BGA Package 144-Lead (16mm × 16mm × 2.51mm) (Reference LTC DWG # 05-08-1503 Rev A) Z A A2 aaa Z SEE NOTES DETAIL A M L K J H G F E D C B 7 A 1 PIN “A1” CORNER 4 PIN 1 2 A1 b ccc Z 3 4 5 b1 MOLD CAP 6 F D 7 SUBSTRATE H1 8 Z // bbb Z H2 9 DETAIL B 10 11 e Øb (144 PLACES) e b Y E aaa Z 12 ddd M Z X Y eee M Z X SEE NOTES G DETAIL B PACKAGE SIDE VIEW PACKAGE TOP VIEW 3 PACKAGE BOTTOM VIEW DIMENSIONS 6.9850 0.630 ±0.025 Ø 144x 5.7150 4.4450 3.1750 1.9050 0.6350 0.0000 0.6350 1.9050 3.1750 4.4450 5.7150 6.9850 SUGGESTED PCB LAYOUT TOP VIEW 2. ALL DIMENSIONS ARE IN MILLIMETERS. DRAWING NOT TO SCALE DETAIL A 6.9850 5.7150 4.4450 3.1750 1.9050 0.6350 0.0000 0.6350 1.9050 3.1750 4.4450 5.7150 6.9850 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 SYMBOL A A1 A2 b b1 D E e F G H1 H2 aaa bbb ccc ddd eee MIN 2.31 0.50 1.81 0.60 0.60 0.36 1.45 NOM 2.51 0.60 1.91 0.75 0.63 16.00 16.00 1.27 13.97 13.97 0.41 1.50 MAX 2.71 0.70 2.01 0.90 0.66 0.46 1.55 0.15 0.10 0.20 0.30 0.15 TOTAL NUMBER OF BALLS: 144 3 BALL DESIGNATION PER JESD MS-028 AND JEP95 4 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE NOTES 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu 7 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY LTMXXXXXX µModule COMPONENT PIN “A1” TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION BGA 144 1015 REV A