MIC4609 Evaluation Board User’s Guide 2016 Microchip Technology Inc. DS50002478A Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, AnyRate, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, ETHERSYNCH, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker, Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == DS50002478A-page 2 Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2016, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-5224-0437-8 2016 Microchip Technology Inc. Object of Declaration: MIC4609 Evaluation Board 2016 Microchip Technology Inc. DS50002478A-page 3 NOTES: DS50002478A-page 4 2016 Microchip Technology Inc. MIC4609 EVALUATION BOARD USER’S GUIDE Table of Contents Preface ........................................................................................................................... 7 Introduction............................................................................................................ 7 Document Layout .................................................................................................. 7 Conventions Used in This Guide........................................................................... 8 Recommended Reading........................................................................................ 8 The Microchip Website.......................................................................................... 9 Customer Support ................................................................................................. 9 Revision History .................................................................................................... 9 Chapter 1. Product Overview 1.1 Introduction ................................................................................................... 11 1.2 MIC4609 Short Overview ............................................................................. 11 1.3 What is the MIC4609 Evaluation Board? ..................................................... 11 1.4 MIC4609 Evaluation Board Kit Contents ...................................................... 11 Chapter 2. Installation and Operation 2.1 System and Configuration Requirements ..................................................... 13 2.2 Circuit Description ........................................................................................ 13 2.2.1 Overcurrent and Fault circuitry .................................................................. 14 2.2.2 Enable Pin (EN) ......................................................................................... 14 2.2.3 Input Pins (xHI/xLI) .................................................................................... 14 2.2.4 Power and Motor Connections .................................................................. 14 2.2.5 Power Stage and Motor Connections ........................................................ 15 Appendix A. Schematic and Layouts A.1 Introduction .................................................................................................. 17 A.2 Board – Schematic ....................................................................................... 18 A.3 Board – Top Layer ....................................................................................... 19 A.4 Board – Top Copper .................................................................................... 20 A.5 Board – Mid Layer 1 ..................................................................................... 21 A.6 Board – Mid Layer 2 ..................................................................................... 22 A.7 Board – Bottom Copper ............................................................................... 23 A.8 Board – Bottom Layer .................................................................................. 24 Appendix B. Bill of Materials (BOM)........................................................................... 25 Worldwide Sales and Service .................................................................................... 28 2016 Microchip Technology Inc. DS50002478A-page 5 MIC4609 Evaluation Board User’s Guide NOTES: DS50002478A-page 6 2016 Microchip Technology Inc. MIC4609 EVALUATION BOARD USER’S GUIDE Preface NOTICE TO CUSTOMERS All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our website (www.microchip.com) to obtain the latest documentation available. Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is “DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level of the document. For the most up-to-date information on development tools, see the MPLAB® IDE online help. Select the Help menu, and then Topics to open a list of available online help files. INTRODUCTION This chapter contains general information that will be useful to know before using the MIC4609 Evaluation Board. Items discussed in this chapter include: • • • • • • Document Layout Conventions Used in This Guide Recommended Reading The Microchip Web Site Customer Support Revision History DOCUMENT LAYOUT This document describes how to install the MIC4609 Evaluation Board. It also describes how to operate the Evaluation Board. The manual layout is as follows: • Chapter 1. “Product Overview” – Important information about the MIC4609 Evaluation Board. • Chapter 2. “Installation and Operation” – Includes instructions on how to get started with the MIC4609 Evaluation Board. • Appendix A. “Schematic and Layouts” – Shows the schematic and layout diagrams for the MIC4609 Evaluation Board. • Appendix B. “Bill of Materials (BOM)” – Lists the parts used to build the MIC4609 Evaluation Board. 2016 Microchip Technology Inc. DS50002478A-page 7 Preface CONVENTIONS USED IN THIS GUIDE This manual uses the following documentation conventions: DOCUMENTATION CONVENTIONS Description Arial font: Italic characters Initial caps Quotes Underlined, Italic text with right angle bracket Bold characters N‘Rnnnn Text in angle brackets < > Courier New font: Plain Courier New Represents Examples Referenced books Emphasized text A window A dialog A menu selection A field name in a window or dialog A menu path MPLAB® IDE User’s Guide ...is the only compiler... the Output window the Settings dialog select Enable Programmer “Save project before build” A dialog button A tab A number in verilog format, where N is the total number of digits, R is the radix and n is a digit. A key on the keyboard Click OK Click the Power tab 4‘b0010, 2‘hF1 Italic Courier New Sample source code Filenames File paths Keywords Command-line options Bit values Constants A variable argument Square brackets [ ] Optional arguments Curly brackets and pipe character: { | } Ellipses... Choice of mutually exclusive arguments; an OR selection Replaces repeated text Represents code supplied by user File>Save Press <Enter>, <F1> #define START autoexec.bat c:\mcc18\h _asm, _endasm, static -Opa+, -Opa0, 1 0xFF, ‘A’ file.o, where file can be any valid filename mcc18 [options] file [options] errorlevel {0|1} var_name [, var_name...] void main (void) { ... } RECOMMENDED READING This user's guide describes how to use MIC4609 Evaluation Board. Another useful document is listed below. The following Microchip document is available and recommended as supplemental reference resource: • MIC4609 Data Sheet – “600V 3-Phase MOSFET/IGBT Driver” (DS20005531A) 2016 Microchip Technology Inc. DS50002478A-page 8 Preface THE MICROCHIP WEBSITE Microchip provides online support via our website at www.microchip.com. This website is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the website contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives. CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the website at: http://www.microchip.com/support. REVISION HISTORY Revision A (March 2016) • Original release of this document. 2016 Microchip Technology Inc. DS50002478A-page 9 Preface NOTES: 2016 Microchip Technology Inc. DS50002478A-page 10 MIC4609 EVALUATION BOARD USER’S GUIDE Chapter 1. Product Overview 1.1 INTRODUCTION This chapter provides an overview of the MIC4609 Evaluation Board and covers the following topics: • MIC4609 Short Overview • What is the MIC4609 Evaluation Board? • MIC4609 Evaluation Board Kit Contents 1.2 MIC4609 SHORT OVERVIEW The MIC4609 Evaluation Board is a 600V, 3-Phase driver that can be used with either IGBTs or MOSFETs. The MIC4609 features a 300 ns typical input filtering time to prevent unwanted pulses and a 550 ns of propagation delay. The board is available in an 28-pin wide SOIC package, with an operating junction temperature range of –40°C to +125°C. 1.3 WHAT IS THE MIC4609 EVALUATION BOARD? The board is comprised of the MIC4609 3-phase driver, 6 IGBTs and provisions for current/voltage sensing. Right angle header J1 provides an interface to a controller board for input drive signals, control signals and VDD/AVDD supply voltages. The input drive signals may also be accessed with jumpers J2, J3, J5, J6, J10 and J11. TP4 and J16 are connected to the VDD supply voltage. The high voltage VBUS, power ground and the 3-phase motor connections are made through connector J9. 1.4 MIC4609 EVALUATION BOARD KIT CONTENTS The MIC4609 Evaluation Board includes the following items: • MIC4609 Evaluation Board (ADM00749) • Important Information Sheet 2016 Microchip Technology Inc. DS50002478A-page 11 MIC4609 Evaluation Board User’s Guide NOTES: DS50002478A-page 12 2016 Microchip Technology Inc. MIC4609 EVALUATION BOARD USER’S GUIDE Chapter 2. Installation and Operation 2.1 SYSTEM AND CONFIGURATION REQUIREMENTS The MIC4609 Evaluation Board requires a VDD power supply with an output between 10V and 20V, an AVDD supply of 3.3V or 5V and a high voltage VBUS power supply that is used to driver the Motor or other load. Do not exceed 450V on VBUS unless C17 is removed. Note: 2.2 The evaluation board does not have reverse polarity protection. Applying a negative voltage to the VBUS (J16), VAVDD (J1.12) or VDD (J16 or J1.10) terminals may damage the device. Do not exceed 450V on VBUS due to the 450V rating of the 10 µF Aluminum Electrolytic capacitor (C17). Remove C17 if voltages between 450V and 600V are required. CIRCUIT DESCRIPTION The MIC4609 driver stage interfaces the incoming PWM signals to the IGBT power stage. Refer to the MIC4609 data sheet for detailed information on the driver’s operation. Figure 2-1 is a partial schematic showing the components for phase A. VDD C15 D15 VIN VDD AHB R19 C4 AHI Level shift D12 AHO R14 AHS R22 R59 D17 R20 Phase A D7 Q3 R15 ALI ALO VSS COM Phase B Q6 M Phase C R62 R18 Common return connection for Phase B and C R21/ R58 FIGURE 2-1: Phase A Circuitry A resistor diode network is connected between the high and low-side driver output and the IGBT gate. Resistors R14 and R15 limit the driver output current into the gate, which slows down both the turn-on and turn-off of the IGBTs. The diode resistor combination in parallel with the series resistors (R19/D12 and R20/D7) allows the turn off to be faster than the turn-on. 2016 Microchip Technology Inc. DS50002478A-page 13 MIC4609 Evaluation Board User’s Guide Resistor R22 and diode D17 clamp the HS pin to prevent it from going too negative. This can occur when the high-side IGBT turns off and the motor current freewheels through the low-side IGBT (Q3). Resistors R59 and R62 prevent charge from building up on the gates (and causing shoot-through current if both IGBTs turn-on) when VIN is present but VDD is not. Current sense resistors in Phase A (R18) and Phase B (R35, not shown) provide a current signal to the controller for FOC or similar control architectures. Phase C does not have a sense resistor. Parallel resistors R21 and R58 sense the current from all three phases and are used for overcurrent detection. The voltage across these resistors is sensed by the OC circuitry in the MIC4609, which shuts off the driver outputs if the OC threshold is exceeded. 2.2.1 Overcurrent and Fault circuitry The MIC4609 can detect an overcurrent condition by sensing the voltage across a current sense resistor (R21/R58) and comparing it to an internal reference. If the peak voltage sensed exceeds the reference, the output drivers are turned off for a period of time before being allowed to turn back on. The delay is set with capacitor C31. Refer to the MIC4609 data sheet for additional information on setting the delay. The FAULT pin goes low during the overcurrent event. This signal can be read by the controller to indicate a fault condition. The FAULT pin is pulled up to AVDD with a 100 k resistor. The fault signal can be monitored on TP1 or on pin 7 of jumper J1. 2.2.2 Enable Pin (EN) A 3-pin header (J8) connected to the enable pin allows it to be set high (ON) or low (OFF). When the jumper is set high, it is pulled up to AVDD through a 1 k resistor. The signal is connected to pin 9 of J1. A high level on the EN pin turns ON the internal bias’ in the driver and allows the driver to operate normally. Setting the EN pin low puts the device into a low IQ state and turns off all six driver outputs. An external connection may be used to set the EN pin state. When using an external connection, make sure the EN pin voltage does not exceed VDD. 2.2.3 Input Pins (xHI/xLI) Connections to the six input pins are made through connector J1 (pins 1-6) or through individual headers (J2, J3, J5, J6, J10, and J11). The individual headers can be used to monitor the signals or to set them high or low. Resistors in series with the inputs (as well as the EN and FAULT pins) can be used to limit current back to the controller if there is a fault condition or reverse voltage connection. 2.2.4 Power and Motor connections There are four voltage dividers on the board that provide sensing feedback to the controller: • VBUS_SNS monitors the high voltage BUS • FB_PHA, FB_PHB and FB_PHC monitor the phase voltages. RECN is the reconstructed neutral voltage. These signals are filtered and clamped to AVDD for noise and surge overvoltage protection. DS50002478A-page 14 2016 Microchip Technology Inc. Installation and Operation The sense voltage is the output of the voltage dividers and can be calculated using the following equation: EQUATION 2-1: R41 VFB_PHA = V PhaseA -------------------------------------------- R41 + R44 + R48 Similar calculations are made for Phases B, C and the VBUS sense. The resistor values on the board generate a 2V FB signal for a 300V BUS or phase voltage. If higher or lower voltage motors are used, the resistor divider values must be recalculated. 2.2.5 Power Stage and Motor connections The VBUS and power GND connections as well as the three motor phase connections are accessed through connector J9. In the existing evaluation board configuration, the maximum voltage on VBUS is 450V DC. This is limited by the voltage rating of the electrolytic capacitor, C17. If the capacitor is removed, VBUS can increase to 600V. Locations for an RC snubber for each of the phase nodes are located on the back of the board. These are not populated but are available to attenuate ringing if necessary. 2016 Microchip Technology Inc. DS50002478A-page 15 MIC4609 Evaluation Board User’s Guide NOTES: DS50002478A-page 16 2016 Microchip Technology Inc. MIC4609 EVALUATION BOARD USER’S GUIDE Appendix A. Schematic and Layouts A.1 INTRODUCTION This appendix contains the following schematics and layouts for the MIC4609 Evaluation Board: • • • • • • • Board – Schematic Board – Top Layer Board – Top Copper Board – Mid Layer 1 Board – Mid Layer 2 Board – Bottom Copper Board – Bottom Layer 2016 Microchip Technology Inc. DS50002478A-page 17 BOARD – SCHEMATIC 2 D13 VDD US1M-TP D14 US1M-TP 1 VDD 1 3 0 0 CHI FAULT AVDD R51 BLI R4 100k 1 2 AHO 3 BHI AHS 4 CHI NC 5 ALI BHB BHO BHS 9 ISNS 3 1NF AGND AGND 11 RCIN 12 VSS NC CHB CHO CHS NC 20 MIC4609YWM C24 AGND VDD AVDD 2016 Microchip Technology Inc. 2 4 6 8 10 12 Shunt High Sum Rtn 14 Shunt High 2 Rtn 16 Shunt High 1 Rtn 18 FB_PHC 20 RECN 22 24 AHI CHI BLI FAULT 1 3 5 7 9 11 13 15 17 19 21 23 C6 1UF/25V 17 VBUS_SNS Shunt High Sum Shunt High 2 Shunt High 1 FB_PHB FB_PHA D19 D16 US1M-TP US1M-TP TP2 TP3 C20 10UF/25V AGND R9 C18 1k 1nF C12 R20 0 D7 J9 AGND Phase B 5 Phase C Q3 1 Shunt High 1 R10 R29 NF C10 NF C19 20k NF R3 NF C1 NF R44 75K R45 75K R46 75K R48 75K R56 75K R57 75K D8 0 ED2612 FB_PHBR12 332 R25 10k FB_PHC R17 332 R30 R31 10k 10k AVDD Q2 R63 20k IRG4BC20KD R34 0 R35 0.05 Shunt High 2 Rtn R36 1N5819HW RECN 1 1N5819HW Shunt High 2 FB_PHA R11 332 R18 0.05 0 R2 R16 NF Phase A R62 Shunt High 1 Rtn R24 D9 GND 4 R23 R15 10 VBUS 2 3 IRG4BC20KD 1N5819HW 1 10 R28 R33 TP5 1UF/630V R13 2 3 1 D1 0 1 10 C23 1UF/630V Q4 IRG4BC20KD D17 US1M-TP 0 AVDD VBUS_SNS 10 R7 Header 12X2 C9 1 0 EN R8 75K C7 Q5 IRG4BC20KD R61 20k 16 10 R49 0 R5 75K 10 1UF/25V J1 BHI ALI CLI R60 20k R22 1UF/25V 18 BLO 15 C17 10uF/450V 1UF/630V 1UF/630V R1 10 C15 19 C5 1 1N5819HW D10 1N5819HW R6 0 21 ALO 1UF/630V Q6 IRG4BC20KD D11 0 14 CLO 20k 10 22 13 COM R59 C11 R27 R32 23 BLI C2 1UF/630V 1 10 24 CLI FAULT R14 25 7 8 D12 0 26 VBUS 1N5819HW R19 27 6 10 EN C31 J8 ENABLE AHI 0 TP1 EN R38 1k AHB 2 0 R39 0 R54 0 CLI R55 ALI AVDD R50 0 R52 28 VDD 1 + R53 U1 2 1 2 BHI US1M-TP AGND AGND AHI C32 1UF/25V 3 AGND AGND C14 1NF 2 3 C4 10UF/25V R64 20k 3 2 J16 2 2 AHI 3 2 ALI 3 J6 1 J2 D15 2 3 TP4 3 3 BLI 2 1 J10 2 BHI 2 J3 3 3 CHI 2 J11 3 2 CLI 1 3 J5 1 AVDD 1 AVDD Q1 IRG4BC20KD Diode Schottky Dual AK R41 1k Shunt High Sum R37 0 AGND R26 1UF/25V C8 10 1nF R40 0 AGND R47 Shunt High Sum Rtn 0 R21 0.05 R58 0.05 C28 1nF 3 2 2 3 1 D2 Diode Schottky Dual AK R42 1k C29 1nF 1 D3 Diode Schottky Dual AK R43 C30 1k 1nF MIC4609 Evaluation Board User’s Guide DS50002478A-page 18 A.2 Schematic and Layouts A.3 BOARD – TOP LAYER 2016 Microchip Technology Inc. DS50002478A-page 19 MIC4609 Evaluation Board User’s Guide A.4 BOARD – TOP COPPER DS50002478A-page 20 2016 Microchip Technology Inc. Schematic and Layouts A.5 BOARD – MID LAYER 1 2016 Microchip Technology Inc. DS50002478A-page 21 MIC4609 Evaluation Board User’s Guide A.6 BOARD – MID LAYER 2 DS50002478A-page 22 2016 Microchip Technology Inc. Schematic and Layouts A.7 BOARD – BOTTOM COPPER 2016 Microchip Technology Inc. DS50002478A-page 23 MIC4609 Evaluation Board User’s Guide A.8 BOARD – BOTTOM LAYER DS50002478A-page 24 2016 Microchip Technology Inc. MIC4609 EVALUATION BOARD USER’S GUIDE Appendix B. Bill of Materials (BOM) TABLE B-1: Qty. BILL OF MATERIALS (BOM) Reference Description Manufacturer Part Number 3 C1, C10, C19 1206 size capacitor DO NOT POPULATE 6 C2, C5, C7, C9, C11, C12 1 µF/630V 2 C4, C20 10 µF/25V TDK Corporation C2012X5R1E106K085AC 5 C6, C15, C23, C24, C32 1 µF/25V TDK Corporation C1608X7R1E105K080AB 7 C8, C14, C18, C28, C29, C30, C31 1nF/50V TDK Corporation C1608X7R1H102K080AE 1 C17 10 µF/450V Al. El Panasonic® ECG EEU-EE2W100 1 U1 600V, 3-phase driver Microchip Technology, Inc. MIC4609YWM 3 R3, R16, R29 1206 size resistor DO NOT POPULATE 100K, 1%, 1/4W TDK Corporation CKG57NX7T2J105M500JH 1 R4 10 R1, R2, R13, R14, R15, 10, 1%, 1/10W R22, R23, R26, R27, R28 Panasonic- ECG ERJ-3EKF10R0V 5 'R9, R38, R41, R42, R43 1k, 1%, 1/10W Panasonic- ECG ERJ-3EKF1001V 3 R25, R30, R31 10K, 1%, 1/10W Panasonic- ECG ERJ-3EKF1002V 8 R5, R8, R44, R45, R46, R48, R56, R57 75K, 1%, 1/4W Panasonic- ECG ERJ-8ENF7502V 21 R6, R7, R10, R19, R20, 0, 1%, 1/10W R24, R32, R33, R34, R36, R37, R39, R40, R47, R49, R50, R51, R52, R53, R54, R55 Panasonic- ECG ERJ-3GEY0R00V 3 R11, R12, R17 332,1%, 1/10W Panasonic- ECG ERJ-3EKF3320V 4 R18, R21, R35, R58 0.05, 1W 1% Panasonic- ECG ERJ-M1WSF50MU 6 R59, R60, R61, R62, R63, 20K, 1%, 1/10W R64 Note 1: Panasonic- ECG ERJ-3EKF1003V Panasonic- ECG ERJ-3EKF2002V The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. 2016 Microchip Technology Inc. DS50002478A-page 25 MIC4609 Evaluation Board User’s Guide TABLE B-2: Qty BILL OF MATERIALS (BOM) - MECHANICAL PARTS Reference Description Manufacturer Incorporated® Part Number 3 D1, D2, D3 Diode Schottky Dual AK 40V/200mA Diodes 6 D7, D8, D9, D10, D11, D12 Schottky, 1A/40V Diodes Incorporated 1N5819HW 6 D13, D14, D15, D16, D17, D19 100V/1A Ultra fast diode Diodes Incorporated US1M-TP 1 J1 68021-224HLF 8 J2, J3, J5, J6, J8, J10, J11, J16 Header, 12-Pin, dual row, right angle FCI FCI Header, 3-pin 1 J9 5 position terminal block ED2612 6 Q1, Q2, Q3, Q4, Q5, Q6 (Note 2) IGBT Infineon Technologies AG IRG4BC20KD IGBT Infineon Technologies AG IKB06N60T IGBT Fairchild Semiconductor® SGW10N60RUFD IGBT STMicroelectronics STGB10NC60KD Note 1: 2: BAS40-04 68000-103HLF On-Shore Technology, Inc. The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. Note that only one set of six IGBTs are used at a time. You can choose the IGBT produced by one of the three listed manufacturers. DS50002478A-page 26 2016 Microchip Technology Inc. Bill of Materials (BOM) NOTES: 2016 Microchip Technology Inc. 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