506BW

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFN8, 3x3, 0.65P
CASE 506BW−01
ISSUE O
1
SCALE 2:1
A
B
D
L
L
L1
PIN ONE
REFERENCE
2X
0.10 C
2X
ÏÏÏ
ÏÏÏ
ÏÏÏ
ÏÏÏ
0.10 C
DETAIL A
OPTIONAL
CONSTRUCTIONS
E
ÏÏ
ÏÏ
EXPOSED Cu
TOP VIEW
OPTIONAL
CONSTRUCTIONS
0.05 C
NOTE 4
A1
SIDE VIEW
SEATING
PLANE
1
4
L
E2
8X
K
e/2
8
5
8X
b
0.10 C A B
e
BOTTOM VIEW
0.05 C
NOTE 3
RECOMMENDED
SOLDERING FOOTPRINT*
2.50
1.75
ÎÎÎ
ÎÎ
ÎÎ
ÎÎÎ
ÎÎ
ÎÎ
Î
ÎÎ
ÎÎ
ÎÎ
ÎÎÎ
ÎÎ
ÎÎ
1
0.65
PITCH
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.25
0.35
3.00 BSC
2.30
2.50
3.00 BSC
1.55
1.75
0.65 BSC
0.20
−−−
0.35
0.45
0.00
0.15
GENERIC
MARKING DIAGRAM*
1
D2
DETAIL A
8X
C
MOLD CMPD
DETAIL B
A
(A3)
DETAIL B
0.05 C
DATE 13 OCT 2010
XXXXX
XXXXX
ALYWG
G
XXXXX = Specific Device Code
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
8X
0.62
3.30
8X
0.40
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON53212E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
DFN8, 3X3, 0.65P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON53212E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY J. SAMUDIO.
DATE
13 OCT 2010
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2010
October, 2010 − Rev. 01O
Case Outline Number:
506BW