LGA Package 149-Lead (15mm × 15mm × 1.67mm) (Reference LTC DWG# 05-08-1944 Rev A) SEE NOTES DETAIL A aaa Z E Y X SEE NOTES A aaa Z 3 7 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 PIN 1 A B PIN “A1” CORNER C 4 b MOLD CAP D E SUBSTRATE F G H1 H2 F H Z // bbb Z D J K DETAIL B L DIA (0.500 ±0.025) 149x M e Ø eee S Z X Y N P R e G DETAIL A DETAIL B PACKAGE BOTTOM VIEW 7.0 6.0 5.0 4.0 3.0 2.0 0.25 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0.25 PACKAGE TOP VIEW 7.0 b 2. ALL DIMENSIONS ARE IN MILLIMETERS 7.0 6.0 5.0 4.0 0.50 ±0.025 Ø 149x 3.0 2.0 1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 SUGGESTED PCB LAYOUT TOP VIEW 3 LAND DESIGNATION PER JESD MO-222, SPP-010 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE DIMENSIONS SYMBOL A b D E e F G H1 H2 aaa bbb eee MIN 1.58 0.45 0.40 1.18 NOM 1.67 0.50 15.0 15.0 1.0 14.0 14.0 0.45 1.22 MAX 1.76 0.55 NOTES 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. THE TOTAL NUMBER OF PADS: 149 7 0.50 1.26 0.15 0.10 0.05 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY LTMXXXXXX µModule TOTAL NUMBER OF LGA PADS: 149 COMPONENT PIN “A1” TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION LGA 149 0316 REV A