power module board level reliability report

Power Module Board Level Reliability Report(as of 8/22/2013)
Summary
Test Name
Conditions
Duration
# of Lots
Sample Size
TEMP CYCLE
TEMP CYCLE
Rejects
-20C TO 100C
920
1
10 (note 1)
0
-40C TO 125C
5000
1
9 (note 2)
0 (note 3)
TEMP CYCLE
-40C TO 125C
2000
1
45 (note 4)
0
TEMP CYCLE
-40C TO 125C
2000
1
44 (note 5)
0
TEMP CYCLE
-40C TO 125C
2000
1
16 (note 6)
0
TEMP CYCLE
-40C TO 125C
2000
1
16 (note 7)
0
Notes:
1)
2)
3)
4)
5)
6)
7)
15x15x2.2 QFN body size. 2 functional modules per board. Assembled using 63/37 Sn/Pb solder paste
15x15x3.5 QFN body size. 1 functional modules per board. Assembled using 63/37 Sn/Pb solder paste
1 reject detected at 2000 cycles – not due to board level solder joint failure.
11.45x17.2x2.5 HDA body size. 1 daisy chain modules per board. Assembled using SAC 305 Pb free solder paste.
11.45x17.2x2.5 HDA body size. 1 daisy chain modules per board. Assembled using 63/37 Sn/Pb solder paste.
15x15x2.2 QFN body size. 2 functional modules per 12 layer board. Assembled using 63/37 Sn/Pb solder paste
15x15x3.5 QFN body size. 2 functional modules per 12 layer board. Assembled using 63/37 Sn/Pb solder paste
For additional information, please contact
Address:
Intersil Corporation
Reliability Engineering
PO Box 65004 M/S 58-098
Palm Bay, FL 32906
Email: [email protected]
Phone: (321) 724-7437
Fax: (321) 729-5560