LGA Package 20-Lead (4mm × 3mm × 0.75mm) (Reference LTC DWG # 05-08-1519 Rev Ø) aaa Z b 17 SEE NOTES 7 20 20× 2× ddd Z DETAIL A ccc M Z X Y A PAD “A1” CORNER 16 4 1 PIN 1 NOTCH 0.25 × 45° b 1.225 0.20 SEE NOTES F D1 Z A1 e DETAIL C aaa Z 10 Y E 20b eee M Z X Y fff M Z Z // bbb Z 2× e/2 e PACKAGE BOTTOM VIEW NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 DETAIL B 0.7500 0.2500 0.0000 0.2500 0.7500 DETAIL A DIMENSIONS PACKAGE OUTLINE 0.25 ±0.05 1.2500 0.20 0.70 ±0.05 0.20 0.7500 0.2500 0.0000 0.2500 4.50 ±0.05 1.225 0.725 0.7500 1.2500 3.50 ±0.05 SUGGESTED PCB LAYOUT TOP VIEW SYMBOL A A1 b D E e F G D1 E1 H1 H2 aaa bbb ccc ddd eee fff MIN 0.61 0.020 0.247 0.16 0.45 NOM 0.75 0.030 0.250 4.00 3.00 0.50 2.50 1.50 2.65 1.65 0.20 0.55 7 G H1 H2 e E1 DETAIL B PACKAGE TOP VIEW 6 11 DETAIL C X 0.275 0.725 SUBSTRATE MOLD CAP 3 6 ccc M Z X Y D MAX 0.84 0.040 0.253 0.40 2. ALL DIMENSIONS ARE IN MILLIMETERS 3 METAL FEATURES UNDER THE SOLDER MASK OPENING NOT SHOWN SO AS NOT TO OBSCURE THESE TERMINIALS AND HEAT FEATURES 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE NOTES 5. PRIMARY DATUM -Z- IS SEATING PLANE 6 7 0.24 0.60 0.10 0.10 0.08 0.10 0.15 0.08 TOTAL NUMBER OF LGA PADS: 20 THE EXPOSED HEAT FEATURE IS SEGMENTED AND ARRANGED IN A MATRIX FORMAT. IT MAY HAVE OPTIONAL CORNER RADII ON EACH SEGMENT ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY LTXXXXXX COMPONENT PIN “A1” TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION LGA 20 1115 REV Ø