Data Sheet

PESD5V0S1UA; PESD12VS1UA
Unidirectional ESD protection for transient voltage
suppression
Rev. 01 — 9 February 2009
Product data sheet
1. Product profile
1.1 General description
Unidirectional ElectroStatic Discharge (ESD) protection diodes in a very small
Surface-Mounted Device (SMD) plastic package designed to protect one signal line
from the damage caused by ESD and transient overvoltage.
Table 1.
Product overview
Type number
PESD5V0S1UA
Package
Configuration
NXP
JEITA
SOD323
SC-76
single
PESD12VS1UA
1.2 Features
n Transient Voltage Suppression (TVS)
protection of one line
n Max. peak pulse power: PPP = 890 W
n Low clamping voltage: VCL = 19 V
n Low leakage current: IRM = 300 nA
n ESD protection up to 30 kV
n IEC 61000-4-2; level 4 (ESD)
n IEC 61000-4-5 (surge); IPP = 47 A
n AEC-Q101 qualified
1.3 Applications
n Computers and peripherals
n Audio and video equipment
n Cellular handsets and accessories
n Communication systems
n Portable electronics
n Medical and industrial equipment
1.4 Quick reference data
Table 2.
Quick reference data
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
VRWM
reverse standoff voltage
Cd
Conditions
Min
Typ
Max
Unit
PESD5V0S1UA
-
-
5
V
PESD12VS1UA
-
-
12
V
PESD5V0S1UA
-
480
530
pF
PESD12VS1UA
-
160
180
pF
diode capacitance
f = 1 MHz; VR = 0 V
PESD5V0S1UA; PESD12VS1UA
NXP Semiconductors
Unidirectional ESD protection for transient voltage suppression
2. Pinning information
Table 3.
Pinning
Pin
Description
1
cathode
2
anode
Simplified outline
Graphic symbol
[1]
1
2
1
2
006aaa152
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 4.
Ordering information
Type number
PESD5V0S1UA
Package
Name
Description
Version
SC-76
plastic surface-mounted package; 2 leads
SOD323
PESD12VS1UA
4. Marking
Table 5.
Marking codes
Type number
Marking code
PESD5V0S1UA
AV
PESD12VS1UA
AW
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
PPP
IPP
Parameter
Conditions
peak pulse power
tp = 8/20 µs
Max
Unit
PESD5V0S1UA
-
890
W
PESD12VS1UA
-
600
W
PESD5V0S1UA
-
47
A
PESD12VS1UA
-
22.5
A
peak pulse current
tp = 8/20 µs
PESD5V0S1UA_PESD12VS1UA_1
Product data sheet
Min
[1][2]
[1][2]
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 9 February 2009
2 of 14
PESD5V0S1UA; PESD12VS1UA
NXP Semiconductors
Unidirectional ESD protection for transient voltage suppression
Table 6.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Ptot
Parameter
Conditions
total power dissipation
Tamb ≤ 25 °C
Min
Max
Unit
[3]
-
360
mW
[4]
-
500
mW
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−55
+150
°C
Tstg
storage temperature
−65
+150
°C
[1]
Non-repetitive current pulse 8/20 µs exponential decay waveform according to IEC 61000-4-5.
[2]
Soldering point of cathode tab.
[3]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[4]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
Table 7.
ESD maximum ratings
Tamb = 25 °C unless otherwise specified.
Symbol
VESD
[1]
Parameter
Conditions
electrostatic discharge voltage
Min
Max
Unit
-
30
kV
machine model
-
400
V
MIL-STD-883 (human
body model)
-
16
kV
IEC 61000-4-2
(contact discharge)
Device stressed with ten non-repetitive ESD pulses.
Table 8.
ESD standards compliance
Standard
Conditions
IEC 61000-4-2; level 4 (ESD)
> 15 kV (air); > 8 kV (contact)
MIL-STD-883; class 3 (human body model)
> 4 kV
PESD5V0S1UA_PESD12VS1UA_1
Product data sheet
[1]
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 9 February 2009
3 of 14
PESD5V0S1UA; PESD12VS1UA
NXP Semiconductors
Unidirectional ESD protection for transient voltage suppression
001aaa631
IPP
001aaa630
120
100 %
90 %
100 % IPP; 8 µs
IPP
(%)
80
e−t
50 % IPP; 20 µs
40
10 %
0
10
20
30
30 ns
40
t (µs)
Fig 1.
t
tr = 0.7 ns to 1 ns
0
60 ns
8/20 µs pulse waveform according to
IEC 61000-4-5
Fig 2.
ESD pulse waveform according to
IEC 61000-4-2
6. Thermal characteristics
Table 9.
Symbol
Rth(j-a)
Rth(j-sp)
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
Conditions
in free air
thermal resistance from
junction to solder point
Typ
Max
Unit
-
-
345
K/W
[2]
-
-
250
K/W
[3]
-
-
90
K/W
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[3]
Soldering point of cathode tab.
PESD5V0S1UA_PESD12VS1UA_1
Product data sheet
Min
[1]
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 9 February 2009
4 of 14
PESD5V0S1UA; PESD12VS1UA
NXP Semiconductors
Unidirectional ESD protection for transient voltage suppression
7. Characteristics
Table 10. Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
VRWM
reverse standoff voltage
IRM
Conditions
-
-
5
V
-
12
V
VRWM = 5 V
-
0.3
4
µA
VRWM = 12 V
-
<1
100
nA
PESD5V0S1UA
6.2
6.8
7.3
V
PESD12VS1UA
13.3
14.5
15.75
V
-
480
530
pF
-
160
180
pF
IPP = 47 A
-
-
19
V
IPP = 25 A
-
-
13.5
V
IPP = 5 A
-
-
9.8
V
reverse leakage current
breakdown voltage
diode capacitance
IR = 5 mA
f = 1 MHz;
VR = 0 V
PESD12VS1UA
PESD12VS1UA
[1]
[1]
clamping voltage
PESD5V0S1UA
rdif
differential resistance
IPP = 22.5 A
-
-
27
V
IPP = 15 A
-
-
23.5
V
IPP = 5 A
-
-
19
V
IR = 5 mA
PESD5V0S1UA
-
2
100
Ω
PESD12VS1UA
-
5
100
Ω
Non-repetitive current pulse 8/20 µs exponential decay waveform according to IEC 61000-4-5.
PESD5V0S1UA_PESD12VS1UA_1
Product data sheet
Unit
-
PESD5V0S1UA
VCL
Max
PESD12VS1UA
PESD12VS1UA
Cd
Typ
PESD5V0S1UA
PESD5V0S1UA
VBR
Min
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 9 February 2009
5 of 14
PESD5V0S1UA; PESD12VS1UA
NXP Semiconductors
Unidirectional ESD protection for transient voltage suppression
006aab414
104
001aaa193
1.2
PPP
PPP
(W)
PPP(25°C)
103
0.8
(1)
(2)
102
0.4
101
101
102
103
0
104
0
50
100
150
tp (µs)
200
Tj (°C)
Tamb = 25 °C
(1) PESD5V0S1UA
(2) PESD12VS1UA
Fig 3.
Peak pulse power as a function of exponential
pulse duration; typical values
006aab415
500
Cd
(pF)
Fig 4.
Relative variation of peak pulse power as a
function of junction temperature; typical
values
006aab416
103
(1)
IRM
(nA)
400
102
300
10
(2)
(1)
200
1
(2)
100
0
0
4
8
12
10−1
−75
−25
VR (V)
f = 1 MHz; Tamb = 25 °C
25
75
125
175
Tamb (°C)
(1) PESD5V0S1UA
(1) PESD5V0S1UA
(2) PESD12VS1UA
(2) PESD12VS1UA
Fig 5.
Diode capacitance as a function of reverse
voltage; typical values
Fig 6.
Reverse leakage current as a function of
ambient temperature; typical values
PESD5V0S1UA_PESD12VS1UA_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 9 February 2009
6 of 14
NXP Semiconductors
PESD5V0S1UA; PESD12VS1UA
Unidirectional ESD protection for transient voltage suppression
I
−VCL −VBR −VRWM
V
−IRM
−IR
−
+
P-N
−IPP
006aaa407
Fig 7.
V-I characteristics for a unidirectional ESD protection diode
PESD5V0S1UA_PESD12VS1UA_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 9 February 2009
7 of 14
PESD5V0S1UA; PESD12VS1UA
NXP Semiconductors
Unidirectional ESD protection for transient voltage suppression
ESD TESTER
acc. to IEC 61000-4-2
CZ = 150 pF; RZ = 330 Ω
4 GHz DIGITAL
OSCILLOSCOPE
450 Ω
RZ
RG 223/U
50 Ω coax
10×
ATTENUATOR
50 Ω
CZ
DUT
(DEVICE
UNDER
TEST)
vertical scale = 10 V/div
horizontal scale = 10 ns/div
vertical scale = 10 A/div
horizontal scale = 15 ns/div
PESD12VS1UA
PESD5V0S1UA
GND
clamped +8 kV ESD pulse waveform
(IEC 61000-4-2 network)
unclamped +8 kV ESD pulse waveform
(IEC 61000-4-2 network)
vertical scale = 10 V/div
horizontal scale = 10 ns/div
vertical scale = 10 A/div
horizontal scale = 15 ns/div
GND
PESD12VS1UA
PESD5V0S1UA
clamped −8 kV ESD pulse waveform
(IEC 61000-4-2 network)
unclamped −8 kV ESD pulse waveform
(IEC 61000-4-2 network)
Fig 8.
006aab417
ESD clamping test setup and waveforms
PESD5V0S1UA_PESD12VS1UA_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 9 February 2009
8 of 14
PESD5V0S1UA; PESD12VS1UA
NXP Semiconductors
Unidirectional ESD protection for transient voltage suppression
8. Application information
PESD5V0S1UA and PESD12VS1UA are designed for the protection of one unidirectional
data or signal line from the damage caused by ESD and transient overvoltage.
The devices may be used on lines where the signal polarities are either positive or
negative with respect to ground.
The PESD5V0S1UA provides a surge capability of 890 W and the PESD12VS1UA
provides a surge capability of 600 W per line for an 8/20 µs waveform.
line to be protected
(positive signal polarity)
line to be protected
(negative signal polarity)
DUT
DUT
GND
GND
unidirectional protection of one line
006aab251
Fig 9.
Application diagram
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD and Electrical Fast
Transient (EFT). The following guidelines are recommended:
1. Place the device as close to the input terminal or connector as possible.
2. The path length between the device and the protected line should be minimized.
3. Keep parallel signal paths to a minimum.
4. Avoid running protected conductors in parallel with unprotected conductors.
5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and
ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Ground planes should be used whenever possible. For multilayer PCBs, use ground
vias.
PESD5V0S1UA_PESD12VS1UA_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 9 February 2009
9 of 14
NXP Semiconductors
PESD5V0S1UA; PESD12VS1UA
Unidirectional ESD protection for transient voltage suppression
9. Test information
9.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
10. Package outline
1.35
1.15
1.1
0.8
0.45
0.15
1
2.7
2.3
1.8
1.6
2
0.40
0.25
Dimensions in mm
0.25
0.10
03-12-17
Fig 10. Package outline PESDxS1UA (SOD323/SC-76)
11. Packing information
Table 11. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package Description
PESD5V0S1UA SOD323
4 mm pitch, 8 mm tape and reel
Packing quantity
3000
10000
-115
-135
PESD12VS1UA
[1]
For further information and the availability of packing methods, see Section 15.
PESD5V0S1UA_PESD12VS1UA_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 9 February 2009
10 of 14
PESD5V0S1UA; PESD12VS1UA
NXP Semiconductors
Unidirectional ESD protection for transient voltage suppression
12. Soldering
3.05
2.1
solder lands
solder resist
0.5 (2×)
1.65 0.95
0.6 (2×)
solder paste
occupied area
2.2
Dimensions in mm
0.5
(2×)
0.6
(2×)
sod323_fr
Fig 11. Reflow soldering footprint PESDxS1UA (SOD323/SC-76)
5
2.9
1.5 (2×)
solder lands
solder resist
occupied area
2.75
1.2
(2×)
Dimensions in mm
preferred transport
direction during soldering
sod323_fw
Fig 12. Wave soldering footprint PESDxS1UA (SOD323/SC-76)
PESD5V0S1UA_PESD12VS1UA_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 9 February 2009
11 of 14
PESD5V0S1UA; PESD12VS1UA
NXP Semiconductors
Unidirectional ESD protection for transient voltage suppression
13. Revision history
Table 12.
Revision history
Document ID
Release date
PESD5V0S1UA_PESD12VS1UA_1 20090209
Data sheet status
Change notice
Supersedes
Product data sheet
-
-
PESD5V0S1UA_PESD12VS1UA_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 9 February 2009
12 of 14
NXP Semiconductors
PESD5V0S1UA; PESD12VS1UA
Unidirectional ESD protection for transient voltage suppression
14. Legal information
14.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
14.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PESD5V0S1UA_PESD12VS1UA_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 9 February 2009
13 of 14
NXP Semiconductors
PESD5V0S1UA; PESD12VS1UA
Unidirectional ESD protection for transient voltage suppression
16. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
9.1
10
11
12
13
14
14.1
14.2
14.3
14.4
15
16
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Application information. . . . . . . . . . . . . . . . . . . 9
Test information . . . . . . . . . . . . . . . . . . . . . . . . 10
Quality information . . . . . . . . . . . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
Packing information. . . . . . . . . . . . . . . . . . . . . 10
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Contact information. . . . . . . . . . . . . . . . . . . . . 13
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 9 February 2009
Document identifier: PESD5V0S1UA_PESD12VS1UA_1