MATERIAL DECLARATION SHEET Material Product Line Revision Date Revision RoHS Compliant Halogen free compliant MF-FSMF050X Multifuse March.06, 2009 A Yes Yes 1 Breakdown of part (eg Lead, Ceramic body, coating, plating, additive) Carbon Black 2 Copper plating 3 Foil 4 PCB Foil 5 Polymer 6 Prepreg 7 Packing-Carrier Tape No. 8 Packing-Cover Tape 9 Soldering plating 10 Protection layer Material/substance name (eg.Sn alloy, Cu Copper) Material/ substance weight in grams (±0.1%) CAS No. / Int. Identifier Carbon 0.0001482 1333-86-4 Material /substance weight % 5.46% Copper 0.0002214 7440-50-8 8.16% Copper 0.0018847 7440-50-8 69.49% Nickel 0.0000992 7440-02-0 3.66% Copper 0.0001861 7440-50-8 6.86% Polyethylene Homopolymer 0.0001313 9002-88-4 4.84% Proprietary Additives 0.0000002 - 0.01% Epoxy 0.0000040 35948-25-5 0.15% Glass fiber 0.0000027 65997-17-3 0.10% Polystyrene N/A 9003-53-6 N/A N/A Polyethylene Homopolymer N/A 9002-88-4 N/A N/A Polyethylene terephthalate N/A 25038-59-9 N/A N/A Polyethylene Homopolymer N/A 9002-88-4 N/A N/A Nickel 0.0000334 7440-02-0 1.23% Gold 0.0000001 7440-57-5 0.01% Epoxy 0.0000009 - 0.03% 0.03% Total weight (grams) 0.0027121 Total 100% 100% Sum(%) 5.46% 8.16% 73.15% 6.86% 4.85% 0.25% 1.24%