MATERIAL DECLARATION SHEET Material Number Product Line CD2010 Series Schottky Rectifier Diodes Compliance Date RoHS Compliant No. 1 Construction Element(subpart) FRP January 1, 2005 Yes MSL Homogeneous Material 1 Material weight [mg] Others 12 2 Epoxy Plastic 5.36 3 Solder Cream Metal 0.94 4 Dice Others 1.30 5 Terminal Plating Metal 0.4 Total weight 20 This Document was updated on: Headquarters Riverside CA Homogeneous Material\ Substances Continuous filament glass fibers Copper Non-Hazardous cured resin Silicon Dioxide Bisphenol type epoxy Lead *2 Tin Silver Silicon Silver Nickel Titanium Arsenic Phosphorus Tin if applicable Materials Mass % Material Mass % of total unit wt. 65997-17-3 43 25.8 7440-50-8 14 8.4 Proprietary 43 25.8 7631-86-9 55 14.74 9003-36-5 45 12.06 7439-92-1 7440-31-5 7440-22-4 7440-21-3 7440-22-4 7440-02-0 7440-32-6 7440-38-2 7723-14-0 88 10 2 90.46 8.5 0.67 0.27 0.09 0.01 4.136 0.47 0.094 5.8799 0.5525 0.04355 0.01755 0.00585 0.00065 7440-31-5 100 2 CASRN Subpart mass of total wt. (%) 60.00 26.80 4.70 6.50 2.00 2015/05/05 www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 2 MATERIAL DECLARATION SHEET Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. 2. *：Excepted for RoHS 7(a)-Lead in high melting temperature type solders (i.e. lead- based alloys containing 85% by weight or more lead)； Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 2 of 2