LGA Package 81-Lead (15mm × 11.25mm × 2.82mm) (Reference LTC DWG # 05-08-1868 Rev A) DETAIL A 8 A aaa Z SEE NOTES 7 6 5 4 3 2 7 1 PAD 1 A PAD “A1” CORNER b B 4 C D E MOLD CAP D F SUBSTRATE F G H 0.27 – 0.37 J Z // bbb Z 2.45 – 2.55 K e DETAIL B L aaa Z DETAIL B DIA (0.630) 81x PACKAGE BOTTOM VIEW 2. ALL DIMENSIONS ARE IN MILLIMETERS 4.445 3.175 1.905 0.000 0.635 0.635 1.905 3.175 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 eee S X Y 4.445 SEE NOTES G PACKAGE TOP VIEW 6.350 0.630 ±0.025 Ø 81x e b X Y E 3 LAND DESIGNATION PER JESD MO-222, SPP-010 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE DETAIL A 5.080 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. THE TOTAL NUMBER OF PADS: 81 DIMENSIONS 0.000 5.080 6.350 SUGGESTED PCB LAYOUT TOP VIEW SYMBOL A b D E e F G aaa bbb eee MIN 2.72 0.60 NOM 2.82 0.63 15.0 11.25 1.27 12.70 8.89 MAX 2.92 0.66 0.15 0.10 0.05 TOTAL NUMBER OF LGA PADS: 81 NOTES 7 ! COMPONENT PIN “A1” TRAY PIN 1 BEVEL PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY LTMXXXXXX µModule PACKAGE IN TRAY LOADING ORIENTATION LGA 81 1212 REV A