PL IA NT Features S CO M ■ 6 *R oH ■ ■ ■ ■ Applications Lead free as standard RoHS compliant* Low profile Low power loss, high efficiency UL 94V-0 classification ■ ■ ■ ■ High frequency switching power supplies Inverters Free wheeling Polarity protection CD2010-B140 – Surface Mount Schottky Rectifier Diode General Information The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop increasingly smaller electronic components. Bourns offers Schottky Rectifier Diodes for rectification applications, in compact chip package 2010 size format, which offers PCB real estate savings and are considerably smaller than most competitive parts. The Schottky Rectifier Diodes offer a forward current of 1 A with a repetitive peak reverse voltage of 40 V. Bourns® Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment and their flat configuration minimizes roll away. Tin Plated Connectors FRP Substrate and Epoxy Underfill Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter Symbol Min. Nom. Max. Unit DC Blocking Voltage VDC 40 V Repetitive Peak Reverse Voltage VRRM 40 V Average Forward Rectified Current1 I(AV) 1.0 A Instantaneous Forward Voltage @ IF = 1.0 A VF 0.55 V Reverse Leakage Current @ VRRM IR 0.1 mA IFSM 70 A Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load (JEDEC Method) 0.45 Notes: 1 See Forward Derating Curve. Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter Symbol Min. Nom. Max. Unit Junction Temperature Range TJ -40 +25 +125 °C Storage Temperature Range TSTG -40 +25 +125 °C *RoHS Directive 2002/95/EC Jan 27 2003 including Annex Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. CD2010-B140 – Surface Mount Schottky Rectifier Diode Product Dimensions Recommended Footprint This is a lead free product. It is packaged with FRP substrate and is epoxy underfilled. The terminals are pure tin plated and are solderable per MIL-STD-750, Method 2026. The package weighs approximately 0.02 g. The package and dimensions are shown below. The device will mount onto existing JEDEC SOD-106 footprint. How To Order A CD 2010 - B 1 40 C B D Common Code Chip Diode Package • 2010 Model B = Schottky Barrier Diode Current 1=1A Working Peak Reverse Voltage 40 = 40 VRWM (Volts) E F Dimensions A 4.40 - 4.60 (0.173 - 0.181) B 2.10 - 2.30 (0.083 - 0.091) C 0.50 (0.020) D 0.75 - 1.15 (0.029 - 0.045) E 0.75 - 1.15 (0.029 - 0.045) F 0.85 - 1.25 (0.033 - 0.049) DIMENSIONS: MM (INCHES) *RoHS Directive 2002/95/EC Jan 27 2003 including Annex Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. CD2010-B140 – Surface Mount Schottky Rectifier Diode Rating and Characteristic Curves Average Forward Rectified Current (Amps) Forward Current Derating Curve Maximum Non-Repetitive Peak Forward Surge Current Peak Forward Surge Current (Amps) 1.5 1.0 0.5 0 0 25 50 75 100 125 150 80 70 60 50 40 30 20 Pulse Width 8.3 ms Single Half Sine-Wave (JEDEC Method) 10 0 10 1 Lead Temperature (°C) Forward Characteristics Reverse Characteristics 100 10 Instantaneous Reverse Current (mA) Instantaneous Forward Current (Amps) 10.00 1.00 0.10 TJ = 100 °C 1.0 0.10 1.0 TJ = 25 °C 0.001 0.01 0 0.2 0.4 0.6 1.0 0.8 1.2 Typical Junction Capacitance 400 TJ = 25 °C f = 1.0 MHz Vsig = 50 mVP-P 100 10 0.1 1.0 10 Reverse Voltage (Volts) 0 20 40 60 80 Percent of Rated Peak Reverse Voltage (%) Instantaneous Forward Voltage (Volts) Junction Capacitance (pF) 100 Number of Cycles at 60 Hz 100 *RoHS Directive 2002/95/EC Jan 27 2003 including Annex Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 100 CD2010-B140 – Surface Mount Schottky Rectifier Diode Packaging Information The product will be dispensed in Tape and Reel format (see diagram below). P 0 P 1 d T E Index Hole 120 ° F D2 W B D1 D P A Trailer C Device Leader ....... ....... ....... ....... ....... ....... ....... ....... End 10 pitches (min.) 10 pitches (min.) Direction of Feed Item Symbol Carrier Width A Carrier Length B Carrier Depth C Sprocket Hole d Reel Outside Diameter D Reel Inner Diameter D1 Feed Hole Diameter D2 Sprocket Hole Position E Punch Hole Position F Punch Hole Pitch P Sprocket Hole Pitch P0 Embossment Center P1 Overall Tape Thickness T Tape Width W Reel Width W1 Quantity per Reel — W1 Start DIMENSIONS: MM (INCHES) Devices are packed in accordance with EIA standard RS-481-A and specifications shown here. 2010 2.80 ± 0.10 (0.110 ± 0.004) 5.00 ± 0.10 (0.197 ± 0.004) 1.55 ± 0.10 (0.061 ± 0.004) 1.55 ± 0.05 (0.061 ± 0.002) 178 (7.008) 80.0 Min. (3.150) 13.0 ± 0.20 (0.512 ± 0.008) 1.75 ± 0.10 (0.069 ± 0.004) 3.50 ± 0.05 (0.138 ± 0.002) 4.00 ± 0.10 (0.157 ± 0.004) 4.00 ± 0.10 (0.157 ± 0.004) 2.00 ± 0.05 (0.079 ± 0.002) 0.20 ± 0.10 (0.008 ± 0.004) 8.00 ± 0.20 (0.315 ± 0.008) 13.5 Max. (0.531) 2,500 Reliable Electronic Solutions Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700 www.bourns.com *RoHS Directive 2002/95/EC Jan 27 2003 including Annex Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. COPYRIGHT© 2005, BOURNS, INC. LITHO IN U.S.A. IPA0501 04/05