail
External sync
frequency range
Syncext
100 kHz ≤ FSYNC ≤ 600 kHz
7,8a,8b
01,02
Pass
Pass/
Fail
Sync voltage threshold
SyncTHR
1,2,3
01,02
2
V
Minimum TG off time
MinOFF
4,5,6
01,02
650
nS
Minimum TG on time
MinON
4,5,6
01,02
400
nS
1/ A representative device has been high dose rate tested using condition A of Method 1019 of MIL-STD-883 to 300 krads(Si)
to ensure RHA designator level “F”. Pre and post irradiation limits are identical unless otherwise specified.
2/ VIN = 20 V, VCC = BOOST = 10 V, SHDN > 2 V, RSET = 49.9 KΩ, SENSE- = SENSE+ = 10 V, SGND = PGND = SW = SYNC
= 0 V.
3/ Device types 01 and 02 have been characterized through all levels L, R, and F of irradiation. However,
device types 01 and 02 are tested at 1X times the F level. Pre and post irradiation values are identical unless
otherwise specified in table I. When performing post irradiation electrical measurements for any RHA level, TC = +25ºC.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-14223
A
REVISION LEVEL
A
SHEET
6
Case outline X.
Symbol
A
A1
b
c
D
E
e
e1
L1
S1
Millimeters
Min
Max
--2.92
0.81
1.32
0.30
0.46
0.20
0.30
9.27
9.78
12.45
12.95
1.27 TYP
8.76
9.02
10.16
--1.91 REF
Inches
Min
Max
--.115
.032
.052
.012
.018
.008
.012
.365
.385
.490
.510
.050 TYP
.345
.355
.400
--.075 REF
NOTES:
1. The U. S. Government preferred system of measurement is the metric SI. This item was designed using inch-pound
units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the
inch-pound units shall take precedence.
2. Pin numbers are for reference only.
3. Case outline X weight: 1.5 grams typical.
FIGURE 1. Case outlines.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
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A
REVISION LEVEL
A
SHEET
7
Case outline Y.
Symbol
A
A1
b
c
D
E
D1
e
e1
L1
L2
S1
Millimeters
Min
Max
--2.92
0.20
0.46
0.30
0.46
0.20
0.30
9.27
9.78
12.45
12.95
13.97
15.24
1.27 TYP
8.76
9.02
1.27 REF
1.14
1.40
1.91 REF
Inches
Min
Max
--.115
.008
.018
.012
.018
.008
.012
.365
.385
.490
.510
.550
.600
.050 TYP
.345
.355
.050 REF
0.045
0.055
.075 REF
NOTES:
1. The U. S. Government preferred system of measurement is the metric SI. This item was designed using inch-pound
units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the
inch-pound units shall take precedence.
2. Pin numbers are for reference only.
3. Case outline Y weight: 1.5 grams typical.
FIGURE 1. Case outlines - Continued.
STANDARD
MICROCIRCUIT DRAWING
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DSCC FORM 2234
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REVISION LEVEL
A
SHEET
8
Device type
01 and 02
Case outlines
X and Y
Terminal number
Terminal symbol
1
VIN
2
SHDN
3
CSS
4
SGND
5
VFB
6
VC
7
SYNC
8
FSET
9
SENSE-
10
SENSE+
11
PGND
12
BG
13
VCC
14
SW
15
TG
16
BOOST
CASE
ISOLATED
FIGURE 2. Terminal connections.
STANDARD
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REVISION LEVEL
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9
TABLE II. Electrical test requirements.
MIL-PRF-38534 test requirements
Subgroups
(in accordance with
MIL-PRF-38534, group A
test table)
Interim electrical parameters
1
Final electrical parameters
1*, 2, 3, 4, 5, 6, 7, 8A, 8B
Group A test requirements
1*, 2, 3, 4, 5, 6, 7, 8A, 8B
Group C end-point electrical
parameters
1*, 2, 3, 4, 5, 6, 7, 8A, 8B
End-point electrical parameters
for radiation hardness assurance
(RHA) devices
1, 4, 7
* PDA applies to subgroup 1.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form,
fit, or function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply:
a.
b.
Burn-in test, method 1015 of MIL-STD-883.
(1)
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to either DLA Land and Maritime-VA or the acquiring activity upon request.
Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance
with the intent specified in method 1015 of MIL-STD-883.
(2)
TC = +125°C minimum.
Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance
with MIL-PRF-38534 and as specified herein.
4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows:
a.
Tests shall be as specified in table II herein.
b.
Subgroups 9, 10, and 11 shall be omitted.
4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534.
STANDARD
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REVISION LEVEL
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10
4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows:
a.
End-point electrical parameters shall be as specified in table II herein.
b.
Steady-state life test, method 1005 of MIL-STD-883.
(1)
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to either DLA Land and Maritime-VA or the acquiring activity upon request.
Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance
with the intent specified in method 1005 of MIL-STD-883.
(2)
TC = +125°C minimum.
(3)
Test duration: 1,000 hours minimum as specified in 1005 of MIL-STD-883.
4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534.
4.3.5 Radiation Hardness Assurance (RHA). RHA qualification is required for those devices with the RHA designator as
specified herein. See table IIIA and IIIB.
Table IIIA. Radiation Hardness Assurance Methods Table.
RHA
method
Employed
Testing at rated
total dose of
300 krads(Si)
Element
Hybrid
Level
Device
Level
1X 1/
1X
Worst Case Analysis
Not Performed
Includes
Combines
temperature temperature and
effects
radiation effects
No
No
End point electrical tests
after total dose
Combines End-of-life Element Level Hybrid device
total dose
level
and
displacement
effects
No
No
TC = +25ºC
TC = +25ºC
1/ Elements tested at the hybrid level, since there is only one active element in the device.
Table IIIB. Hybrid level and element level test table.
M.S. Kennedy
SMD 596214223
Hybrid Level
Testing
Radiation Test
Total Dose
Neutron
Low Dose High Dose
ELDRS
Displacement
Rate
Rate (HDR) Characterization Damage (DD)
Not
Tested
Element Level
Testing 1/
Bipolar Linear
or Mixed Signal
Tested
(300 krads)
No
Tested11
(5 x 102
n/cm )
Not
X
Tested (hybrid level
test)
No
Tested
(hybrid level
test)
1/ Elements tested at the hybrid level, since there is only one active element in the device.
STANDARD
MICROCIRCUIT DRAWING
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DSCC FORM 2234
APR 97
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REVISION LEVEL
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SHEET
11
4.3.5.1 Radiation Hardness Assurance (RHA) inspection. RHA qualification is required for those devices with the RHA
designator as specified herein. End-point electrical parameters for radiation hardness assurance (RHA) devices shall be
specified in table II. Radiation testing will be in accordance with the qualifying activity (DLA Land and Maritime -VQ) approved
plan and with MIL-PRF-38534, Appendix G.
a.
The hybrid device manufacturer shall establish procedures controlling element radiation testing, and shall establish
radiation test plans used to implement element lot qualification during procurement. Test plans and test reports shall
be filed and controlled in accordance with the manufacturer's configuration management system.
b.
The hybrid device manufacturer shall oversee element lot qualification, and monitor design changes for continued
compliance to RHA requirements.
4.3.5.1.1 Hybrid level radiation qualification.
4.3.5.1.1.1 Qualification by similarity. Device type 5962F1422301HXA was initially subjected to neutron and TID testing . All
other devices on this SMD contain the same active element and are considered similar for the purpose of RHA testing.
4.3.5.1.1.2 Total ionizing dose characterization testing. A representative device is characterized and tested, initially and after
any design or process changes which may affect the RHA response. Devices are tested at High Dose Rate (HDR) in
accordance with condition A of method 1019 of MIL-STD-883 to 300 krads(Si). 0.9900/90% statistics are applied to the device
parameter degradations, which are compared against Table I herein. A minimum of 8 devices (4 biased and 4 unbiased) shall
be tested.
4.3.5.1.1.3 Neutron testing. A representative device is characterized and tested initially, and after design or process changes
that may affect the RHA response. The device is tested in accordance with Method 1017 of MIL-STD-883. Five samples shall
be tested. The end point electrical values of the five samples will be compared to the limits specified in table I herein.
4.3.5.1.2 Element level radiation qualification. Elements are tested at the hybrid level since this device contains only one
active element.
4.3.5.2 Radiation lot acceptance. Each wafer lot of active elements shall be evaluated for acceptance in accordance with the
approved plan and MIL-PRF-38534 Appendix G.
4.3.5.2.1 Total Ionizing Dose. Every wafer lot of the active element will be RLAT (Radiation Lot Acceptance Testing) tested In
accordance with 4.3.5.1.1.2. Alternatively, active element manufacturer TID data from the wafer lot may be evaluated for
acceptance per 4.3.5.1.1.2.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated as specified in MIL-PRF38534.
6.4 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires
configuration control and the applicable SMD. DLA Land and Maritime will maintain a record of users and this list will be used
for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962)
should contact DLA Land and Maritime-VA, telephone (614) 692-8108.
6.5 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3990,
or telephone (614) 692-1081.
STANDARD
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DSCC FORM 2234
APR 97
SIZE
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A
REVISION LEVEL
A
SHEET
12
6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK-103
and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DLA Land and Maritime-VA and have agreed to
this drawing.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
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A
REVISION LEVEL
A
SHEET
13
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 15-06-23
Approved sources of supply for SMD 5962-14223 listed below for immediate acquisition information only and shall be
added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be revised
to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate
of compliance has been submitted to and accepted by DLA Land and Maritime-VA. This information bulletin is
superseded by the next dated revisions of MIL-HDBK-103 and QML-38534. DLA Land and Maritime maintains an
online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962F1422301HXA
5962F1422301HXC
5962F1422301HYA
5962F1422301HYC
5962F1422301KXA
5962F1422301KXC
5962F1422301KYA
5962F1422301KYC
31597
31597
31597
31597
31597
31597
31597
31597
MSK 5055-1HRHS
MSK 5055-1HRHS
MSK 5055-1HRHGW
MSK 5055-1HRHGW
MSK 5055-1KRHS
MSK 5055-1KRHS
MSK 5055-1KRHGW
MSK 5055-1KRHGW
5962F1422302HXA
5962F1422302HXC
5962F1422302HYA
5962F1422302HYC
5962F1422302KXA
5962F1422302KXC
5962F1422302KYA
5962F1422302KYC
31597
31597
31597
31597
31597
31597
31597
31597
MSK 5055-2HRHS
MSK 5055-2HRHS
MSK 5055-2HRHGW
MSK 5055-2HRHGW
MSK 5055-2KRHS
MSK 5055-2KRHS
MSK 5055-2KRHGW
MSK 5055-2KRHGW
1/
2/
The lead finish shown for each PIN representing a hermetic
package is the most readily available from the manufacturer
listed for that part. If the desired lead finish is not listed
contact the Vendor to determine its availability.
Caution. Do not use this number for item acquisition. Items
acquired to this number may not satisfy the performance
requirements of this drawing.
Vendor CAGE
number
31597
Vendor name
and address
Anaren Microwave Inc - MSK Products
6635 Kirkville Road
East Syracuse, NY 13057
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.