MATERIAL DECLARATION SHEET Material Product Line Revision Date Revision RoHS Compliant MF - SMDF Multifuse April 25, 2005 A Yes Breakdown of part Material/substance name Material/ substance (e.g. Lead, Ceramic body, (e.g. Sn alloy, Cu weight in grams coating, plating, additive) Copper) (±0.1%) CAS No. / Int. Identifier Material Sum(%) /substance weight % No. 1 2 3 Carbon Black Carbon Copper plating Copper Foil Copper Nickel 4 5 PCB Foil Copper Polymer Polyethylene Homopolymer Proprietary Additives 6 Prepreg Epoxy Glass fiber 7 Packing-Carrier Tape Polystyrene Polyethylene Homopolymer 8 Packing-Cover Tape Polyethylene terephthalate Polyethylene Homopolymer 9 10 Soldering plating Nickel Soldering plating Gold 0.0014939 0.0028159 0.0186284 0.0009805 0.0023674 0.0012975 0.0000175 0.0066892 0.0044589 N/A N/A N/A N/A 0.0001851 0.0000022 1333-86-4 3.84% 11.07% 7.23% 7440-50-8 7440-02-0 7440-50-8 9002-88-4 47.84% 47.84% 2.52% 2.52% 6.08% 6.08% 3.33% 3.38% 0.04% 17.18% 28.63% 11.45% 9003-53-6 9002-88-4 25038-59-9 9002-88-4 0.48% 0.48% 0.01% 0.01% 100% 100% Total Weight (%) Total weight (grams) 0.0389365 Total