oH V SC AV ER OM AI SIO PL LA N IA BL S NT E Features ■ *R ■ ■ ■ ■ Applications Lead free versions available RoHS compliant (lead free version)* Bidirectional EMI filtering ESD protection Protects two audio lines ■ ■ ■ ■ Cell phones PDAs and notebooks Digital cameras MP3 players and GPS 2FAN-C5R - Integrated Passive & Active Device using CSP General Information The 2FAN-C5R device, manufactured using Thin Film on Silicon technology, provides ESD protection and EMI filtering for the audio port of portable electronic devices such as cell phones, modems and PDAs. The device incorporates two low pass filter channels where each channel has a series 68 ohm resistor assuring a minimum of -25 dB attenuation from 800 MHz to 3 GHz. The device is suitable for EMI filtering of GSM, CDMA, W-CDMA, WLAN and Bluetooth frequencies. Each internal and external port of the two channels includes a TVS diode for ESD protection. The ESD protection provided by the component enables a data port to withstand a minimum ±8 KV Contact / ±15 KV Air Discharge per the ESD test method specified in IEC 61000-4-2. The device measures 1.00 mm x 1.33 mm and is available in a 5 bump CSP package intended to be mounted directly onto an FR4 printed circuit board. The CSP device meets typical thermal cycle and bend test specifications without the use of an underfill material. SOLDER BUMPS SILICON DIE E T E L O S B O Electrical & Thermal Characteristics Electrical Characteristics (TA = 25 °C unless otherwise noted) Per Line Specification Resistance Capacitance @ 0 V 1 MHz Rated Standoff Voltage Breakdown Voltage @ 1 mA Forward Voltage @ 10 mA Leakage Current @ 3.3 V Filter Attenuation @ 800 - 3000 MHz ESD Protection: IEC 61000-4-2 Contact Discharge Air Discharge Symbol Minimum Nominal Maximum Unit R C VWM VBR VF IR S21 55 32 68 40 5.0 81 48 Ω pF V V V µA dB 6.0 -25 0.8 0.1 -30 0.5 ±8 ±15 kV kV Thermal Characteristics (TA = 25 °C unless otherwise noted) Operating Temperature Range Storage Temperature Range Power Dissipation Per Resistor *RoHS Directive 2002/95/EC Jan 27 2003 including Annex Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TJ TSTG PD -40 -55 25 25 +85 +150 100 °C °C mW 2FAN-C5R - Integrated Passive & Active Device using CSP Mechanical Characteristics This is a Silicon-based device and is packaged using chip scale packaging technology. Solder bumps, formed on the Silicon die, provide the interconnect medium from die to PCB. The bumps are arranged on the die in a regular grid formation. The grid pitch is 0.5 mm and the dimensions for the packaged device are shown below. 0.432 - 0.559 (0.017 - 0.022) 0.3 DIA. (0.012) A1 C1 0.435 (0.017) B2 1.285 - 1.375 (0.051 - 0.054) 0.435 (0.017) E T E L O S B O A3 C3 0.330 - 0.457 (0.013 - 0.018) 0.180 - 0.280 (0.007 - 0.011) 0.180 - 0.280 (0.007 - 0.011) 0.245 - 0.255 (0.096 - 0.0100) 0.50 (0.020) 0.971 - 1.001 (0.038 - 0.039) Reliability Data DIMENSIONS = MILLIMETERS (INCHES) Reliability data exists and continues to be gathered on an ongoing basis for Bourns Integrated Passive and Active Devices. “Package level” testing of the integrity of the solder joint is carried out on an independent Daisy-Chain test device. A 25-Pin Daisy Chain component is available from Bourns for this purpose (part number 2TAD-C25R). This is a 5 x 5 array featuring 0.5 mm pitch solder bumps. The Distance to Neutral Point (DNP) on that component is larger than that of the 2FAN-C5R and is thus deemed a worse case for Thermal Cycle testing. “Silicon level” reliability performance will be assured by similarity to other integrated passive CSP devices from Bourns. Frequency Response 0 -5 -10 Gain (dB) -15 -20 2.5 Volts -25 -30 0 Volts -35 -40 -45 -50 0.1 1 10 100 1000 10000 Frequency (MHz) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 2FAN-C5R - Integrated Passive & Active Device using CSP PCB Design and SMT Processing Block Diagram The CSP device block diagram below includes the pin names and basic electrical connections associated with each channel. EXT1 R1: 68 OHMS Please consult the “Bourns Design Guide Using CSP” for notes on PCB design and SMT Processing. INT1 How to Order 2 FAN - C5R ____ GND Thinfilm Model Chipscale E T E L O S B O No. of Solder Bumps EXT2 INT2 R2: 68 OHMS Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Packaging Option R = Tape and Reel Packaged 3000 pcs. / 7 ” reel Terminations LF = Sn/Ag/Cu (lead free) Blank = Sn/Pb 2FAN-C5R - Integrated Passive & Active Device using CSP Device Pin Out The Pin-Out for the device is shown below with the bumps facing up. 1 EXT2 2 3 C INT2 Pin Out A1 C1 B2 B EXT1 INT1 A GND Packaging Function EXT1 EXT2 GND Pin Out A3 C3 E T E L O S B O Function INT1 INT2 The surface mount product will be dispensed in an 8 mm x 4 mm Tape and Reel format per EIA-481 standard. TOP SIDE VIEW (INTO COMPONENT POCKET) DIMENSIONS = 0.3 ± 0.05 (.01 ± .002) 0.3 MAX. (0.01) 0.76 ± 0.1 (.03 ± .004) (INCHES) 4.0 ± 0.1 (.16 ± .004) 1.5 ± 0.1/-0 (.06 ± .004/-0) DIA. 2.0 ± 0.05 (.08 ± .002) R MILLIMETERS 1.52 ± 0.1 (.06 ± .004) 1.18 ± 0.1 (.05 ± .004) 4.0 ± 0.1 (.16 ± .004) ORIENTATION OF COMPONENT IN POCKET 1.75 ± 0.1 (.07 ± .004) 8.0 ± 0.3 (.31 ± .01) 3.5 ± 0.05 (.14 ± .002) R 0.25 TYP. (0.010) BACKSIDE FACING UP Reliable Electronic Solutions Asia-Pacific: TEL +886- (0)2 25624117 • FAX +886- (0)2 25624116 Europe: TEL +41-41 768 5555 • FAX +41-41 768 5510 The Americas: TEL +1-951 781-5492 • FAX +1-951 781-5700 www.bourns.com COPYRIGHT© 2004, BOURNS, INC. LITHO IN U.S.A. 06/05 e/IPA0507 2FAN-C5R REV. B, 02/05 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.