UDB Package 10-Lead Plastic QFN (3mm × 2mm) (Reference LTC DWG # 05-08-1848 Rev A) 0.25 ± 0.05 0.95 ± 0.05 0.65 ±0.05 2.50 ±0.05 1.10 ±0.05 0.75 ±0.05 0.90 ± 0.05 0.05 ± 0.05 DETAIL B DETAIL B PACKAGE OUTLINE 0.25 ± 0.10 0.25 ± 0.05 0.50 BSC 0.85 ± 0.05 3.50 ±0.05 RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS 0.40 ± 0.10 2.00 ± 0.05 3.00 ± 0.05 0.20 REF SIDE VIEW 0.90 ± 0.10 0.05 ± 0.10 DETAIL A R = 0.13 TYP 8 10 0.80 7 BSC 6 0.70 ± 0.10 1 DETAIL A 2 5 3 0.60 ± 0.10 0.50 ± 0.10 0.25 ± 0.05 (UDB10) DFN 0910 REV A 0.50 BSC 0.75 ±0.05 BOTTOM VIEW—EXPOSED PAD 0.00 – 0.05 NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE