DE14MA Package 14-Lead Plastic DFN (4mm × 3mm) (Reference LTC DWG #05-08-1731 Rev A) 1.78 ± 0.05 0.70 ± 0.05 0.10 TYP 0.51 TYP 3.50 ± 0.05 1.65 ± 0.05 2.10 ± 0.05 1.07 ±0.05 1.65 ± 0.05 PACKAGE OUTLINE 0.25 ± 0.05 0.50 BSC 3.00 REF RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 4.00 ± 0.10 (2 SIDES) R = 0.05 TYP 3.00 ± 0.10 (2 SIDES) R = 0.115 TYP 8 1.78 ± 0.10 14 1.07 ±0.10 1.65 ± 0.10 0.10 TYP 0.51 TYP 1.65 ± 0.10 PIN 1 TOP MARK (SEE NOTE 6) 0.200 REF 0.75 ± 0.05 0.40 ± 0.10 7 1 0.25 ± 0.05 0.50 BSC 3.00 REF 0.00 – 0.05 (DE14MA) DFN 0507 REV A BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING PROPOSED IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE PIN 1 NOTCH R = 0.20 OR 0.25 × 45° CHAMFER