LGA Package 28-Lead (4mm × 6mm × 0.94mm) (Reference LTC DWG # 05-08-1673 Rev Ø) SEE NOTES DETAIL A ddd Z aaa Z 28× 2× 23 A 22 PAD “A1” CORNER 4 7 28 1 PIN 1 NOTCH 0.25 × 45° b 1.33 0.20 A1 Z 0.20 DETAIL C E F E1 1.10 SEE NOTES SUBSTRATE MOLD CAP 3 DETAIL C e 6 0.40 H1 aaa Z DETAIL B PACKAGE TOP VIEW 1.2500 0.7500 0.2500 0.0000 0.2500 0.7500 1.2500 DETAIL B 1.7500 1.33 0.70 ±0.05 1.2500 0.20 0.7500 0.20 6.50 ±0.05 1.10 0.2500 0.0000 0.2500 0.7500 1.2500 1.7500 2.2500 4.50 ±0.05 SUGGESTED PCB LAYOUT TOP VIEW 0.20 0.65 NOM 0.94 0.02 0.25 4.00 6.00 0.50 4.50 2.50 2.40 4.40 0.24 0.70 ccc M Z X Y 2. ALL DIMENSIONS ARE IN MILLIMETERS DIMENSIONS MIN 0.85 0.01 0.22 8 PACKAGE BOTTOM VIEW DETAIL A 0.25 ±0.05 2.2500 D1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 0.05 PACKAGE OUTLINE e b G 0.40 SYMBOL A A1 b D E e F G D1 E1 H1 H2 aaa bbb ccc ddd eee fff 13 e/2 e 28b eee M Z X Y fff M Z 2× ccc M Z X Y Y X D 7 14 Z // bbb Z H2 MAX 1.03 0.03 0.28 NOTES 3 METAL FEATURES UNDER THE SOLDER MASK OPENING NOT SHOWN SO AS NOT TO OBSCURE THESE TERMINIALS AND HEAT FEATURES 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 5. PRIMARY DATUM -Z- IS SEATING PLANE 6 7 0.28 0.75 0.15 0.10 0.08 0.10 0.15 0.08 TOTAL NUMBER OF LGA PADS: 28 COMPONENT PIN “A1” TRAY PIN 1 BEVEL THE EXPOSED HEAT FEATURE IS SEGMENTED AND ARRANGED IN A MATRIX FORMAT. IT MAY HAVE OPTIONAL CORNER RADII ON EACH SEGMENT ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY LTMXXXXXX µModule PACKAGE IN TRAY LOADING ORIENTATION LGA 28 0615 REV Ø