UDB Package 12-Lead Plastic QFN (3mm × 2mm) (Reference LTC DWG # 05-08-1941 Rev Ø) 0.25 ±0.05 0.85 ±0.05 0.65 ±0.05 0.90 ±0.05 0.05 REF 2.50 ±0.05 DETAIL B DETAIL B 0.25 ±0.10 PACKAGE OUTLINE 0.25 ±0.05 0.50 BSC 0.75 ±0.05 0.90 ±0.10 0.05 REF DETAIL A 3.50 ±0.05 RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED R = 0.13 TYP 10 12 0.15 REF 0.60 ±0.10 0.40 ±0.10 9 1 0.40 REF 7 0.40 ±0.10 3 2.00 ±0.10 6 3.00 ±0.10 0.50 ±0.10 0.75 ±0.05 0.20 REF 4 0.50 ±0.10 (UDB12) DFN 0113 REV 0 0.25 ±0.05 0.50 BSC BOTTOM VIEW—EXPOSED PAD SIDE VIEW DETAIL A 0.00 – 0.05 NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE