BGA Package 144-Lead (15mm × 15mm × 4.92mm) (Reference LTC DWG # 05-08-1921 Rev A) DETAIL A Z A 12 A2 aaa Z SEE NOTES 11 10 9 8 7 6 5 4 3 2 7 1 M L b A1 ccc Z K J H b1 MOLD CAP G F D SUBSTRATE E Z H2 // bbb Z F H1 D DETAIL B C B PIN “A1” CORNER A ddd M Z X Y eee M Z X 0.0 DETAIL B PACKAGE SIDE VIEW PACKAGE TOP VIEW e b SEE NOTES Y E aaa Z 4 e Øb (144 PLACES) PIN 1 G 3 PACKAGE BOTTOM VIEW DETAIL A 6.9850 5.7150 4.4450 3.1750 1.9050 0.6350 0.0000 0.6350 1.9050 3.1750 4.4450 5.7150 6.9850 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS DIMENSIONS 6.9850 0.630 ±0.025 Ø 144x 5.7150 4.4450 3.1750 1.9050 0.6350 0.0000 0.6350 1.9050 3.1750 4.4450 5.7150 6.9850 SUGGESTED PCB LAYOUT TOP VIEW SYMBOL A A1 A2 b b1 D E e F G H1 H2 aaa bbb ccc ddd eee MIN 4.72 0.50 4.22 0.60 0.60 0.27 3.95 NOM 4.92 0.60 4.32 0.75 0.63 15.00 15.00 1.27 13.97 13.97 0.32 4.00 MAX 5.12 0.70 4.42 0.90 0.66 0.37 4.05 0.15 0.10 0.20 0.30 0.15 TOTAL NUMBER OF BALLS: 144 NOTES 3 BALL DESIGNATION PER JESD MS-028 AND JEP95 4 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu 7 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY LTMXXXXXX µModule COMPONENT PIN “A1” TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION BGA 144 1112 REV A