FE Package 38-Lead Plastic TSSOP (4.4mm) (Reference LTC DWG # 05-08-1779 Rev Ø) Split Exposed Pad Variation AC 4.75 REF 9.60 – 9.80* (.378 – .386) 4.75 REF (.187) 38 20 0.45 6.60 ±0.10 4.50 REF 2.74 REF 2.38 (.094) 0.45 (.018) REF SEE NOTE 4 2.70 1.60 0.315 ±0.05 1.05 ±0.10 2.74 (.108) REF 0.50 BSC RECOMMENDED SOLDER PAD LAYOUT APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 4.30 – 4.50* (.169 – .177) 0.09 – 0.20 (.0035 – .0079) 0.50 – 0.75 (.020 – .030) NOTE: 1. CONTROLLING DIMENSION: MILLIMETERS 2. DIMENSIONS ARE IN MILLIMETERS (INCHES) 3. DRAWING NOT TO SCALE 0.25 REF 1 2.70 (.106) REF 19 1.60 (.063) 1.20 (.047) MAX 0° – 8° 0.50 (.0196) BSC 0.17 – 0.27 (.0067 – .0106) TYP 4. RECOMMENDED MINIMUM PCB METAL SIZE FOR EXPOSED PAD ATTACHMENT *DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.150mm (.006") PER SIDE 0.05 – 0.15 (.002 – .006) FE38 (AC) TSSOP REV Ø 0311 6.40 (.252) BSC