LGA Package 144-Lead (15mm × 15mm × 4.41mm) (Reference LTC DWG # 05-08-1844 Rev C) aaa Z D X A Y SEE NOTES DETAIL A 3x, C (0.22 x45°) G e 7 b M b L K J H G E MOLD CAP SUBSTRATE E e D Z bbb Z 4 F H1 H2 PAD 1 CORNER F C DETAIL B B A aaa Z PACKAGE TOP VIEW PADS SEE NOTES 0.630 ±0.025 SQ. 143x 12 11 10 8 7 6 5 4 3 2 1 DIA 0.630 PAD 1 PACKAGE BOTTOM VIEW 3 eee S X Y 9 DETAIL B 2. ALL DIMENSIONS ARE IN MILLIMETERS 6.9850 5.7150 4.4450 3.1750 1.9050 0.6350 0.0000 0.6350 1.9050 3.1750 4.4450 5.7150 6.9850 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 6.9850 DETAIL A 3 LAND DESIGNATION PER JESD MO-222, SPP-010 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 5.7150 4.4450 DIMENSIONS 3.1750 SYMBOL A b D E e F G H1 H2 aaa bbb eee 1.9050 0.6350 0.0000 0.6350 1.9050 3.1750 4.4450 5.7150 6.9850 SUGGESTED PCB LAYOUT TOP VIEW MIN 4.31 0.60 0.36 3.95 NOM 4.41 0.63 15.00 15.00 1.27 13.97 13.97 0.41 4.00 MAX 4.51 0.66 0.46 4.05 0.15 0.10 0.05 TOTAL NUMBER OF LGA PADS: 144 NOTES 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. THE TOTAL NUMBER OF PADS: 144 7 COMPONENT PIN “A1” TRAY PIN 1 BEVEL ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY LTMXXXXXX µModule PACKAGE IN TRAY LOADING ORIENTATION LGA 144 1112 REV C