MLU

T
PL
IA
N
M
CO
*R
oH
S
Features
Applications
■ RoHS compliant*
■ HDMI 1.4
■ ESD protection >25 kV
■ Digital Visual Interface (DVI)
■ Low capacitance <0.05 pF
■ USB 3.0 / USB OTG
■ Low leakage current <5 nA
■ Memory protection
■ SIM card ports
■ Automotive
ChipGuard® MLU Series - ESD Protectors
General Information
Device Symbol
The ChipGuard® MLU Series has been specifically designed to protect sensitive electronic
components from electrostatic discharge damage. The MLU family has been designed to
protect equipment to IEC61000-4-2, Level 4 (±8 kV Contact / ±15 kV Air Discharge) ESD
specifications targeted for high speed USB 3.0/USB OTG, HDMI 1.4, DVI or IEEE1394
applications.
V
The ChipGuard® MLU Series has been manufactured to provide low 0.05 pF capacitance
and leakage currents less than 5 nA with excellent clamp qualities, making the family almost
transparent under normal working conditions.
Electrical Characteristics @ 25 °C (unless otherwise noted)
CG0402MLU / CG0603MLU (Note 3)
Parameter
Typical Continuous Operating Voltage
Typical Clamping Voltage (Note 1)
Symbol
3.3x
05x
12x
24x
VDC
VC
3.3
5
12
24
Unit
V
25
V
0.05
pF
Maximum Leakage Current @ Max. VDC
CO
IL
5
nA
Typical Trigger Voltage (Note 2)
VT
250
V
Maximum ResponseTime
RT
1
ns
±8
±15
kV
kV
Maximum Capacitance @ 1 VRMS 1 MHz
ESD Protection: Per IEC 61000-4-2
Min. Contact Discharge (>1000 Reps)
Min. Air Discharge (>1000 Reps)
Operating Temperature
Storage Temperature
TOPR
TSTG
-40 to +125
˚C
-55 to +150
˚C
Notes: 1. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement 30 ns after initiation of pulse.
2. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement at maximum pulse voltage.
3. Part number suffix “x” can be E for 0603 size or G for 0402 size to indicate tape & reel quantity.
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
ChipGuard® MLU Series - ESD Protectors
Product Dimensions
Recommended Pad Layout
A
A
W
DIMENSIONS:
MM
(INCHES)
B
B
C
L
D
CG0402
Series
CG0603
Series
L
1.00 ± 0.15
(0.04 ± 0.006)
1.60 ± 0.20
(0.064 ± 0.008)
W
0.50 ± 0.10
(0.02 ± 0.004)
A
B
Dimension
CG0402
Series
CG0603
Series
A
0.51
(0.020)
0.76
(0.030)
0.80 ± 0.20
(0.032 ± 0.008)
B
0.61
(0.024)
1.02
(0.040)
0.36 ± 0.05
(0.014 ± 0.002)
0.45 ± 0.10
(0.018 ± 0.004)
C
0.51
(0.020)
0.50
(0.020)
0.25 ± 0.15
(0.10 ± 0.006)
0.30 ± 0.20
(0.012 ± 0.008)
D
1.70
(0.067)
2.54
(0.100)
Dim.
Solder Reflow Recommendations
300
Preheat Stages 1-3
Soldering
Cooling
A
Stage 1 Preheat
Temperature (°C)
250
200
150
30-70
sec.
60 s to 120 s
B
Stage 2 Preheat
140 °C to 160 °C
Stage 3 Preheat
Preheat to 200 °C
20 s to 40 s
D
Main Heating
200 °C
210 °C
220 °C
230 °C
240 °C
60 s to 70 s
55 s to 65 s
50 s to 60 s
40 s to 50 s
30 s to 40 s
E
Cooling
200 °C to 100 °C
1 °C/s to 4 °C/s
50
110 sec. (min.)
30 s to 60 s
C
100
0
Ambient to Preheating
Temperature
120 sec. (min.)
Time (seconds)
•
•
•
•
This product can be damaged by rapid heating, cooling or localized heating.
Heat shocks should be avoided. Preheating and gradual cooling recommended.
Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.
Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds.
A solder gun under 30 watts is recommended.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
ChipGuard® MLU Series - ESD Protectors
Packaging Dimensions
13.0 ± 1.0
(0.52 ± 0.04)
8.00 ± 0.30
(0.32 ± 0.012)
4.00 ± 0.10
(0.16 ± 0.004)
C
1.50 ± 0.10
(0.06 ± 0.004)
62.0 ± 1.50
(2.48 ± 0.06)
2.0 ± 0.50
(0.08 ± 0.02)
L
13.0 ± 0.50
(0.52 ± 0.02)
TOP
TAPE
G
W
D
21.0 ± 0.80
(0.84 ± 0.032)
3.50 ± 0.05
(0.14 ± 0.002)
NOTES: TAPE MATERIAL IS PAPER.
0.60 ± 0.05
TAPE THICKNESS IS
(0.024 ± 0.002)
COVER TAPE ADHESION IS 40 ± 15 GRAMS.
DIMENSIONS:
MM
(INCHES)
9.0 ± 0.50
(0.36 ± 0.02)
CG0402
Series
CG0603
Series
C
1.75 ± 0.05
(0.04 ± 0.002)
1.75 ± 0.10
(0.04 ± 0.004)
D
2.00 ± 0.02
(0.08 ± 0.0008)
2.00 ± 0.05
(0.08 ± 0.002)
L
1.12 ± 0.03
(0.045 ± 0.0012)
1.80 ± 0.20
(0.072 ± 0.008)
W
0.62 ± 0.03
(0.025 ± 0.0012)
0.90 ± 0.20
(0.036 ± 0.008)
G
2.0 ± 0.05
(0.08 ± 0.002)
4.0 ± 0.05
(0.16 ± 0.002)
Dimension
180.8 ± 2.0
(7.12 ± 0.08)
How to Order
CG 0n0n MLU - n.n x
®
ChipGuard
Product Designator
Package Option
0402 = 0402 Package
0603 = 0603 Package
Multilayer Series Designator
Operating Voltage**
3.3 = 3.3 V
05 = 5 V
12 = 12 V
24 = 24 V
Tape & Reel Packaging
E = 5,000 pcs. per reel (0603 Package)
G = 10,000 pcs. per reel (0402 Package)
** Only models lower than 10 volts require
decimal point.
Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
REV. K 06/13
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.