PANASONIC EXC24CE360UP

Common mode Noise Filters
Common mode Noise Filters
Type:
EXC24CE
EXC24CF
■ Features
■ Recommended Applications
● Reduce the common mode noise and reform the signal
wave by high-coupled inductors
● The strong multi-layer structure provides high resistance
to reflow soldering heat and a high mounting reliability
● Magnetic shield type
● High-Q impedance : EXC24CF type is also available
● Small size (L 1.25 mm҂W 1.00 mm҂H 0.50 mm) and
low-profile
● USB data lines such as PCs, DSC, Mobile phone.
● LVDS data lines such as PCs, TV.
● IEEE1394 data lines such as PCs, TV.
■ Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
E
X
C
2
4
C
E
9
0
0
U
Size
Number of
Terminals
Product Code
Noise Filter
Code Dimensions(mm)
2
Type Characteristics
Coupled
type
4 Terminals C
1.25 ҂ 1.00 ҂ 0.50
(L) ҂ (W) ҂ (H)
■ Construction
Nominal Impedance
High speed
E Differential transmission
(for Mbps)
High speed
F Differential transmission
(for Mbps) High-Q type
Form
12
Suffix
The first two digits are
Code
Packing
significant figure of
U Embossed Carrier Taping
impedance value, and the
third one denotes the
number of zeros following
■ Dimensions in mm (not to scale)
F
Ferrite
C
D
E
A
B
Inner Conductor
Electrode
Type
(inches)
Dimensions (mm)
A
B
C
D
E
F
EXC24CE/CF 1.25±0.15 1.00±0.15 0.50±0.10 0.20±0.15 0.55±0.10 0.30±0.10
(0504)
Mass
(Weight)
[mg/pc.]
3
■ Circuit Configuration
4
3
4
3
1
2
1
2
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2008
Common mode Noise Filters
■ Ratings
Impedance (액) at 100 MHz
Common Mode
Differential Mode
Rated Voltage
(V DC)
Rated Current
(mA DC)
DC Resistance
(액)max.
EXC24CE360UP
36 액±25 %
20 액 max.
5
200
1.00
EXC24CE900U
90 액±25 %
15 액 max.
5
160
1.75
EXC24CE121U
120 액±25 %
18 액 max.
5
140
2.20
EXC24CE201U
200 액±25 %
20 액 max.
5
130
2.70
EXC24CF900U
90 액±25 %
20 액 max.
5
130
2.50
Part Number
■ Impedance Characteristics (Typical)
● EXC24CE360UP
● EXC24CE900U
1000
Impedance (액)
Impedance (액)
10000
1000
Common Mode
100
Common Mode
100
10
10
Differential Mode
11
10
100
Frequency (MHz)
1000
Differential Mode
1
10000
● EXC24CE121U
1
100
Frequency (MHz)
1000
10000
● EXC24CE201U
1000
1000
Common Mode
Impedance (액)
Common Mode
Impedance (액)
10
100
10
100
10
Differential Mode
Differential Mode
1
1
10
100
Frequency (MHz)
1000
10000
11
10
100
Frequency (MHz)
1000
10000
● EXC24CF900U
Impedance (액)
10000
1000
Common Mode
100
10
Differential Mode
1
1
10
100
Frequency (MHz)
1000
10000
● Measurement Circuit
(A) Common Mode
(B) Differential Mode
Z
Z
■ Packaging Methods(Taping) and Recommended Land Pattern Design
■ Recommended Soldering Conditions and Safety Precations
Refer 120 page.
Refer 121 page.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2010
Common mode Noise Filters
■ Packaging Methods (Taping)
● Standard Quantity
Part Number
Kind of Taping
EXC14C첸첸첸첸U
Embossed Carrier Taping
EXC18C첸첸첸첸U
EXC24C첸첸첸첸U
● Embossed Carrier Taping
t1
Pitch (P1)
Quantity
2 mm
10000 pcs./reel
4 mm
5000 pcs./reel
● Embossed Carrier Taping
P0
t1
Sprocket hole
Compartment
φD0
Chip component
B
P2
Tape running
direction
Compartment
A
B
W
F
E
P2
φD0
P0
EXC14C첸 2.0±0.1 4.0±0.1
t1
P2
P0
Chip component
P1
EXC14C첸 0.75±0.10 0.95±0.10 8.0±0.2 3.50±0.05 1.75±0.10 2.0±0.1
Type
P1
t2
(mm)
Embossed Carrier Dimensions
Type
F
W
F
P1
t2
Tape running direction
–0
1.5+0.1
0.25±0.05 0.85±0.15
(mm)
Embossed Carrier Dimensions
Type
A
B
W
EXC18C첸 1.00±0.10 1.80±0.10
EXC24C첸 1.20±0.15 1.45±0.15
t2
W
A
A
B
φ D0
E
E
Sprocket hole
Type
EXC18C첸
EXC24C첸
P2
2.0±0.1 4.0±0.1
E
P1
8.0±0.2 3.5±0.1 1.75±0.10 4.0±0.1
φD0
P0
F
t1
t2
1.5+0.1
0.25±0.05
–0
0.50±0.05
0.90±0.15
● Taping Reel
T
φC
φB
φD
E
φA
(mm)
Standard Reel Dimensions
W
t
Type
φA
φB
EXC14C첸
EXC18C첸 180.0±3.0 60.0±1.0
EXC24C첸
φC
φD
13.0±0.5
21.0±0.8
Type
E
W
T
t
EXC14C첸
EXC18C첸
EXC24C첸
2.0±0.5
9.0±0.3
11.4±1.5
1.2±0.2
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Jun. 2009
Common mode Noise Filters
■ Recommended Land Pattern Design
● EXC14C첸, EXC24C첸
● EXC18C첸
B
B
F
F
E
Type
A
D
E
D
C
C
D
A
D
E
Dimensions (mm)
A
B
C
D
E
F
EXC14C첸
0.80 to 1.00
0.80
0.30
0.25 to 0.35
0.30
0.20
EXC24C첸
1.60 to 2.00
0.95
0.70
0.45 to 0.65
0.35
0.25
Dimensions (mm)
Type
EXC18C첸
A
B
C
D
E
F
1.4
1.4
0.4
0.5
0.2
0.4
■ Recommended Soldering Conditions
Recommendations and precautions are described below
● Recommended soldering conditions for reflow
· Reflow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specified.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability before actual use.
Temperature
Peak
Preheating
Heating
For soldering (Example : Sn-37Pb)
Preheating
Main heating
Peak
Temperature
140 °C to 160 °C
Above 200 °C
235 ± 10 °C
Time
60 s to 120 s
30 s to 40 s
max. 10 s
For lead-free soldering (Example : Sn/3Ag/0.5Cu)
Temperature
Time
Preheating
150 °C to 170 °C
60 s to 120 s
Main heating
Above 230 °C
30 s to 40 s
Peak
max. 260 °C
max. 10 s
Time
● Flow soldering
· We do not recommend flow soldering , because flow soldering may cause bridges betwwn the electrodes.
<Repair with hand soldering>
● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder
each electrode for 3 seconds or less.
● Never touch this product with the tip of a soldering iron.
Safety Precations
The following are precautions for individual products. Please also refer to the precautions common to EMI Filters,
ESD Suppressors, Fuses, and MR Sensors shown on page EL113 of this catalog.
1. Use rosin-based flux or halogen-free flux.
2. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales person
in advance.
3. Do not apply shock to Common mode Noise Filters (hereafter called the filters) or pinch them with a hard tool
(e.g. pliers and tweezers). Otherwise, their bodies may be chipped, affecting their performance. Excessive mechanical stress may damage the filters. Handle with care.
4. Store the filters in a location with a temperature ranging from –5 °C to +40 °C and a relative humidity of 40 % to 60 %,
where there are no rapid changes in temperature or humidity.
5. Use the filters within half a year after the date of the outgoing inspection indicated on the packages.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Jun. 2009
Safety Precautions (Common precautions for EMI Filters, ESD Suppressors, Fuses, and MR Sensors)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifications with us in advance. The design and specifications in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as damage to
vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
✽ Systems equipped with a protection circuit and a protection device
✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
(1) Precautions for use
• These products are designed and manufactured for general and standard use in general electronic equipment
(e.g. AV equipment, home electric appliances, office equipment, information and communication equipment)
• These products are not intended for use in the following special conditions. Before using the products,
carefully check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. Electric Static Discharge (ESD) Environment (except ESD Suppressors)
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with
resin or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will
not affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components
or inflammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs).
• Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble flux may deteriorate the
performance or reliability of the products.
• Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water
residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival
at your company, provided that they remain packed as they were when delivered and stored at a temperature
of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the
date of arrival at your company)
The performance of EMI Filters is guaranteed for 6 months or a year from the outgoing inspection date indicated on
the packages, provided that they are stored at a temperature of -5 °C to +40 °C and a relative humidity of 40 %
to 60 %. Check the guarantee period in the specifications. The performance of Thermal Cutoffs is guaranteed for a
year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of
-10 °C to +40 °C and a relative humidity of 30 % to 75 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping
materials) may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Jan. 2008
– EL113 –