BGA Package 144-Lead (12mm × 12mm × 1.29mm) (Reference LTC DWG # 05-08-1967 Rev Ø) (Y144AH) A Z aaa Z SEE NOTES DETAIL A A2 12 11 10 9 8 7 6 5 4 3 2 7 1 A PIN “A1” CORNER 4 PIN 1 B A1 b ccc Z C D E b1 MOLD CAP F F SUBSTRATE D H Z // bbb Z G H1 H2 J DETAIL B K L Øb (144 PLACES) M ddd M Z X Y eee M Z X e b Y E aaa Z e DETAIL B PACKAGE SIDE VIEW PACKAGE TOP VIEW SEE NOTES G 3 PACKAGE BOTTOM VIEW NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 5.500 4.500 3.500 2.500 1.500 0.500 0.0000 0.500 1.500 2.500 3.500 4.500 5.500 DETAIL A DIMENSIONS 5.500 0.40 ±0.025 Ø 144x 4.500 3.500 2.500 1.500 0.500 0.0000 0.500 1.500 2.500 3.500 4.500 5.500 SUGGESTED PCB LAYOUT TOP VIEW 2. ALL DIMENSIONS ARE IN MILLIMETERS. DRAWING NOT TO SCALE SYMBOL A A1 A2 b b1 D E e F G H1 H2 aaa bbb ccc ddd eee MIN 1.24 0.27 0.92 0.35 0.30 0.22 0.65 NOM 1.29 0.32 0.97 0.40 0.35 12.00 12.00 1.00 11.00 11.00 0.27 0.70 MAX 1.34 0.37 1.02 0.45 0.40 0.32 0.75 0.15 0.10 0.12 0.15 0.08 TOTAL NUMBER OF BALLS: 144 3 BALL DESIGNATION PER JESD MS-028 AND JEP95 4 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE NOTES 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu 7 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY LTXXXXXX COMPONENT PIN “A1” TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION BGA 144 1213 REV Ø