MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSSOP−20 EP CASE 948AB−01 ISSUE O SCALE 1:1 DATE 17 JUN 2008 B D DETAIL B B 20 e/2 0.20 C A-B D 11 2X 10 TIPS E1 DETAIL B ÉÉÉ ÉÉÉ PIN 1 REFERENCE 1 E b b1 ÍÍÍÍ ÍÍÍÍ ÍÍÍÍ D c c1 10 e 20X A SECTION B−B b 0.10 TOP VIEW M C A-B D DIM A A1 A2 b b1 c c1 D E E1 e L L2 M P P1 M A2 B 0.05 C B A DETAIL A END VIEW 0.08 C 20X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.07 IN EXCESS OF THE LEAD WIDTH AT MMC. DAMBAR CANNOT BE LOACTED ON THE LOWER RADIUS OR THE FOOT OF THE LEAD. 4. DIMENSIONS b, b1, c, c1 TO BE MEASURED BETWEEN 0.10 AND 0.25 FROM LEAD TIP. 5. DATUMS A AND B ARE ARE DETERMINED AT DATUM H. DATUM H IS LOACTED AT THE MOLD PARTING LINE AND COINCIDENT WITH LEAD WHERE THE LEAD EXITS THE PLASTIC BODY. 6. DIMENSION D DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.15 PER SIDE. D AND E1 ARE DETERMINED AT DATUM H. SIDE VIEW A1 C SEATING PLANE H L2 P SEATING PLANE L DETAIL A P1 GAUGE PLANE C GENERIC MARKING DIAGRAM* XXXX XXXX ALYWG G BOTTOM VIEW SOLDERING FOOTPRINT XXXX A L Y W G 4.30 6.76 20X 0.98 MILLIMETERS MIN MAX 1.10 --0.05 0.15 0.85 0.95 0.19 0.30 0.19 0.25 0.09 0.20 0.09 0.16 6.60 6.40 6.40 BSC 4.30 4.50 0.65 BSC 0.50 0.70 0.25 BSC 0_ 8_ --4.20 --3.00 3.10 = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. 20X 0.65 PITCH 0.35 DIMENSIONS: MILLIMETERS DOCUMENT NUMBER: STATUS: NEW STANDARD: 98AON30874E ON SEMICONDUCTOR STANDARD 1 http://onsemi.com TSSOP−20 EXPOSED PAD 1 © Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. Case Outline Number: PAGE 1 OFXXX 2 DOCUMENT NUMBER: 98AON30874E PAGE 2 OF 2 ISSUE O REVISION RELEASED FOR PRODUCTION. REQ. BY B. KIRK. DATE 17 JUN 2008 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2008 June, 2008 − Rev. 01O Case Outline Number: 948AB