LGA Package 16-Lead (3mm × 3mm × 0.94mm) ddd Z (Reference LTC DWG # 05-08-1516 Rev Ø) aaa Z 13 SEE NOTES 8 16 12 PAD “A1” CORNER 4 1 6 b D F A1 D1 Z SEE NOTES 0.375 e DETAIL C 0.375 3 9 4 SUBSTRATE MOLD CAP X DETAIL B 0.375 H1 H2 16b eee M Z X Y fff M Z Z // bbb Z e/2 e 0.7500 0.2500 0.0000 0.2500 0.7500 DIMENSIONS PACKAGE OUTLINE 0.25 ±0.05 0.7500 0.2500 0.0000 0.2500 0.7500 3.50 ±0.05 SUGGESTED PCB LAYOUT TOP VIEW 5 7 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 DETAIL A 0.70 ±0.05 e E1 PACKAGE BOTTOM VIEW DETAIL B 3.50 ±0.05 b G PACKAGE TOP VIEW 2× aaa Z 8 DETAIL C Y E PIN 1 NOTCH 0.25 × 45° ccc M Z X Y 16× 2× DETAIL A ccc M Z X Y A SYMBOL A A1 b D E e F G D1 E1 H1 H2 aaa bbb ccc ddd eee fff MIN 0.85 0.01 0.22 0.20 0.65 NOM 0.94 0.02 0.25 3.00 3.00 0.50 1.50 1.50 1.45 1.45 0.24 0.70 MAX 1.03 0.03 0.28 0.40 2. ALL DIMENSIONS ARE IN MILLIMETERS 3 METAL FEATURES UNDER THE SOLDER MASK OPENING NOT SHOWN SO AS NOT TO OBSCURE THESE TERMINIALS AND HEAT FEATURES 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE NOTES 5. PRIMARY DATUM -Z- IS SEATING PLANE 6 THE EXPOSED HEAT FEATURE MAY HAVE OPTIONAL CORNER RADII 7 CORNER SUPPORT PAD CHAMFER IS OPTIONAL 8 0.28 0.75 0.10 0.10 0.08 0.10 0.15 0.08 TOTAL NUMBER OF LGA PADS: 24 COMPONENT PIN “A1” TRAY PIN 1 BEVEL ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY LTMXXXXXX µModule PACKAGE IN TRAY LOADING ORIENTATION LGA 16 1015 REV Ø