DHC Package 18-Lead Plastic DFN (5mm × 3mm) (Reference LTC DWG # 05-08-1955 Rev Ø) 0.65 ±0.05 3.50 ±0.05 1.65 ±0.05 2.20 ±0.05 (2 SIDES) PACKAGE OUTLINE 0.25 ± 0.05 0.50 BSC 4.40 ±0.05 (2 SIDES) RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 5.00 ±0.10 (2 SIDES) R = 0.20 TYP 3.00 ±0.10 (2 SIDES) R = 0.115 TYP 10 0.40 ±0.10 18 1.65 ±0.10 (2 SIDES) PIN 1 TOP MARK (SEE NOTE 6) PIN 1 NOTCH 0.200 REF 0.75 ±0.05 0.00 – 0.05 9 0.25 ±0.05 0.50 BSC 4.40 ±0.10 (2 SIDES) BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WJED-1) IN JEDEC PACKAGE OUTLINE MO-229 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 1 (DHC18) DFN 0713 REV Ø