MATERIAL DECLARATION SHEET

MATERIAL DECLARATION SHEET
Material #
CD2010 Series
Product Line
Integrated Passive & Active Devices
Date
11/1/2005
RoHS Compliant
Yes
COMPONENT DETAILS
No.
1
2
3
Construction
element
FR-5
Schottky
Solder paste
Material group
FR-5
Die
Solder paste
Material
weight [g]
Materials
7440-50-8
7631-86-9
0.012000
Cu
Fiber
Resin
Amine catalyst
Acetone
Silicon
7440-21-3
0.000479
0.000920
CAS
if applicable
Average mass
[%]
Sum [%]
4%
50%
55%
1%
0.1%
60.6%
79.3%
Ag
13.8%
Ti
1.26%
Ni
1.26%
SiO2
0.9%
B
3.4%
Others
0.08%
Ag
7440-22-4
3.5%
Sn
7440-31-5
95.5%
Cu
7440-50-8
1%
2.42%
4.65%
4
Plating
Plating
0.000400
Sn
7440-31-5
100%
2.02%
5
Molding
Component
Liquid epoxy
0.006000
Silica fused
Epoxy resin
25068-38-6
40%
60%
30.3%
Headquarters Riverside CA
www.bourns.com
Traces
page 1 of 2
MATERIAL DECLARATION SHEET
Total weight
0.019799
** Product is only available with lead free terminals.
Standard Part Number Example:
CD2010-B140
Note: Avg. mass and sum data is a % of the component weight.
It is the responsibility of the user to ensure that the latest revision is being accessed on the website.
Headquarters Riverside CA
www.bourns.com
page 2 of 2