PESD24VS1UA Unidirectional ESD protection diode Rev. 1 — 7 March 2011 Product data sheet 1. Product profile 1.1 General description Unidirectional ElectroStatic Discharge (ESD) protection diode in a SOD323 (SC-76) very small Surface-Mounted Device (SMD) plastic package designed to protect one signal line from the damage caused by ESD and other transients. 1.2 Features and benefits Unidirectional ESD protection of one line Max. peak pulse power: PPP = 160 W Ultra low leakage current: IRM < 1 nA ESD protection up to 23 kV IEC 61000-4-2, level 4 (ESD) IEC 61000-4-5 (surge); IPP = 3 A 1.3 Applications Computers and peripherals Communication systems Audio and video equipment Data lines Controller Area Network (CAN) bus protection 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter VRWM reverse standoff voltage Cd diode capacitance Conditions VR = 0 V; f = 1 MHz Min Typ Max Unit - - 24 V - 23 50 pF 2. Pinning information Table 2. Pinning Pin Description 1 cathode 2 anode Simplified outline Graphic symbol [1] 1 2 1 2 006aaa152 PESD24VS1UA NXP Semiconductors Unidirectional ESD protection diode [1] The marking bar indicates the cathode. 3. Ordering information Table 3. Ordering information Type number PESD24VS1UA Package Name Description Version SC-76 plastic surface-mounted package; 2 leads SOD323 4. Marking Table 4. Marking codes Type number Marking code PESD24VS1UA 2E 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions peak pulse power tp = 8/20 μs [1] IPP peak pulse current tp = 8/20 μs [1] Tj junction temperature Tamb ambient temperature Tstg storage temperature PPP [1] PESD24VS1UA Product data sheet Min Max Unit - 160 W - 3 A - 150 °C −65 +150 °C −65 +150 °C Non-repetitive current pulse 8/20 μs exponential decay waveform according to IEC 61000-4-5. All information provided in this document is subject to legal disclaimers. Rev. 1 — 7 March 2011 © NXP B.V. 2011. All rights reserved. 2 of 13 PESD24VS1UA NXP Semiconductors Unidirectional ESD protection diode Table 6. ESD maximum ratings Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions electrostatic discharge voltage VESD [1] IEC 61000-4-2 (contact discharge) MIL-STD-883 (human body model) [1] Min Max Unit - 23 kV - 10 kV Device stressed with ten non-repetitive ESD pulses. Table 7. ESD standards compliance Standard Conditions IEC 61000-4-2; level 4 (ESD) > 15 kV (air); > 8 kV (contact) MIL-STD-883; class 3 (human body model) > 4 kV 001aaa631 IPP 001aaa630 120 100 % 90 % 100 % IPP; 8 μs IPP (%) 80 e−t 50 % IPP; 20 μs 40 10 % 0 10 20 30 30 ns 40 t (μs) Fig 1. t tr = 0.7 ns to 1 ns 0 8/20 μs pulse waveform according to IEC 61000-4-5 PESD24VS1UA Product data sheet 60 ns Fig 2. ESD pulse waveform according to IEC 61000-4-2 All information provided in this document is subject to legal disclaimers. Rev. 1 — 7 March 2011 © NXP B.V. 2011. All rights reserved. 3 of 13 PESD24VS1UA NXP Semiconductors Unidirectional ESD protection diode 6. Characteristics Table 8. Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VRWM reverse standoff voltage - - 24 V IRM reverse leakage current VRWM = 24 V - <1 50 nA VBR breakdown voltage IR = 5 mA 26.5 27.0 27.5 V Cd diode capacitance f = 1 MHz; VR = 0 V - 23 50 pF VCL clamping voltage - - 36 V - - 70 V - 1.53 - Ω [1][2] IPP = 1 A IPP = 3 A dynamic resistance rdyn [1] [2][3] IR = 10 A Non-repetitive current pulse 8/20 μs exponential decay waveform according to IEC 61000-4-5. [2] Measured from pin 1 to pin 2. [3] Non-repetitive current pulse, Transmission Line Pulse (TLP) tp = 100 ns; square pulse; ANS/IESD STM5-1-2008. 006aac519 104 001aaa193 1.2 PPP Ppp (W) PPP(25°C) 103 0.8 102 0.4 10 1 10 102 103 0 104 0 50 100 150 200 Tj (°C) tp (μs) Tamb = 25 °C Fig 3. Peak pulse power dissipation as a function of pulse time; typical values PESD24VS1UA Product data sheet Fig 4. Relative variation of peak pulse power as a function of junction temperature; typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 7 March 2011 © NXP B.V. 2011. All rights reserved. 4 of 13 PESD24VS1UA NXP Semiconductors Unidirectional ESD protection diode 006aac520 50 006aac521 10 Cd (pF) IR 40 IR(25°C) 30 1 20 10 10–1 –100 0 0 5 10 15 20 25 –50 0 50 100 VR (V) f = 1 MHz; Tamb = 25 °C Fig 5. 150 Tj (°C) VRWM = 24 V Diode capacitance as a function of reverse voltage; typical values Fig 6. Relative variation of reverse leakage current as a function of junction temperature; typical values I −VCL −VBR −VRWM V −IRM −IR − + P-N −IPP 006aaa407 Fig 7. PESD24VS1UA Product data sheet V-I characteristics for a unidirectional ESD protection diode All information provided in this document is subject to legal disclaimers. Rev. 1 — 7 March 2011 © NXP B.V. 2011. All rights reserved. 5 of 13 PESD24VS1UA NXP Semiconductors Unidirectional ESD protection diode ESD TESTER RZ 450 Ω RG 223/U 50 Ω coax 4 GHz DIGITAL OSCILLOSCOPE 10´ ATTENUATOR 50 Ω CZ DUT (DEVICE UNDER TEST) IEC 61000-4-2 network CZ = 150 pF; RZ = 330 Ω vertical scale = 2 kV/div horizontal scale = 15 ns/div vertical scale = 25 V/div horizontal scale = 15 ns/div GND GND unclamped +8 kV ESD pulse waveform (IEC 61000-4-2 network) clamped +8 kV ESD pulse waveform (IEC 61000-4-2 network) vertical scale = 2 kV/div horizontal scale = 15 ns/div GND GND vertical scale = 25 V/div horizontal scale = 15 ns/div unclamped –8 kV ESD pulse waveform (IEC 61000-4-2 network) Fig 8. clamped –8 kV ESD pulse waveform (IEC 61000-4-2 network) 006aac522 ESD clamping setup and waveforms PESD24VS1UA Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 7 March 2011 © NXP B.V. 2011. All rights reserved. 6 of 13 PESD24VS1UA NXP Semiconductors Unidirectional ESD protection diode 7. Application information The PESD24VS1UA is designed for the protection of one unidirectional data or signal line from the damage caused by ESD and surge pulses. The device may be used on lines where the signal polarities are either positive or negative with respect to ground. The PESD24VS1UA provides a surge capability of 160 W per line for an 8/20 μs waveform. line to be protected (positive signal polarity) line to be protected (negative signal polarity) PESD24VS1UA PESD24VS1UA ground ground unidirectional protection of one line 006aac523 Fig 9. Unidirectional protection of one line Circuit board layout and protection device placement: Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT) and surge transients. The following guidelines are recommended: 1. Place the PESD24VS1UA as close to the input terminal or connector as possible. 2. The path length between the PESD24VS1UA and the protected line should be minimized. 3. Keep parallel signal paths to a minimum. 4. Avoid running protected conductors in parallel with unprotected conductors. 5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and ground loops. 6. Minimize the length of the transient return path to ground. 7. Avoid using shared transient return paths to a common ground point. 8. Ground planes should be used whenever possible. For multilayer PCBs, use ground vias. 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. PESD24VS1UA Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 7 March 2011 © NXP B.V. 2011. All rights reserved. 7 of 13 PESD24VS1UA NXP Semiconductors Unidirectional ESD protection diode 9. Package outline 1.35 1.15 1.1 0.8 0.45 0.15 1 2.7 2.3 1.8 1.6 2 0.40 0.25 Dimensions in mm 0.25 0.10 03-12-17 Fig 10. Package outline PESD24VS1UA (SOD323/SC-76) 10. Packing information Table 9. Possible packing methods The indicated -xxx are the last three digits of the 12 NC ordering code.[1] Type number PESD24VS1UA [1] PESD24VS1UA Product data sheet Package SOD323 Description 4 mm pitch, 8 mm tape and reel Packing quantity 3000 10000 -115 -135 For further information and the availability of packing methods, see Section 14. All information provided in this document is subject to legal disclaimers. Rev. 1 — 7 March 2011 © NXP B.V. 2011. All rights reserved. 8 of 13 PESD24VS1UA NXP Semiconductors Unidirectional ESD protection diode 11. Soldering 3.05 2.1 solder lands solder resist 0.5 (2×) 1.65 0.95 0.6 (2×) solder paste occupied area 2.2 Dimensions in mm 0.5 (2×) 0.6 (2×) sod323_fr Fig 11. Reflow soldering footprint PESD24VS1UA (SOD323/SC-76) 5 2.9 1.5 (2×) solder lands solder resist occupied area 2.75 1.2 (2×) Dimensions in mm preferred transport direction during soldering sod323_fw Fig 12. Wave soldering footprint PESD24VS1UA (SOD323/SC-76) PESD24VS1UA Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 7 March 2011 © NXP B.V. 2011. All rights reserved. 9 of 13 PESD24VS1UA NXP Semiconductors Unidirectional ESD protection diode 12. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes PESD24VS1UA v.1 20110307 Product data sheet - - PESD24VS1UA Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 7 March 2011 © NXP B.V. 2011. All rights reserved. 10 of 13 PESD24VS1UA NXP Semiconductors Unidirectional ESD protection diode 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 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NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. 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Export might require a prior authorization from national authorities. PESD24VS1UA Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 7 March 2011 © NXP B.V. 2011. All rights reserved. 11 of 13 PESD24VS1UA NXP Semiconductors Unidirectional ESD protection diode Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] PESD24VS1UA Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 7 March 2011 © NXP B.V. 2011. All rights reserved. 12 of 13 PESD24VS1UA NXP Semiconductors Unidirectional ESD protection diode 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Application information. . . . . . . . . . . . . . . . . . . 7 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 7 Quality information . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Packing information . . . . . . . . . . . . . . . . . . . . . 8 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 7 March 2011 Document identifier: PESD24VS1UA