PM1210

T
PL
IA
N
M
CO
Applications
■ Formerly a
■ Mobile phones
■
■ Cellular phones
■
22
0
*R
oH
S
Features
■
■
■
model
High resistance to heat and humidity
Resistance to mechanical shock and
pressure
Accurate dimensions for automatic
surface mounting
Inductance range: 1 to 150 µH
RoHS compliant*
■ CTV, VCR, HIC, FDD
PM1210 Series - Chip Inductor
Electrical Specifications @25 °C
Inductance
Bourns
Part No.
General Specifications
Q
Min.
Test
Frequency
(MHz)
SRF
Min.
(MHz)
DCR
Max.
(Ω)
(mA)
400
IDC
µH
Tol. (%)
PM1210-1R0J-RC
1
±5
30
7.96
120
0.7
PM1210-1R2J-RC
1.2
±5
30
7.96
100
0.75
390
PM1210-1R5J-RC
1.5
±5
30
7.96
85
0.85
370
PM1210-1R8J-RC
1.8
±5
30
7.96
80
0.9
350
PM1210-2R2J-RC
2.2
±5
30
7.96
75
1
320
PM1210-2R7J-RC
2.7
±5
30
7.96
70
1.1
290
PM1210-3R3J-RC
3.3
±5
30
7.96
60
1.2
260
PM1210-3R9J-RC
3.9
±5
30
7.96
55
1.3
250
PM1210-4R7J-RC
4.7
±5
30
7.96
50
1.5
220
PM1210-5R6J-RC
5.6
±5
30
7.96
45
1.6
200
PM1210-6R8J-RC
6.8
±5
30
7.96
40
1.8
180
PM1210-8R2J-RC
8.2
±5
30
7.96
35
2
170
PM1210-100J-RC
10
±5
30
2.52
30
2.1
150
PM1210-120J-RC
12
±5
30
2.52
20
2.5
140
PM1210-150J-RC
15
±5
30
2.52
20
2.8
130
PM1210-180J-RC
18
±5
30
2.52
20
3.3
120
PM1210-220J-RC
22
±5
30
2.52
20
3.7
110
PM1210-270J-RC
27
±5
30
2.52
20
5
80
PM1210-330J-RC
33
±5
30
2.52
17
5.6
70
PM1210-390J-RC
39
±5
30
2.52
16
6.4
65
PM1210-470J-RC
47
±5
30
2.52
15
7
60
PM1210-560J-RC
56
±5
30
2.52
13
8
55
PM1210-680J-RC
68
±5
30
2.52
12
9
50
PM1210-820J-RC
82
±5
30
2.52
11
10
45
PM1210-101J-RC
100
±5
20
0.796
10
11
40
PM1210-121J-RC
120
±5
20
0.796
10
11
70
PM1210-151J-RC
150
±5
20
0.796
8
15
65
Operating Temperature
................................-40 °C to +125 °C
(Temperature rise included)
Storage Temperature
................................-40 °C to +125 °C
Resistance to Soldering Heat
.............................. 245 °C, 5 seconds
Temperature Rise ..........................20 °C
Rated Current .... Inductance drops 10 %
Materials
Core ..............................................Ferrite
Wire ...........................Enamelled copper
Enclosure............................. Epoxy resin
Terminal Finish ...................................Sn
Packaging ...... 2,000 pcs. per 7-inch reel
Product Dimensions
2.90 ± 0.2
(.114 ± .008)
2.20 ± 0.2
(.087 ± .008)
0.60 +0.3/-0.0
(.024 +.012/-.000)
3.20 ± 0.4
(.126 ± .016)
0.60 +0.3/-0.0
(.024 +.012/-.000)
Schematic
0.75 +0.2
(.030 +.008)
0.75 +0.2
(.030 +.008)
1.00 ± 0.2
(.039 ± .008)
2.50 ± 0.2
(.098 ± .008)
Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
EMEA: Tel: +36 88 520 390 • Fax: +36 88 520 211
The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device
performance may vary over time.
Users should verify actual device performance in their specific applications.
Recommended Layout
1.9 ~ 2.4
(.075 ~ .094)
1.2 ~ 1.3
(.047 ~ .051)
1.2 ~ 1.3
(.047 ~ .051)
1.6 ~ 2.0
(.063 ~ .079)
DIMENSIONS:
MM
(INCHES)
SRF0504
Series- -Chip
LineInductor
Filter
PM1210 Series
Soldering Profile
Temperature (°C)
275
<1> 5 seconds maximum
at +245 °C
225
<1> 245 °C
170 °C
183 °C
175
150 °C
60 seconds
maximum
125
Ramp Down
5 °C/second
120 -150 seconds
10 seconds minimum
75
Ramp Up
4 °C/second maximum
25
0
50
100
150
200
250
300
Time (Seconds)
Packaging Specifications
2.0 ± 0.5
(.079 ± .020)
178
DIA.
(7.008)
12.5
(.492)
DIA.
13.0
(.512)
21.0 ± 0.8
(.827 ± .031)
50.0 -0
(1.97 -0)
13.0
DIA.
(.512)
8.0
(.315)
10 +0
(.394 +0)
COMPONENTS
100
TRAILER
160
(6.299)
200
(7.874)
MIN.
NO COMPONENT
100
START
100
100
100
100
100
LEADER
4.0
(.157)
100
4.0
(.157)
END
USER DIRECTION OF FEED
MIN.
NO COMPONENT
QTY: 2000 PCS. PER REEL
DIMENSIONS:
MM
(INCHES)
REV. 08/14
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.