DHD Package 16-Lead Plastic DFN (5mm × 4mm) (Reference LTC DWG # 05-08-1707 Rev A) 0.70 ±0.05 4.50 ±0.05 3.10 ±0.05 2.44 ±0.05 (2 SIDES) PACKAGE OUTLINE 0.25 ±0.05 0.50 BSC 4.34 ±0.05 (2 SIDES) RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS 5.00 ±0.10 (2 SIDES) 9 4.00 ±0.10 (2 SIDES) R = 0.115 TYP 0.40 ±0.10 16 2.44 ±0.10 (2 SIDES) PIN 1 TOP MARK (SEE NOTE 6) PIN 1 NOTCH 8 0.200 REF 1 0.25 ±0.05 0.50 BSC 0.75 ±0.05 0.00 – 0.05 4.34 ±0.10 (2 SIDES) BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WJGD-2) IN JEDEC PACKAGE OUTLINE MO-229 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE (DHD16) DFN REV A 1113