05-08-1703

DC6 Package
6-Lead Plastic DFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1703 Rev C)
0.70 ±0.05
2.55 ±0.05
1.15 ±0.05 0.60 ±0.10
(2 SIDES)
PACKAGE
OUTLINE
0.25 ±0.05
0.50 BSC
1.37 ±0.10
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
R = 0.125
TYP
0.60 ±0.10
(2 SIDES)
0.40 ±0.10
4
6
2.00 ±0.10
(4 SIDES)
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
PIN 1 NOTCH
R = 0.20 OR
0.25 × 45°
CHAMFER
R = 0.05
TYP
0.200 REF
0.75 ±0.05
3
(DC6) DFN REV C 0915
1
0.25 ±0.05
0.50 BSC
1.37 ±0.10
(2 SIDES)
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WCCD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE