T PL IA N M CO *R oH S Features This series is currently available but not recommended for new designs. ■ Bidirectional TVS ■ Low capacitance - 12 pF ■ ESD protection >15 kV ■ Fits 0402 footprint CDDFN2-TxxC Series - Surface Mount TVS Diode General Information The CDDFN2-TxxC Series provides ESD and EFT protection for external ports of electronic devices such as cellular phones, hand held electronics and other portable electronic devices. The device measures 1.05 mm x 0.65 mm and is available in a DFN-2 package and is intended to be mounted directly onto an FR4 printed circuit board. The device will fit an 0402 footprint. The device is designed to meet IEC 61000-4-2(ESD) and IEC 61000-4-4(EFT) protection requirements. Absolute Maximum Ratings (@ TA = 25 °C Unless Otherwise Noted) Parameter Peak Pulse Power @ 8/20 μs Peak Pulse Current @ 8/20 μs Operating Temperature Storage Temperature Symbol Ppk Ipp TOPR TSTG 5.0C 75 5 CDDFN212C 25 1 -40 to +125 -55 to +150 24C 47 1 Unit W A ºC ºC Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter Maximum Working Peak Voltage Minimum Breakdown Voltage @ 1 mA Maximum Leakage Current @ Vwm Typical Capacitance @ 0 V 1 MHz Maximum Capacitance @ 0 V 1 MHz Maximum Clamping Voltage @ Ipp 8/20 μs ESD Protection per IEC 61000-4-2 Minimum Contact Discharge Minimum Air Discharge Symbol Vwm VBR IL CJ CJ Vc ESD ESD 5.0C 5.0 6.0 15 15 CDDFN212C 12 13 2.0 12 20 25 24C 24 25 10 47 8 15 *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. Unit V V μA pF pF V kV kV CDDFN2-TxxC Series - Surface Mount TVS Diode Product Dimensions Recommended PCB Footprint This is a Molded DFN-2 package with lead free 100 % Au plating on the terminations. It weighs approximately 10 mg. 1.40 (0.055) 0.85 (0.033) A 0.30 (0.012) 0.80 (0.031) TOP B 0.55 (0.022) H C Typical Part Marking CDDFN2-T5.0C ............................................................................ E5 CDDFN2-T12C ............................................................................. E2 CDDFN2-T24C ............................................................................. E4 D BOTTOM 0.55 (0.022) E SIDE How to Order F CD DFN2 - T 5.0 C Common Diode Chip Diode G A B C D E F G H Dimensions 0.55-0.65 (0.022-0.026) 0.95- 1.05 (0.037-.041) 0.45-0.55 (0.018-.022) 0.30 (0.012) TYP. 0.43 (0.017) TYP. 0.30 (0.012) TYP. 0.50 (0.020) TYP. 0.50 (0.020) TYP. DIMENSIONS: Package DFN2 = DFN-2 Package Model Transient Voltage Suppressor Working Peak Reverse Voltage 5.0 = 5.0 VRWM (Volts) 12.0 = 12.0 VRWM (Volts) 24.0 = 24.0 VRWM (Volts) Suffix C = Bidirectional Diode Block Diagram MM (INCHES) Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. CDDFN2-TxxC Series - Surface Mount TVS Diode Rating & Characteristic Curves Pulse Waveform Reverse Characteristics 120 Test Waveform Parameters tt = 8 µs td = 20 µs tt 100 Reverse Current (A) IPP – Peak Pulse Current (% of IPP) 10u 80 et 60 40 1u 100n td = t|IPP/2 20 0 10n 0 5 10 15 20 25 30 0 20 40 t – Time (µs) 60 80 100 Reverse Voltage (%) Power Derating Curve Capacitance Between Terminals 15 Mounting on Glass Epoxy PCBs Capacitance Between Terminals (pF) 100 Power Rating (%) 80 60 40 20 5V 12 12 V 9 24 V 6 3 0 0 0 25 50 75 100 Ambient Temperature (°C) 125 150 0 10 20 Reverse Voltage (V) Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 30 40 CDDFN2-TxxC Series - Surface Mount TVS Diode Packaging Information The surface mount product is packaged in an 8 mm x 4 mm tape and reel format per EIA-481 standard. P 0 P 1 d T E Index Hole 120 ° F D2 W B D1 D P A Trailer ....... ....... End C Device ....... ....... ....... ....... Leader ....... ....... W1 Start DIMENSIONS: 10 pitches (min.) MM (INCHES) 10 pitches (min.) Direction of Feed Item Symbol DFN-2 Carrier Width A 0.80 ± 0.10 (0.031 ± 0.004) Carrier Length B 1.20 ± 0.10 (0.047 ± 0.004) Carrier Depth C 0.70 ± 0.10 (0.027 ± 0.004) Sprocket Hole d 1.55 ± 0.05 (0.061 ± 0.002) Reel Outside Diameter D 178 (7.008) Reel Inner Diameter D1 50.0 MIN. (1.969) Feed Hole Diameter D2 13.0 ± 0.20 (0.512 ± 0.008) Sprocket Hole Position E 1.75 ± 0.10 (0.069 ± 0.004) Punch Hole Position F 3.50 ± 0.05 (0.138 ± 0.002) Punch Hole Pitch P 4.00 ± 0.10 (0.157 ± 0.004) Sprocket Hole Pitch P0 4.00 ± 0.10 (0.157 ± 0.004) Embossment Center P1 2.00 ± 0.05 (0.079 ± 0.002) Overall Tape Thickness T 0.20 ± 0.10 (0.008 ± 0.004) Tape Width W 8.00 ± 0.20 (0.315 ± 0.008) Reel Width W1 Quantity per Reel -- 14.4 MAX. (0.567) 5000 REV. 12/15 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.