5962-9750901QPA SMD

REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
A
Drawing updated to reflect current requirements. – gt
02-12-30
R. Monnin
B
Add Group A subgroups 5 and 6 to delay time test as specified in table I. – gt
03-02-13
R. Monnin
11-07-19
C. Saffle
Under Table I, for all tPLH, tPHL, and tW tests, replace subgroup 4 with
C
subgroup 9. Under Table I, for tD test, replace subgroups 4, 5, 6, with
subgroups 9, 10, 11. Under Table II, delete subgroups 5, 6, and replace with
subgroups 9, 10, 11. Update boilerplate paragraphs to current MIL-PRF-38535
requirements. - ro
REV
SHEET
REV
C
SHEET
15
REV STATUS
REV
C
C
C
C
C
C
C
C
C
C
C
C
C
C
OF SHEETS
SHEET
1
2
3
4
5
6
7
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9
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11
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13
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PMIC N/A
PREPARED BY
RICK OFFICER
STANDARD
MICROCIRCUIT
DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
CHECKED BY
RAJESH PITHADIA
APPROVED BY
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
RAYMOND MONNIN
DRAWING APPROVAL DATE
97-03-17
REVISION LEVEL
C
MICROCIRCUIT, LINEAR, MICROPOWER
SUPPLY VOLTAGE SUPERVISORS,
MONOLITHIC SILICON
SIZE
CAGE CODE
A
67268
SHEET
DSCC FORM 2233
APR 97
5962-97509
1 OF 15
5962-E400-11
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part
or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
-
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
01
Q
P
A
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
97509
/
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
Generic number
01
Circuit function
TLC7733
Micropower supply voltage supervisors
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
Device requirements documentation
M
Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Q or V
Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
P
2
Descriptive designator
Terminals
GDIP1-T8 or CDIP2-T8
CQCC1-N20
8
20
Package style
Dual-in-line
Square leadless chip carrier
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
STANDARD
MICROCIRCUIT DRAWING
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A
REVISION LEVEL
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SHEET
2
1.3 Absolute maximum ratings. 1/ 2/ 3/
Supply voltage (VDD) ...................................................................................... +7.0 V dc
Input voltage range, CONTROL, RESIN , SENSE .......................................... -0.3 V dc to +7.0 V dc
Low output current (IOL) .................................................................................. 10 mA
High output current (IOH) ................................................................................ -10 mA
Input clamp current (IIK) (VIN  0.0 V or VIN  VDD) ....................................... 10 mA
Output clamp current (IOK) (VOUT  0.0 V or VOUT  VDD) ............................ 10 mA
Continuous total power dissipation (PD) (TA  +25C) .................................... 500 mW
Junction temperature (TJ) ............................................................................... +175C
Storage temperature range ............................................................................. -65C to +150C
Thermal resistance, junction-to-case (JC) ..................................................... See MIL-STD-1835
Thermal resistance, junction-to-ambient (JA):
Case P ......................................................................................................... 180C/W
Case 2 ......................................................................................................... 65C/W
1.4 Recommended operating conditions.
Supply voltage range (VDD) ............................................................................ +2.0 V dc to +6.0 V dc
Input voltage range (VIN) ................................................................................ 0 V to VDD
High level input voltage at RESIN and CONTROL (VIH) ................................ 0.7 V x VDD minimum 4/
Low level input voltage at RESIN and CONTROL (VIL) ................................. 0.2 V x VDD maximum 4/
High level output current (IOH) (VDD  2.7 V) ................................................. -2 mA maximum
Low level output current (IOL) (VDD  2.7 V) ................................................... 2 mA maximum
Input transition rise and fall rate at RESIN and CONTROL (t / V) .............. 100 ns/V maximum
Operating free air ambient temperature range (TA) ........................................ -55C to +125C
_____
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ Unless otherwise noted, all voltages are referenced to GND.
3/ The limits for the parameters specified herein shall apply over the full specified VDD range and ambient temperature
range of -55C to +125C.
4/ To ensure a low supply current, VIL should be kept  0.3 V and VIH  VDD - 0.3 V.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-97509
A
REVISION LEVEL
C
SHEET
3
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth table. The truth table shall be as specified on figure 2.
3.2.4 Logic diagrams. The logic diagram shall be as specified on figure 3.
3.2.5 Timing diagrams. The timing diagrams shall be as specified on figure 4.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-97509
A
REVISION LEVEL
C
SHEET
4
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN is not feasible due to space limitations, the manufacturer has the
option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked.
Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in
accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of
supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of
MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime -VA of change of
product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime’s agent,
and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore
documentation shall be made available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 95 (see MIL-PRF-38535, appendix A).
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
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DSCC FORM 2234
APR 97
SIZE
5962-97509
A
REVISION LEVEL
C
SHEET
5
TABLE I. Electrical performance characteristics.
Test
Symbol
Group A
subgroups
Conditions 1/
-55C  TA  +125C
unless otherwise specified
Device
type
Limits
Min
High level output voltage
Low level output voltage
Negative going input 2/
VOH
VOL
-VIT
VDD = 2.0 V, IOH = -20 A
1,2,3
01
2.3
VDD = 4.5 V, IOH = -20 A
4.2
VDD = 4.5 V, IOH = -2 mA
3.6
1,2,3
Max
1.7
VDD = 2.7 V, IOH = -20 A
VDD = 2.0 V, IOL = 20 A
Unit
01
V
0.2
VDD = 2.7 V, IOL = 20 A
0.2
VDD = 4.5 V, IOL = 20 A
0.2
VDD = 4.5 V, IOL = 2 mA
0.5
VDD = 2 V to 6 V
1
threshold voltage, SENSE
01
2,3
2.86
3.0
2.86
3.1
V
V
Power up reset voltage 3/
VRES
IOL = 20 A
1,2,3
01
1.0
V
Input current at RESIN pin
IIN
VIN = 0 V to VDD
1,2,3
01
2.0
A
Input current at CONTROL
pin
IIN
VIN = VDD
1,2,3
01
15.0
A
Input current at SENSE pin
IIN
VIN = 5 V
1,2,3
01
10.0
A
Supply current
IS
RESIN = VDD,
1,2,3
01
16
A
1
01
150
A
Supply current during time
delay
IDD
SENSE = VDD  VIT max +
0.2 V, CONTROL = 0 V,
outputs open
RESIN = VDD, VCT = 0 V,
VDD= 5 V, SENSE = VDD,
CONTROL = 0 V, outputs
open
Input capacitance, SENSE
CIN
2,3
4
VIN = 0 V to VDD
250
01
50
pF
See footnotes at end of table.
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REVISION LEVEL
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SHEET
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TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Functional test
Delay time
Group A
subgroups
Conditions 1/
-55C  TA  +125C
unless otherwise specified
See 4.4.1c
tD
RL = 2 k, CL = 50 pF
VIN (SENSE)  +VIT to
CONTROL = 0.4 V,
RESET and RESET
CT = 100 nF, VDD = 5.0 V,
Device
type
Limits
Unit
Min
Max
7,8
01
L
H
9,10,11
01
1.1
4.2
ms
9
01
24
s
RESIN = 2.7 V
Propagation delay time,
tPLH
VDD = 5.0 V, 4/
RL = 2 k, CL = 50 pF,
SENSE to RESET
tPHL
7
VIH = +VIT max + 0.2 V,
VIL = -VIT max - 0.2 V,
Propagation delay time,
tPLH
CONTROL = 0.4 V,
SENSE to RESET
tPHL
RESIN = 2.7 V,
9
01
s
7
24
CT = NC
Propagation delay time,
tPLH
VDD = 5.0 V, 4/
RESIN to RESET
tPHL
RL = 2 k, CL = 50 pF,
9
01
24
s
60
ns
65
ns
24
s
58
ns
VIH = 2.7 V, VIL = 0.4 V,
Propagation delay time,
tPLH
SENSE = +VIT max + 0.2 V
RESIN to RESET
tPHL
CONTROL = 0.4 V,
9
01
CT = NC
Propagation delay time,
tPLH
CONTROL to RESET
9
VDD = 5.0 V, 4/
01
RL = 2 k, CL = 50 pF,
VIH = 2.7 V, VIL = 0.4 V,
tPHL
58
SENSE = +VIT max +0.2 V
RESIN = 2.7 V,
CT = NC
See footnotes at end of table.
STANDARD
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DSCC FORM 2234
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REVISION LEVEL
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SHEET
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TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Group A
subgroups
Conditions 1/
-55C  TA  +125C
unless otherwise specified
Device
type
Limits
Min
Low level minimum pulse
tW
duration, SENSE
Low level minimum pulse
duration, RESIN
9
VIH = VIT max + 0.2 V,
01
Unit
Max
3
s
1
s
VIL = VIT min - 0.2 V
tW
9
VIL = 0.4 V,
VIH = 2.7 V
1/
All characteristics are measured with CT = 0.1 F, unless otherwise specified.
2/
To ensure best stability of the threshold voltage, a bypass capacitor (ceramic 0.1 F) should be placed near the
supply terminals.
3/
The lowest supply voltage at which RESET becomes active.
4/
NC equal no capacitor and includes up to 100 pF probe and jig capacitance.
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Device type
01
Case outlines
P
Terminal number
2
Terminal symbol
1
CONTROL
NC
2
RESIN
CONTROL
3
CT
NC
4
GND
NC
5
RESET
RESIN
6
RESET
NC
7
SENSE
CT
8
VDD
NC
9
---
NC
10
---
GND
11
---
NC
12
---
RESET
13
---
NC
14
---
NC
15
---
RESET
16
---
NC
17
---
SENSE
18
---
NC
19
---
NC
20
---
VDD
NC = No connection.
FIGURE 1. Terminal connections.
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CONTROL
RESIN
VIN (SENSE)  +VIT
RESET
RESET
L
L
False
H
L
L
L
True
H
L
L
H
False
H
L
L
H
True
L 1/
H 1/
H
L
False
H
L
H
L
True
H
L
H
H
False
H
L
H
H
True
H
H 1/
1/ RESET and RESET states shown are valid for time  time delay.
FIGURE 2. Truth table.
NOTE: Outputs are totem pole configuration. External pull up or pull down resistors are not required.
FIGURE 3. Logic diagram.
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NOTES:
1. For switching characteristics, RL = 2 k.
2. CL = 50 pF includes jig and probe capacitance.
FIGURE 4. Timing waveforms.
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FIGURE 4. Timing waveforms - Continued.
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4. VERIFICATION
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in
accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
4.2.1 Additional criteria for device class M.
a.
Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition B or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
(2) TA = +125C, minimum.
b.
Interim and final electrical test parameters shall be as specified in table II herein.
4.2.2 Additional criteria for device classes Q and V.
a.
The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under
document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
b.
Interim and final electrical test parameters shall be as specified in table II herein.
c.
Additional screening for device class V beyond the requirements of device class Q shall be as specified in
MIL-PRF-38535, appendix B.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups
A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with
MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for
device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed
for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections
(see 4.4.1 through 4.4.4).
4.4.1 Group A inspection.
a.
Tests shall be as specified in table II herein.
b.
Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted.
c.
For device class M, subgroups 7 and 8 tests shall be sufficient to verify the truth table. For device classes Q and V,
subgroups 7 and 8 shall include verifying the functionality of the device.
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TABLE II. Electrical test requirements.
Test requirements
Interim electrical
parameters (see 4.2)
Final electrical
parameters (see 4.2)
Group A test
requirements (see 4.4)
Group C end-point electrical
parameters (see 4.4)
Group D end-point electrical
parameters (see 4.4)
Group E end-point electrical
parameters (see 4.4)
Subgroups
(in accordance with
MIL-PRF-38535, table III)
Subgroups
(in accordance with
MIL-STD-883,
method 5005, table I)
Device
class M
---
Device
class Q
---
1,2,3,4,5,6,7,8, 1/
9,10,11
1,2,3,4,7,8,9,10,11
Device
class V
---
1,2,3
1,2,3,4,7,8, 1/
9,10,11
1,2,3,4,7,8,
9,10,11
1,2,3
1,2,3,4,7,8, 2/
9,10,11
1,2,3,4,7,8,
9,10,11
1,2,3
1,2,3
1,2,3
1,2,3
---
---
---
1/ PDA applies to subgroup 1.
2/ PDA applies to subgroups 1 and 7.
4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein.
4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:
a.
Test condition B or D. The test circuit shall be maintained by the manufacturer under document revision level control
and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs,
outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of
MIL-STD-883.
b.
TA = +125C, minimum.
c.
Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,
or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The
test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of
MIL-STD-883.
STANDARD
MICROCIRCUIT DRAWING
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DSCC FORM 2234
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REVISION LEVEL
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SHEET
14
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein.
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured
(see 3.5 herein).
a.
End-point electrical parameters shall be as specified in table II herein.
b.
For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as
specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to
radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device
classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25C 5C,
after exposure, to the subgroups specified in table II herein.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes
Q and V or MIL-PRF-38535, appendix A for device class M.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor
prepared specification or drawing.
6.1.2 Substitutability. Device class Q devices will replace device class M devices.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.3 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires
configuration control and which SMD's are applicable to that system. DLA Land and Maritime will maintain a record of users and
this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic
devices (FSC 5962) should contact DLA Land and Maritime -VA, telephone (614) 692-0544.
6.4 Comments. Comments on this drawing should be directed to DLA Land and Maritime -VA, Columbus, Ohio 43218-3990,
or telephone (614) 692-0540.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-HDBK-1331.
6.6 Sources of supply.
6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535.
The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DLA Land and Maritime -VA and
have agreed to this drawing.
6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103.
The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been
submitted to and accepted by DLA Land and Maritime -VA.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-97509
A
REVISION LEVEL
C
SHEET
15
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 11-07-19
Approved sources of supply for SMD 5962-97509 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DLA Land and Maritime -VA. This information
bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime
maintains an online database of all current sources of supply at
http://www.dscc.landandmaritime.mil/Programs/Smcr/.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-9750901QPA
01295
TLC7733MJGB
5962-9750901Q2A
01295
TLC7733MFKB
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
Vendor CAGE
number
01295
Vendor name
and address
Texas Instruments, Inc.
Semiconductor Group
8505 Forest Lane
P.O. Box 660199
Dallas, TX 75243
Point of contact: U.S. Highway 75 South
P.O. Box 84, M/S 853
Sherman, TX 75090-9493
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.