HALOGEN High Current Power Inductors HF Pb FREE HCM1305 Series Applications • • • • • • • • • SMD Device Description • • • • • • • • • • Halogen free 125°C maximum total operating temperature 13.8x 12.5 x 5.0mm maximum surface mount package Powder Iron core material Magnetically shielded, low EMI High current carrying capacity, low core losses Inductance range 0.22µH to 2.2µH Current range from 20 to 110 Amps Frequency range up to 5MHz RoHS compliant Voltage Regulator Module (VRM) Multi-phase regulators Desktop and server VRMs and EVRDs Data networking and storage systems Notebook regulators Point-of-load modules Base station equipment Battery power systems Graphics cards Environmental Data • Storage temperature range: -55°C to +125°C • Operating temperature range: -55°C to +125°C (ambient plus self temperature rise) • Solder reflow temperature: J-STD-020D compliant Packaging • Supplied in tape and reel packaging, 400 parts per 13” reel Product Specifications Part 6 Number HCM1305-R22-R HCM1305-R47-R HCM1305-R56-R HCM1305-R68-R HCM1305-R82-R HCM1305-1R0-R HCM1305-1R5-R HCM1305-2R2-R 1. 2. 3. OCL1 FLL2 Min Irms3 Isat4 DCR (mΩ) DCR (mΩ) ± 20% (μH) 0.22 0.47 0.56 0.68 0.82 1.00 1.50 2.20 (μH) 0.14 0.30 0.36 0.44 0.52 0.64 0.96 1.41 (Amps) 51 38 36 34 31 29 23 20 @25°C (Amps) 110 65 55 53 52 50 48 32 @20°C Nominal 0.63 0.80 1.15 1.15 1.40 2.10 2.75 4.60 @20°C Maximum 0.72 0.92 1.33 1.33 1.61 2.42 3.16 5.29 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.25Vrms, 0.0Adc @ 25°C. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.25Vrms, Isat @ 25°C. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application. 4. Isat: Peak current for approximately 20% rolloff at +25°C. 5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI. Bp-p: (Gauss), K: (K-factor from table), L: (Inductance in μH), ΔI (Peak-to-peak ripple current in Amps). 6. Part Number Definition: HCM1305-xxx-R - HCM1305 = Product code and size - xxx= Inductance value in μH, R = decimal point - “-R” suffix = RoHS compliant Dimensions - mm 1010 BU-SB101160 Page 1 of 4 K-factor5 367 174 110 110 140 117 120 110 Data Sheet: 4371 Packaging Information - mm Supplied in tape and reel packaging, 400 parts per 13” diameter reel. Temperature Rise vs. Total Loss 50 45 40 Temperature Rise( °C) 35 30 25 20 15 10 5 0 0 0. 2 0. 4 0. 6 0. 8 1 1. 2 1. 4 Total Loss (W) Core Loss 1010 BU-SB101160 Page 2 of 4 Data Sheet: 4371 1. 6 1. 8 2 2. 2 Inductance Characteristics HCM1305-R22-R 90% 90% % of OCL 80% % of OCL HCM1305-R47-R 100% 100% 70% 80% 70% 60% 60% 50% 50% 40% 40% 0 10 20 30 40 50 60 70 80 0 90 100 110 120 130 140 150 10 20 30 40 90% 90% 80% 80% % of OCL 100% % of OCL 100% 70% 60% 50% 50% 0 10 20 30 40 50 60 70 80 90 0 100 10 20 30 40 I IDC (Amps) HCM1305-R82-R 90 70 80 100 50 60 90 DC(Amps) HCM1305-1R0-R 100% 100% 90% 90% 80% 80% % of OCL % of OCL 80 40% 40% 70% 70% 60% 60% 50% 50% 40% 40% 0 10 20 30 40 50 60 70 0 80 10 20 30 40 50 60 70 IDC (Amps) IDC (Amps) HCM1305-1R5-R HCM1305-2R2-R 100% 100% 90% 90% 80% 80% % of OCL % of OCL 70 70% 60% 70% 70% 60% 60% 50% 50% 40% 40% 0 5 10 15 20 25 30 35 40 45 50 55 60 0 5 IDC (Amps) BU-SB101160 60 HCM1305-R68-R HCM1305-R56-R 1010 50 IDC (Amps) IDC (Amps) 10 15 20 25 30 IDC (Amps) Page 3 of 4 Data Sheet: 4371 35 40 45 50 55 Solder Reflow Profile TP TC -5°C tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Package Thickness <2.5mm _2.5mm > TL Preheat A Temperature T smax Table 1 - Standard SnPb Solder (Tc) t Volume mm3 <350 235°C 220°C Volume mm3 _ >350 220°C 220°C Table 2 - Lead (Pb) Free Solder (T c) Tsmin 25°C ts Package Thickness <1.6mm 1.6 – 2.5mm >2.5mm Time 25°C to Peak Volume mm3 <350 260°C 260°C 250°C Volume mm3 350 - 2000 260°C 250°C 245°C Volume mm3 >2000 260°C 245°C 245°C Time Reference JDEC J-STD-020D Profile Feature Preheat and Soak • Temperature min. (Tsmin) Standard SnPb Solder 100°C Lead (Pb) Free Solder 150°C • Temperature max. (Tsmax) 150°C 200°C • Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 60-150 Seconds 217°C 60-150 Seconds Table 1 Table 2 20 Seconds** 30 Seconds** 6°C/ Second Max. 6°C/ Second Max. 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. North America Cooper Electronic Technologies 1225 Broken Sound Parkway NW Suite F Boca Raton, FL 33487-3533 Tel: 1-561-998-4100 Fax: 1-561-241-6640 Toll Free: 1-888-414-2645 Cooper Bussmann P.O. Box 14460 St. Louis, MO 63178-4460 Tel: 1-636-394-2877 Fax: 1-636-527-1607 Europe Cooper Electronic Technologies Cooper (UK) Limited Burton-on-the-Wolds Leicestershire • LE12 5TH UK Tel: +44 (0) 1509 882 737 Fax: +44 (0) 1509 882 786 Cooper Electronic Technologies Avda. Santa Eulalia, 290 08223 Terrassa, (Barcelona), Spain Tel: +34 937 362 812 +34 937 362 813 Fax: +34 937 362 719 Asia Pacific Cooper Electronic Technologies 1 Jalan Kilang Timor #06-01 Pacific Tech Centre Singapore 159303 Tel: +65 278 6151 Fax: +65 270 4160 The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. © 2010 Cooper Bussmann w w w. c o o p e r bu s s m a n n . c o m 1010 BU-SB101160 Page 4 of 4 Data Sheet: 4371