Power Module Board Level Reliability Report(as of 8/22/2013) Summary Test Name Conditions Duration # of Lots Sample Size TEMP CYCLE TEMP CYCLE Rejects -20C TO 100C 920 1 10 (note 1) 0 -40C TO 125C 5000 1 9 (note 2) 0 (note 3) TEMP CYCLE -40C TO 125C 2000 1 45 (note 4) 0 TEMP CYCLE -40C TO 125C 2000 1 44 (note 5) 0 TEMP CYCLE -40C TO 125C 2000 1 16 (note 6) 0 TEMP CYCLE -40C TO 125C 2000 1 16 (note 7) 0 Notes: 1) 2) 3) 4) 5) 6) 7) 15x15x2.2 QFN body size. 2 functional modules per board. Assembled using 63/37 Sn/Pb solder paste 15x15x3.5 QFN body size. 1 functional modules per board. Assembled using 63/37 Sn/Pb solder paste 1 reject detected at 2000 cycles – not due to board level solder joint failure. 11.45x17.2x2.5 HDA body size. 1 daisy chain modules per board. Assembled using SAC 305 Pb free solder paste. 11.45x17.2x2.5 HDA body size. 1 daisy chain modules per board. Assembled using 63/37 Sn/Pb solder paste. 15x15x2.2 QFN body size. 2 functional modules per 12 layer board. Assembled using 63/37 Sn/Pb solder paste 15x15x3.5 QFN body size. 2 functional modules per 12 layer board. Assembled using 63/37 Sn/Pb solder paste For additional information, please contact Address: Intersil Corporation Reliability Engineering PO Box 65004 M/S 58-098 Palm Bay, FL 32906 Email: [email protected] Phone: (321) 724-7437 Fax: (321) 729-5560