MCP37210-200 MCP37D10-200 200 Msps, 12-Bit Low-Power Single-Channel ADC Features • Sample Rates: 200 Msps • Signal-to-Noise Ratio (SNR) with fIN = 15 MHz and -1 dBFS: - 67 dBFS (typical) at 200 Msps • Spurious-Free Dynamic Range (SFDR) with fIN = 15 MHz and -1 dBFS: - 96 dBc (typical) at 200 Msps • Power Dissipation with LVDS Digital I/O: - 337 mW at 200 Msps • Power Dissipation with CMOS Digital I/O: - 304 mW at 200 Msps, output clock = 100 MHz • Power Dissipation Excluding Digital I/O: - 256 mW at 200 Msps • Power-Saving Modes: - 89 mW during Standby - 24 mW during Shutdown • Supply Voltage: - Digital Section: 1.2V, 1.8V - Analog Section: 1.2V, 1.8V • Selectable Full-Scale Input Range: up to 1.8 VP-P • Analog Input Bandwidth: 650 MHz • Output Interface: - Parallel CMOS, DDR LVDS • Output Data Format: - Two's complement or offset binary • Optional Output Data Randomizer • Digital Signal Post-Processing (DSPP) Options: - Decimation filters for improved SNR - Offset and Gain adjustment - Noise-Shaping Requantizer (NSR) - Digital Down-Conversion (DDC) with I/Q or fS/8 output (MCP37D10-200) • Built-In ADC Linearity Calibration Algorithms: - Harmonic Distortion Correction (HDC) - DAC Noise Cancellation (DNC) - Dynamic Element Matching (DEM) - Flash Error Calibration • Serial Peripheral Interface (SPI) • Package Options: - VTLA-124 (9 mm x 9 mm x 0.9 mm) - TFBGA-121 (8 mm x 8 mm) • No external reference decoupling capacitor required for TFBGA Package • Industrial Temperature Range: -40°C to +85°C Typical Applications • • • • • • Communication Instruments Microwave Digital Radio Cellular Base Stations Radar Scanners and Low-Power Portable Instruments Industrial and Consumer Data Acquisition System Device Offering(1) Part Number Sample Rate Resolution MCP37210-200 200 Msps 12 MCP37D10-200 200 Msps MCP37220-200 200 Msps MCP37D20-200 200 Msps 14 Note 1: Digital Decimation Digital (FIR Filters) Down-Conversion Noise-Shaping Requantizer Yes No Yes 12 Yes Yes Yes 14 Yes No No Yes Yes No Devices in the same package type are pin-compatible. 2015-2016 Microchip Technology Inc. DS20005395B-page 1 MCP37210-200 AND MCP37D10-200 Functional Block Diagram AVDD12 CLK+ CLK- AVDD18 GND DVDD12 Duty Cycle Correction Clock Selection DVDD18 DLL PLL Output Clock Control DCLK- Digital Signal Post-Processing: AIN+ - Decimation - Noise-Shaping Requantizer (NSR) - Offset/Gain Adjustment Pipelined ADC MCP37D10-200: AIN- - Digital Down-Conversion (DDC) VREF+ OVR VREF- WCK Output Control: VCM SENSE DCLK+ - CMOS - DDR LVDS Reference Generator Q[11:0] Internal Registers VBG REF+ DS20005395B-page 2 REF- SDIO SCLK CS 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 Description The MCP37210-200 is a single-channel 200 Msps 12-bit pipelined ADC, with built-in high-order digital decimation filters, Noise-Shaping Requantizer (NSR), gain and offset adjustment. Package Types Bottom View The MCP37D10-200 is also a single-channel 200 Msps 12-bit pipelined ADC, with built-in digital down-conversion in addition to the features offered by the MCP37210-200. Both devices feature harmonic distortion correction and DAC noise cancellation that enables highperformance specifications with SNR of 67 dBFS (typical) and SFDR of 96 dBc (typical). The output decimation filter option improves SNR performance up to 73.5 dBFS with the 64x decimation setting. The NSR feature reshapes the quantization noise level so that most of the noise power is pushed outside the frequency band of interest. As a result, SNR is improved within a selected frequency band of interest, while SFDR is not affected. Dimension: 9 mm x 9 mm x 0.9 mm (a) VTLA-124 Package. Bottom View The digital down-conversion option in the MCP37D10-200 can be utilized with the decimation and quadrature output (I and Q data) options, and offers great flexibility in various digital communication system designs, including cellular base-stations and narrow-band communication systems. These A/D converters exhibit industry-leading low-power performance with only 338 mW operation, while using the LVDS output interface at 200 Msps. This superior low-power operation, coupled with high dynamic performance, makes these devices ideal for portable high-frequency instrumentation, sonar, radar, and high-speed data acquisition systems. These devices also include various features designed to maximize flexibility in the user’s applications and minimize system cost, such as a programmable PLL clock, output data rate control and phase alignment, and programmable digital pattern generation. The device’s operational modes and feature sets are configured by setting up the user-programmable internal registers. Dimension: 8 mm x 8 mm x 1.08 mm Ball Pitch: 0.65 mm Ball Diameter: 0.4 mm (b) TFBGA-121 Package. The device samples the analog input on the rising edge of the clock. The digital output code is available after 23 clock cycles of data latency. Latency will increase if any of the digital signal post-processing (DSPP) options are enabled. The differential full-scale analog input range is programmable up to 1.8 VP-P. The ADC output data can be coded in two's complement or offset binary representation, with or without the data randomizer option. The output data is available with a full-rate CMOS or Double-Data-Rate (DDR) LVDS interface. The device is available in Pb-free VTLA-124 and TFBGA-121 packages. The device operates over the commercial temperature range of -40°C to +85°C. 2015-2016 Microchip Technology Inc. DS20005395B-page 3 MCP37210-200 AND MCP37D10-200 NOTES: DS20005395B-page 4 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 1.0 PACKAGE PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS Top View (Not to Scale) AVDD18 AIN- AVDD12 NC A68 A66 A67 A1 B56 A65 A64 B54 B55 A63 Note 2 A62 B52 B53 AIN+ AVDD12 VBG NC A60 A61 B50 B51 AVDD18 A59 A56 A57 B46 B47 SENSE REF- Note 2 A2 A58 B48 B49 REF+ AVDD12 VCM REF- A54 A55 B45 B43 CS DVDD18 Note 2 A49 B41 A48 A3 B2 B40 B3 DVDD12 B39 A4 NC VTLA-124 (9 mm x 9 mm x 0.9 mm) A5 B4 WCK/OVR+ B38 (OVR) A6 Q11/Q5+ B37 B5 A7 Note 2 B6 DVDD18 B36 EP (GND) Note 4 A8 B7 A9 A47 A46 A45 WCK/OVR(WCK) A44 Q10/Q5A43 Q8/Q4- Q9/Q4+ B35 A42 Q7/Q3+ B8 Q6/Q3- B34 B9 Q5/Q2+ B33 B10 Q3/Q1+ B32 B11 DVDD18 B31 NC A10 A11 A41 DVDD18 A40 Q4/Q2- A12 A39 Q2/Q1- A13 AVDD12 A38 Q1/Q0+ Q0/Q0- B12 B30 A14 A37 B29 B13 A15 AVDD12 B14 A16 A17 A51 A50 B42 B44 REF+ A52 A53 AVDD18 B1 NC SCLK SDIO A18 NC B15 A19 Note 2 CLK- B16 A20 B17 A21 Note 1 ADR0 SYNC B18 A22 B19 A23 CLK+ AVDD18 SLAVE A36 GND RESET DCLK+ B20 A24 B21 A25 B22 A26 DVDD12 CAL DVDD18 B23 A27 DCLK- B24 A28 DVDD18 B25 A29 TP Note 3 B26 A30 DVDD12 B27 A31 B28 A32 A35 A33 A34 NC Note 2 Note 1: Tie to GND or DVDD18. ADR1 is internally bonded to GND. 2: NC – Not connected pin. This pin can float or be tied to ground. 3: TP – Test pin. Leave this pin floating and do not tie to ground or supply. 4: Exposed pad (EP – back pad of the package) is the common ground (GND) for analog and digital supplies. Connect this pad to a clean ground reference on the PCB. FIGURE 1-1: VTLA-124 Package. 2015-2016 Microchip Technology Inc. DS20005395B-page 5 MCP37210-200 AND MCP37D10-200 TABLE 1-1: PIN FUNCTION TABLE FOR VTLA-124 Pin No. Name I/O Type Description A2, A22, A65, B1, B52 AVDD18 Supply A12, A56, A60, A63, B10, B11, B12, B13, B15, B16, B45, B49, B53 AVDD12 Supply voltage input (1.2V) for analog section A25, A30, B39 DVDD12 Supply voltage input (1.2V) for digital section A41, B24, B27, B31, B36, B43 DVDD18 Supply voltage input (1.8V) for digital section and all digital I/O EP GND Power Supply Pins Supply voltage input (1.8V) for analog section Exposed pad: Common ground pin for digital and analog sections ADC Analog Input Pins B54 AIN+ A64 AIN- Analog Input Differential analog input (+) A21 CLK+ Differential clock input (+) B17 CLK- Differential clock input (-) Differential analog input (-) Reference Pins(1) A57, B46 REF+ A58, B47 REF- Analog Output Differential reference voltage (+) Differential reference voltage (–) SENSE, Bandgap and Common-Mode Voltage Pins B48 SENSE Analog Input Analog input full-scale range selection. See Table 4-2 for SENSE voltage settings. A59 VBG Analog Output Internal bandgap output voltage. Connect a decoupling capacitor (2.2 µF) A55 VCM Common-mode output voltage for analog input signal. Connect a decoupling capacitor (0.1 µF)(2) Digital I/O Pins Digital Input SPI address selection pin (A0 bit). Tie to GND or DVDD18(3) B18 ADR0 A23 SLAVE B19 SYNC Digital Not used. Leave this pin floating(9) Input/Output B21 RESET Digital Input Reset control input: High: Normal operating mode Low: Reset mode(4) A26 CAL B22 DCLK+ LVDS: Differential digital clock output (+) CMOS: Digital clock output(6) A27 DCLK- LVDS: Differential digital clock output (-) CMOS: Unused (leave floating) DS20005395B-page 6 Not used. Tie to GND(9) Digital Output Calibration status flag digital output: High: Calibration is complete Low: Calibration is not complete(5) 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 TABLE 1-1: PIN FUNCTION TABLE FOR VTLA-124 (CONTINUED) Pin No. Name I/O Type Description B30 Q0/Q0- Digital Output A38 Q1/Q0+ Digital data output: CMOS = Q1 DDR LVDS = Q0+ A39 Q2/Q1- Digital data output: CMOS = Q2 DDR LVDS = Q1- B32 Q3/Q1+ Digital data output: CMOS = Q3 DDR LVDS = Q1+ A40 Q4/Q2- Digital data output: CMOS = Q4 DDR LVDS = Q2- B33 Q5/Q2+ Digital data output: CMOS = Q5 DDR LVDS = Q2+ B34 Q6/Q3- Digital data output: CMOS = Q6 DDR LVDS = Q3- A42 Q7/Q3+ Digital data output: CMOS = Q7 DDR LVDS = Q3+ B35 Q8/Q4- Digital data output: CMOS = Q8 DDR LVDS = Q4- A43 Q9/Q4+ Digital data output: CMOS = Q9 DDR LVDS = Q4+ A44 Q10/Q5- Digital data output: CMOS = Q10 DDR LVDS = Q5- B37 Q11/Q5+ Digital data output: CMOS = Q11 DDR LVDS = Q5+ B38 WCK/OVR+ (OVR) A45 WCK/OVR(WCK) (7) ADC Output Pins Digital data output: CMOS = Q0 DDR LVDS = Q0- OVR: Input over-range indication digital output(8) WCK: - MCP37210: No output - MCP37D10: Word clock synchronizes with digital output in I/Q data mode SPI Interface Pins A53 SDIO A54 SCLK B44 CS Digital SPI data input/output Input/Output Digital Input SPI serial clock input SPI Chip Select input Not Connected Pins A1, A3 - A7, A8 - A11, A13 - A20, A32 - A37, A46 - A52, A61 - A62, A66 - A68, B2 - B9, B14, B28, B29, B40, B41, B42, B50 - B51, B55, B56 NC 2015-2016 Microchip Technology Inc. These pins can be tied to ground or left floating. DS20005395B-page 7 MCP37210-200 AND MCP37D10-200 TABLE 1-1: PIN FUNCTION TABLE FOR VTLA-124 (CONTINUED) Pin No. Name I/O Type Description Pins that need to be grounded A24, A64, B20, B54 GND These pins are not supply pins, but need to be tied to ground. Output Test Pins A28 - A29, A31, B23, B25, B26 TP Digital Output Output test pins. Do not use. Always leave these pins floating. Do not tie to ground or supply. Notes: 1. 2. 3. 4. 5. 6. 7. 8. These pins are for the internal reference voltage output. They should not be driven. External decoupling circuit is required. See Section 4.3.3 “Decoupling Circuits for Internal Voltage Reference and Bandgap Output” for details. When VCM output is used for the common-mode voltage of analog inputs (i.e. by connecting to the center-tap of a balun), VCM pin should be decoupled with a 0.1 µF capacitor. ADR1 (for A1 bit) is internally bonded to GND (‘0’). If ADR0 is dynamically controlled, ADR0 must be held constant while CS is “Low”. The device is in Reset mode while this pin stays “Low”. On the rising edge of RESET, the device exits the Reset mode, initializes all internal user registers to default values and begins power-up calibration. CAL pin stays “Low” at power-up until the first power-up calibration is completed. When the first calibration has completed, this pin has “High” output. It stays “High” until the internal calibration is restarted by hardware or a Soft Reset command. In Reset mode, this pin is “Low”. In Standby and Shutdown modes, this pin will maintain the prior condition. The phase of DCLK relative to the data output bits may be adjusted depending on the operating mode. This is controlled differently depending on the configuration of the digital signal post-processing (DSPP) and PLL (or DLL). See also Addresses 0x52, 0x64 and 0x6D (Registers 5-7, 5-22 and 5-28) for more details. DDR LVDS: Two data bits are multiplexed onto each differential output pair. The output pins shown here are for “Even bit first”, which is the default setting of OUTPUT_MODE<1:0> in Address 0x62 (Register 5-20). The even data bits (Q0, Q2, Q4, Q6, Q8, Q10) appear when DCLK+ is “High”. The odd data bits (Q1, Q3, Q5, Q7, Q9, Q11) appear when DCLK+ is “Low”. See Addresses 0x65 (Register 5-23) and 0x68 (Register 5-26) for output polarity control. See Figure 2-2 for LVDS output timing diagrams. OVR: OVR will be held “High”’ when analog input overrange is detected. Digital signal post-processing (DSPP) will cause OVR to assert early relative to the output data. See Figure 2-2 for LVDS timing of these bits. WCK: Available for the I/Q output mode only in the MCP37D10. WCK is normally “Low” in I/Q output mode, and “High” when it outputs in-phase (I) data. (a) MCP37210 and MCP37D10 operating outside I/Q output mode: WCK/OVR+ is OVR, and WCK/OVR- is logic ‘0’ (not used). In DDR LVDS output mode, the rising edge of DCLK+ is OVR. (b) I/Q output mode in MCP37D10: In CMOS output mode, WCK/OVR+ is OVR and WCK/OVR- is WCK. WCK is synchronized to in-phase (I) data. In DDR LVDS output mode, WCK/OVR+ and WCK/OVR- are multiplexed. The rising edge of DCLK+ is OVR and the falling edge is WCK. 9. This pin function is not released yet. DS20005395B-page 8 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 Top View (Not to Scale) 1 2 3 4 5 VBG 6 7 8 9 10 11 TP1 AIN- AIN+ GND GND A SDIO VCM REF+ REF- B SCLK CS GND GND SENSE AVDD12 AVDD12 AVDD18 AVDD18 GND GND C WCK/ WCK/ OVR- OVR+ (WCK) (OVR) GND GND AVDD12 AVDD12 AVDD12 GND GND GND GND D Q10/Q5- Q11/Q5+ GND GND AVDD12 AVDD12 AVDD12 GND GND GND GND E Q8/Q4- Q9/Q4+ GND GND AVDD12 AVDD12 AVDD12 GND GND GND GND F Q6/Q3- Q7/Q3+ DVDD18 DVDD18 AVDD12 AVDD12 AVDD12 GND GND GND GND G Q4/Q2- Q5/Q2+ DVDD18 DVDD18 GND GND GND GND GND H Q2/Q1- Q3/Q1+ DVDD12 DVDD12 GND GND GND GND GND GND GND J Q0/Q0- Q1/Q0+ DVDD12 DVDD12 GND GND GND GND GND GND GND CAL GND SLAVE ADR0 ADR1 GND GND CLK- GND AVDD18 TP1 K TP2 TP2 TP2 DCLK- L TP2 TP2 TP2 DCLK+ RESET SYNC All others: AVDD12 AVDD12 GND CLK+ Analog Digital Supply Voltage Notes: Die dimension: 8 mm x 8 mm x 1.08 mm. Ball dimension: (a) Ball Pitch = 0.65 mm, (b) Ball Diameter = 0.4 mm. Solder sphere composition (SnAgCu). FIGURE 1-2: TFBGA-121 Package. Decoupling capacitors for reference pins and VBG are embedded in the package. 2015-2016 Microchip Technology Inc. DS20005395B-page 9 MCP37210-200 AND MCP37D10-200 TABLE 1-2: PIN FUNCTION TABLE FOR TFBGA-121 Ball No. Name I/O Type A1 SDIO Digital Input/Output A2 VCM Analog Output A3 REF+ A4 REF- A5 VBG A6 TP1 Description SPI data input/output Common-mode output voltage for analog input signal Connect a decoupling capacitor (0.1 µF)(1) Differential reference voltage (+/-). Decoupling capacitors are embedded in the TFBGA package. Leave these pins floating. Internal bandgap output voltage A decoupling capacitor (2.2 μF) is embedded in the TFBGA package. Leave this pin floating. Analog Output Analog test pins. Leave these pins floating. A7 Analog Input A8 AIN- A9 AIN+ A10 GND Supply B1 SCLK Digital Input B2 CS B3 GND Supply B5 SENSE Analog Input B6 AVDD12 Supply Differential analog input (-) Differential analog input (+) Common ground for analog and digital sections A11 SPI serial clock input SPI chip select input Common ground for analog and digital sections B4 Analog input range selection. See Table 4-2 for SENSE voltage settings. Supply voltage input (1.2V) for analog section B7 B8 Supply voltage input (1.8V) for analog section AVDD18 B9 B10 GND Supply Common ground for analog and digital sections B11 C1 C2 C3 Digital Output OVR: Input overrange indication digital output(2) WCK: - MCP37210: No output WCK/OVR+ (OVR) - MCP37D10: Word clock synchronizes with digital output in I/Q data mode WCK/OVR(WCK) GND Supply Common ground for analog and digital sections C4 C5 AVDD12 Supply voltage input (1.2V) for analog section C6 C7 C8 GND Common ground pin for analog and digital sections C9 C10 C11 D1 Q10/Q5- Digital Output Digital data output(3) CMOS = Q10 DDR LVDS = Q5- D2 Q11/Q5+ Digital data output(3) CMOS = Q11 DDR LVDS = Q5+ DS20005395B-page 10 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 TABLE 1-2: PIN FUNCTION TABLE FOR TFBGA-121 (CONTINUED) Ball No. Name I/O Type Description D3 GND Supply Common ground for analog and digital sections AVDD12 Supply Supply voltage input (1.2V) for analog section GND Supply Common ground for analog and digital sections E1 Q8/Q4- Digital Output Digital data output(3) CMOS = Q8 DDR LVDS = Q4- E2 Q9/Q4+ E3 GND D4 D5 D6 D7 D8 D9 D10 D11 Digital data output(3) CMOS = Q9 DDR LVDS = Q4+ Supply Common ground for analog and digital sections E4 E5 Supply voltage input (1.2V) for analog section AVDD12 E6 E7 E8 GND Common ground for analog and digital sections E9 E10 E11 F1 Q6/Q3- F2 Q7/Q3+ F3 DVDD18 Digital Output Digital data output(3) CMOS = Q7 DDR LVDS = Q3+ Supply F4 F5 Digital data output(3) CMOS = Q6 DDR LVDS = Q3- AVDD12 Supply voltage input (1.8V) for digital section. All digital input pins are driven by the same DVDD18 potential. Supply voltage input (1.2V) for analog section F6 F7 F8 GND Common ground for analog and digital sections F9 F10 F11 G1 Q4/Q2- Digital Output Digital data output(3) CMOS = Q4 DDR LVDS = Q2- G2 Q5/Q2+ Digital data output(3) CMOS = Q5 DDR LVDS = Q2+ 2015-2016 Microchip Technology Inc. DS20005395B-page 11 MCP37210-200 AND MCP37D10-200 TABLE 1-2: PIN FUNCTION TABLE FOR TFBGA-121 (CONTINUED) Ball No. Name I/O Type G3 DVDD18 Supply G4 G5 GND Description Supply voltage input (1.8V) for digital section. All digital input pins are driven by the same DVDD18 potential Common ground for analog and digital sections G6 G7 AVDD12 Supply Supply voltage input (1.2V) for analog section G8 G9 GND Common ground for analog and digital sections G10 G11 H1 Q2/Q1- Digital Output Digital data output(3) CMOS = Q2 DDR LVDS = Q1- H2 Q3/Q1+ Digital data output(3) CMOS = Q3 DDR LVDS = Q1+ H3 DVDD12 Supply Supply voltage input (1.2V) for digital section H4 H5 GND Common ground for analog and digital sections H6 H7 H8 H9 H10 H11 J1 Q0/Q0- Digital Output Digital data output(3) CMOS = Q0 DDR LVDS = Q0- J2 Q1/Q0+ Digital data output(3) CMOS = Q1 DDR LVDS = Q0+ J3 DVDD12 Supply DC supply voltage input pin for digital section (1.2V) J4 J5 GND Common ground for analog and digital sections J6 J7 J8 J9 J10 J11 K1 TP2 K2 Digital Output Output test pins. Do not use. Do not tie to ground or supply. Always leave this pin floating. K3 K4 DCLK- K5 CAL DS20005395B-page 12 LVDS: Differential digital clock output (-) CMOS: Unused (leave floating) Calibration status flag digital output(4): High: Calibration is complete Low: Calibration is not complete 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 TABLE 1-2: PIN FUNCTION TABLE FOR TFBGA-121 (CONTINUED) Ball No. Name I/O Type K6 GND Supply K7 SLAVE Digital Input K8 ADR0 SPI address selection pin (A0 bit). Tie to GND or DVDD18(5) K9 ADR1 SPI address selection pin (A1 bit). Tie to GND or DVDD18(5) K10 GND Supply Description Common ground pin for analog and digital sections Not used. Tie this pin to GND(8) Common ground for analog and digital sections K11 L1 TP2 L2 Digital Output Output test pins. Do not use. Do not tie to ground or supply. Always leave these pins floating. L3 L4 DCLK+ LVDS: Differential digital clock output (+) CMOS: Digital clock output(6) L5 RESET Digital Input Reset control input: High: Normal operating mode Low: Reset mode(7) L6 SYNC Digital Input/Output Not used. Leave this pin floating(8) L7 GND Supply L8 CLK+ Analog Input L9 CLK- L10 GND Supply L11 AVDD18 Analog Input Common ground for analog and digital sections Differential clock input (+) Differential clock input (-) Common ground for analog and digital sections Supply voltage input (1.8V) for analog section Notes: 1. 2. When VCM output is used for the common-mode voltage of analog inputs (i.e. by connecting to the center tap of a balun), the VCM pin should be decoupled with a 0.1 µF capacitor. OVR: OVR will be held “High”’ when analog input overrange is detected. Digital signal post-processing (DSPP) will cause OVR to assert early relative to the output data. See Figure 2-2 for timing of these bits. WCK: Available for the I/Q output mode only in the MCP37D10. In the I/Q output mode, WCK is normally “Low”, but “High” when it outputs in-phase (I) data. (a) MCP37210 and MCP37D10 operating outside I/Q output mode: WCK/OVR+ is OVR and WCK/OVR- is logic ‘0’ (not used). In DDR LVDS output mode, the rising edge of DCLK+ is OVR. (b) I/Q output mode in MCP37D10: In CMOS output mode, WCK/OVR+ is OVR and WCK/OVR- is WCK. WCK is synchronized to in-phase (I) data. In DDR LVDS output mode, WCK/OVR+ and WCK/OVR- are multiplexed. The rising edge of DCLK+ is OVR and the falling edge is WCK. 3. 4. 5. 6. 7. 8. DDR LVDS: Two data bits are multiplexed onto each differential output pair. The output pins shown here are for “Even bit first”, which is the default setting of OUTPUT_MODE<1:0> in Address 0x62 (Register 5-20). The even data bits (Q0, Q2, Q4, Q6, Q8, Q10) appear when DCLK+ is “High”. The odd data bits (Q1, Q3, Q5, Q7, Q9, Q11) appear when DCLK+ is “Low”. See Addresses 0x65 (Register 5-23) and 0x68 (Register 5-26) for output polarity control. See Figure 2-2 for LVDS output timing diagram. CAL pin stays “Low” at power-up until the first power-up calibration is completed. When the first calibration has completed, this pin has “High” output. It stays “High” until the internal calibration is restarted by hardware or a Soft Reset command. In Reset mode, this pin is “Low”. In Standby and Shutdown modes this pin will maintain the prior condition. If the SPI address is dynamically controlled, the Address pin must be held constant while CS is “Low”. The phase of DCLK relative to the data output bits may be adjusted depending on the operating mode. This is controlled differently depending on the configuration of the digital signal post-processing (DSPP) and PLL (or DLL). See also Addresses 0x52, 0x64 and 0x6D (Registers 5-7, 5-22 and 5-28) for more details. The device is in Reset mode while this pin stays “Low”. On the rising edge of RESET, the device exits the Reset mode, initializes all internal user registers to default values, and begins power-up calibration. This pin function is not released yet. 2015-2016 Microchip Technology Inc. DS20005395B-page 13 MCP37210-200 AND MCP37D10-200 NOTES: DS20005395B-page 14 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 2.0 ELECTRICAL CHARACTERISTICS 2.1 Absolute Maximum Ratings † Analog and Digital Supply Voltage (AVDD12, DVDD12)...................................................................................................... -0.3V to 1.32V Analog and Digital Supply Voltage (AVDD18, DVDD18)...................................................................................................... -0.3V to 1.98V All Inputs and Outputs with respect to GND....................................................................................................... -0.3V to AVDD18 + 0.3V Differential Input Voltage ................................................................................................................................................ |AVDD18 - GND| Current at Input Pins .................................................................................................................................................................... ±2 mA Current at Output and Supply Pins ......................................................................................................................................... ±250 mA Storage Temperature ................................................................................................................................................... -65°C to +150°C Ambient Temperature with Power Applied (TA)............................................................................................................ -55°C to +125°C Maximum Junction Temperature (TJ) ..........................................................................................................................................+150°C ESD Protection on all Pins ......................................................................................................................................................2 kV HBM Solder Reflow Profile ..............................................................................................See Microchip Application Note AN233 (DS00233) † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 2.2 Electrical Specifications TABLE 2-1: ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise specified, all parameters apply for TA = -40°C to +85°C, AVDD18 = DVDD18 = 1.8V, AVDD12 = DVDD12 = 1.2V, GND = 0V, SENSE = AVDD12, Differential Analog Input (AIN) = Sine wave with amplitude of -1 dBFS, fIN = 70 MHz, Clock Input = 200 MHz, fS = 200 Msps, PLL and decimation filters are disabled, Output load: CMOS data pin = 10 pF, LVDS = 100termination, LVDS driver current setting = 3.5 mA, +25°C is applied for typical value. Parameters Sym. Min. Typ. Max. Units Conditions Power Supply Requirements Analog Supply Voltage AVDD18 1.71 1.8 1.89 V AVDD12 1.14 1.2 1.26 V Digital Supply Voltage DVDD18 1.71 1.8 1.89 V DVDD12 1.14 1.2 1.26 V IDD_A18 — 0.03 0.1 mA at AVDD18 Pin IDD_A12 — 141 159 mA at AVDD12 Pin Digital Supply Current during Conversion IDD_D12 — 72 109 mA at DVDD12 Pin Digital I/O Current in CMOS Output Mode IDD_D18 — 27 — mA at DVDD18 Pin DCLK = 100 MHz 66 mA 3.5 mA mode — mA Note 1 Analog Supply Current Analog Supply Current during Conversion Digital Supply Current Digital I/O Current in LVDS Mode Measured at DVDD18 Pin IDD_D18 45 — 33 57 1.8 mA mode 5.4 mA mode Supply Current during Power-Saving Modes During Standby Mode During Shutdown Mode ISTANDBY_AN — 45 — ISTANDBY_DIG — 29 — IDD_SHDN — 20 — 2015-2016 Microchip Technology Inc. mA Address 0x00<4:3> = 1,1(2) mA Address 0x00<7,0> = 1,1(3) DS20005395B-page 15 MCP37210-200 AND MCP37D10-200 TABLE 2-1: ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise specified, all parameters apply for TA = -40°C to +85°C, AVDD18 = DVDD18 = 1.8V, AVDD12 = DVDD12 = 1.2V, GND = 0V, SENSE = AVDD12, Differential Analog Input (AIN) = Sine wave with amplitude of -1 dBFS, fIN = 70 MHz, Clock Input = 200 MHz, fS = 200 Msps, PLL and decimation filters are disabled, Output load: CMOS data pin = 10 pF, LVDS = 100termination, LVDS driver current setting = 3.5 mA, +25°C is applied for typical value. Parameters Sym. Min. Typ. Max. Units Conditions IDD_PLL — 17 — mA PDISS_ADC — 256 — mW Total Power Dissipation during Conversion with CMOS Output Mode PDISS_CMOS — 304 — mW fS = 200 Msps, DCLK = 100 MHz Total Power Dissipation during Conversion with LVDS Output Mode PDISS_LVDS — 337 — mW 3.5 mA mode PLL Circuit PLL Circuit Current PLL enabled. Included in analog supply current specification. Total Power Dissipation(4) Power Dissipation during Conversion, excluding Digital I/O 315 1.8 mA mode 358 5.4 mA mode PDISS_STANDBY — 89 — mW Address 0x00<4:3> = 1,1(2) PDISS_SHDN — 24 — mW Address 0x00<7,0> = 1,1(3) VPOR — 800 — mV VPOR_HYST — 40 — mV Applicable to AVDD12 only (POR tracks AVDD12) VSENSE GND — AVDD12 V VSENSE selects reference SENSE Pin Input Resistance RIN_SENSE — 694 — VSENSE = 0.8V — 154.8 — k VSENSE = 1.2V Current Sink into SENSE Pin ISENSE — 360 — µA VSENSE = 0.8V — 4.2 — µA VSENSE = 1.2V — 0.4 — V VSENSE = GND During Standby Mode During Shutdown Mode Power-on Reset (POR) Voltage Threshold Voltage Hysteresis SENSE Input(5,7,13) SENSE Input Voltage Reference and Common-Mode Voltages Internal Reference Voltage(7,8) VREF — 0.8 — VSENSE = AVDD12 — VSENSE — 400 mV < VSENSE < 800 mV Common-Mode Voltage Output VCM — 0.55 — V Available at VCM pin Bandgap Voltage Output VBG — 0.55 — V Available at VBG pin DS20005395B-page 16 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 TABLE 2-1: ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise specified, all parameters apply for TA = -40°C to +85°C, AVDD18 = DVDD18 = 1.8V, AVDD12 = DVDD12 = 1.2V, GND = 0V, SENSE = AVDD12, Differential Analog Input (AIN) = Sine wave with amplitude of -1 dBFS, fIN = 70 MHz, Clock Input = 200 MHz, fS = 200 Msps, PLL and decimation filters are disabled, Output load: CMOS data pin = 10 pF, LVDS = 100termination, LVDS driver current setting = 3.5 mA, +25°C is applied for typical value. Parameters Sym. Min. Typ. Max. Units AFS — 0.9 — VP-P Conditions Analog Inputs Full-Scale Differential Analog Input Range(5,7) Analog Input Bandwidth fIN_3dB VSENSE = GND — 1.8 — VSENSE = AVDD12 — 2.25 x VSENSE — 400 mV < VSENSE < 800 mV — 650 — 1.6 MHz AIN = -3 dBFS pF Note 5, Note 9 Differential Input Capacitance CIN Analog Input Leakage Current (AIN+, AIN- Pins) ILI_AH — — 50 µA VIH = AVDD12 ILI_AL -50 — — µA VIL = GND — 200 ADC Conversion Rate Conversion Rate Clock Inputs (CLK+, fS Msps Tested at 200 Msps CLK-)(10) Clock Input Frequency Differential Input Voltage Clock Jitter fCLK — — 250 VCLK_IN 300 — 800 mVP-P Note 5 CLKJITTER — 175 — fSRMS Note 5 49 50 51 % Duty cycle correction disabled 30 50 70 % Duty cycle correction enabled Clock Input Duty Cycle(5) Input Leakage Current at CLK Input Pin MHz Note 5 ILI_CLKH — — +110 µA VIH = AVDD12 ILI_CLKL -20 — — µA VIL = GND — — 12 bits Converter Accuracy(6) ADC Resolution (with no missing code) Offset Error — ±3.75 ±11.25 LSb Gain Error GER — ±0.5 — % of FS Integral Nonlinearity INL — ±0.375 — LSb DNL — ±0.1 — LSb CMRRDC — 70 — dB Differential Nonlinearity Analog Input Common-Mode Rejection Ratio 2015-2016 Microchip Technology Inc. DC measurement DS20005395B-page 17 MCP37210-200 AND MCP37D10-200 TABLE 2-1: ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise specified, all parameters apply for TA = -40°C to +85°C, AVDD18 = DVDD18 = 1.8V, AVDD12 = DVDD12 = 1.2V, GND = 0V, SENSE = AVDD12, Differential Analog Input (AIN) = Sine wave with amplitude of -1 dBFS, fIN = 70 MHz, Clock Input = 200 MHz, fS = 200 Msps, PLL and decimation filters are disabled, Output load: CMOS data pin = 10 pF, LVDS = 100termination, LVDS driver current setting = 3.5 mA, +25°C is applied for typical value. Parameters Dynamic Accuracy Sym. Min. SFDR 82 Typ. Max. Units Conditions (6,14) Spurious Free Dynamic Range Signal-to-Noise Ratio (for all resolutions) SNR ENOB Total Harmonic Distortion (first 13 harmonics) THD Two-Tone Intermodulation Distortion fIN1 = 15 MHz, fIN2 = 17 MHz dBc fIN = 15 MHz dBc fIN = 70 MHz dBFS fIN = 15 MHz fIN = 70 MHz 67 66.5 Effective Number of Bits (ENOB)(11) Worst Second or Third Harmonic Distortion 65.5 96 81 10.8 bits 83 HD2 or HD3 IMD — fIN = 15 MHz fIN = 70 MHz 10.8 89 dBc fIN = 15 MHz 81 dBc fIN = 70 MHz 95.8 dBc fIN = 15 MHz 82 dBc fIN = 70 MHz AIN = –7 dBFS, with two input frequencies 92.7 — dBc Digital Logic Input and Output (Except LVDS Output) Schmitt Trigger High-Level Input Voltage VIH 0.7 DVDD18 — DVDD18 V Schmitt Trigger Low-Level Input Voltage VIL GND — 0.3 DVDD18 V VHYST — 0.05 DVDD18 — V Low-Level Output Voltage VOL — — 0.3 V IOL = -3 mA, all digital I/O pins High-Level Output Voltage VOH DVDD18 – 0.5 1.8 — V IOL = + 3mA, all digital I/O pins CLOAD — 10 — pF From output pin to GND CINT — 4 — pF Note 5 Hysteresis of Schmitt Trigger Inputs (All digital inputs) Digital Data Output (CMOS Mode) Maximum External Load Capacitance Internal I/O Capacitance DS20005395B-page 18 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 TABLE 2-1: ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise specified, all parameters apply for TA = -40°C to +85°C, AVDD18 = DVDD18 = 1.8V, AVDD12 = DVDD12 = 1.2V, GND = 0V, SENSE = AVDD12, Differential Analog Input (AIN) = Sine wave with amplitude of -1 dBFS, fIN = 70 MHz, Clock Input = 200 MHz, fS = 200 Msps, PLL and decimation filters are disabled, Output load: CMOS data pin = 10 pF, LVDS = 100termination, LVDS driver current setting = 3.5 mA, +25°C is applied for typical value. Parameters Sym. Min. Typ. Max. Units Conditions Digital Data Output (LVDS Mode)(5) LVDS High-Level Differential Output Voltage VH_LVDS 200 300 400 mV 100 differential termination, LVDS bias = 3.5 mA LVDS Low-Level Differential Output Voltage VL_LVDS -400 -300 -200 mV 100 differential termination, LVDS bias = 3.5 mA LVDS Common-Mode Voltage VCM_LVDS 1 1.15 1.4 V Output Capacitance CINT_LVDS — 4 — pF Internal capacitance from output pin to GND Differential Load Resistance (LVDS) RLVDS — 100 — Across LVDS output pairs ILI_DH — — +1 µA VIH = DVDD18 ILI_DL -1 — — µA VIL = GND ILI_DH — — +6 µA VIH = DVDD18 ILI_DL -35 — — µA VIL = GND(12) Input Leakage Current on Digital I/O Pins Data Output Pins I/O Pins except Data Output Pins Notes: 1. 2. 3. 4. This 1.8V digital supply voltage is used for the digital I/O circuit, including SPI, CMOS and LVDS data output drivers. Standby mode: Most of the internal circuits are turned-off, except internal reference, clock, bias circuits and SPI interface. Shutdown mode: All circuits, including reference and clock, are turned-off, except the SPI interface. Power dissipation is calculated by using the following equation. (a) During operation: PDISS = VDD18 x (IDD_A18 + IDD_D18) + VDD12 x (IDD_A12 + IDD_D12), where IDD_D18 is the digital I/O current for LVDS or CMOS output. VDD18 = 1.8V and VDD12 = 1.2V are used for typical value calculation. (b) During Standby mode: PDISS_STANDBY = (ISTANDBY_AN + ISTANDBY_DIG) x 1.2V (c) During Shutdown mode: PDISS_SHDN = IDD_SHDN x 1.2 V 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. This parameter is ensured by design, but not 100% tested in production. This parameter is ensured by characterization, but not 100% tested in production. See Table 4-1 for details. Differential reference voltage output at REF+/- pins. VREF = VREF+ – VREF-. These references should not be driven. Input capacitance refers to the effective capacitance between differential input pin pair. See Figure 4-8 for details of clock input circuit. ENOB = (SINAD - 1.76)/6.02. This leakage current is due to internal pull-up resistor. RIN_SENSE is calculated from SENSE pin to virtual ground at 0.55V for 400 mV < VSENSE <800 mV. RSENSE = (VSENSE - 0.55V)/ISENSE. Dynamic performance is characterized with DIG_GAIN<7:0> = 0011-1000. 2015-2016 Microchip Technology Inc. DS20005395B-page 19 MCP37210-200 AND MCP37D10-200 TABLE 2-2: TIMING REQUIREMENTS – LVDS AND CMOS OUTPUTS Electrical Specifications: Unless otherwise specified, all parameters apply for TA = -40°C to +85°C, AVDD18 = DVDD18 = 1.8V, AVDD12 = DVDD12 = 1.2V, GND = 0V, SENSE = AVDD12, Differential analog input (AIN) = -1 dBFS sine wave, fIN = 70 MHz, Clock input = 200 MHz, fS = 200 Msps, PLL and decimation filters are disabled, Output load: CMOS data pin = 10 pF, LVDS = 100 termination, LVDS driver current setting = 3.5 mA, DCLK_PHDLY_DLL<2:0> = 000, +25°C is applied for typical value. Parameters Aperture Delay Symbol Min. Typ. Max. Units tA — 1 — ns Conditions Note 1 — 1 — — 50 — TLATENCY — 23 — Clocks Note 2, Note 4 Power-Up Calibration Time TPCAL — 3×226 — Clocks First 3×226 sample clocks after power-up Background Calibration Update Rate TBCAL — 230 — Clocks Per 230 sample clocks after TPCAL TRESET 5 — — ns Input Clock to Output Clock Propagation Delay tCPD — 5.7 — ns Output Clock to Data Propagation Delay tDC — 0.5 — ns Input Clock to Output Data Propagation Delay tPD — 5.8 — ns Input Clock to Output Clock Propagation Delay tCPD — 3.8 — ns Output Clock to Data Propagation Delay tDC — 0.7 — ns Input Clock to Output Data Propagation Delay tPD — 4.5 — ns Out-of-Range Recovery Time tOVR Output Clock Duty Cycle Pipeline Latency System Calibration Clocks Note 1 % Note 1 (1) RESET Low Time See Figure 2-6 for details(1) LVDS Data Output Mode(1,5) CMOS Data Output Mode(1) Note 1: 2: 3: 4: 5: This parameter is ensured by design, but not 100% tested in production. This parameter is ensured by characterization, but not 100% tested in production. tRISE = approximately less than 10% of duty cycle. Output latency is measured without using decimation filter and digital down-converter options. The time delay can be adjusted with the DCLK_PHDLY_DLL<2:0> setting. DS20005395B-page 20 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 S-1 Input Signal: S+1 S *S = Sample Point S+L-1 S+L tA Latency = L Cycles Input Clock: CLKCLK+ tCPD Digital Clock Output: DCLK tDC tPD Output Data: Q<N:0> S-L-1 S-L S-L+1 S-1 S S-L-1 S-L S-L+1 S-1 S Over-Range Output: OVR FIGURE 2-1: Timing Diagram – CMOS Output. S-1 Input Signal: S+1 S+L-1 S *S = Sample Point S+L tA Latency = L Cycles Input Clock: CLKCLK+ tCPD Digital Clock Output: DCLKDCLK+ tDC tPD Output Data: Q-[N:0] Q+[N:0] EVEN S-L-1 ODD S-L-1 EVEN S-L ODD S-L EVEN S-L+1 EVEN S-1 ODD S-1 EVEN S WCK S-L-1 OVR S-L-1 WCK S-L OVR S-L WCK S-L+1 WCK S-1 OVR S-1 WCK S Word-CLK/ Over-Range (Note Output: 1) (Note 1) WCK/OVRWCK/OVR+ Note 1: (a) MCP37210: WCK has no output. Note 1: (a) MCP37210: WCK has no output. (b) MCP37D10: WCK has output in I and Q output mode only. (b) MCP37D10: WCK has output in I and Q output mode only. FIGURE 2-2: Timing Diagram – LVDS Output with Even Bit First. 2015-2016 Microchip Technology Inc. DS20005395B-page 21 MCP37210-200 AND MCP37D10-200 TABLE 2-3: SPI SERIAL INTERFACE TIMING SPECIFICATIONS Electrical Specifications: Unless otherwise specified, all parameters apply for TA = -40°C to +85°C, AVDD18 = DVDD18 = 1.8V, AVDD12 = DVDD12 = 1.2V, GND = 0V, SENSE = AVDD12, Differential analog input (AIN) = -1 dBFS sine wave, fIN = 70 MHz, Clock input = 200 MHz, fS = 200 Msps (ADC core), PLL and decimation filters are disabled, Output load: CMOS data pin = 10 pF, LVDS = 100termination, LVDS driver current setting = 3.5 mA, +25°C is applied for typical value. All timings are measured at 50%. Parameters Symbol Min. Typ. Max. Units Conditions Serial Clock Frequency, fSCK = 50 MHz CS Setup Time tCSS 10 — — ns CS Hold Time tCSH 20 — — ns CS Disable Time tCSD 20 — — ns Data Setup Time tSU 2 — — ns Data Hold Time tHD 4 — — ns Serial Clock High Time tHI 8 — — ns Serial Clock Low Time tLO 8 — — ns Serial Clock Delay Time tCLD 20 — — ns Serial Clock Enable Time tCLE 20 — — ns Output Valid from SCK Low tDO — — 20 ns Output Disable Time tDIS — — 10 ns Note 1: Note 1 Note 1 This parameter is ensured by design, but not 100% tested in production. tCSD CS tSCK tCSS tHI tLO tCLE tCSH tCLD SCLK tSU SDIO (SDI) FIGURE 2-3: tHD MSb in LSb in SPI Serial Input Timing Diagram. CS tSCK tHI tLO tCSH SCLK tDO SDIO (SDO) FIGURE 2-4: DS20005395B-page 22 MSb out tDIS LSb out SPI Serial Output Timing Diagram. 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 Power-on Reset (POR) AVDD12 3×226 cycles (TPCAL) Power-up calibration complete: • Registers are initialized • Device is ready for correct conversion FIGURE 2-5: POR-Related Events: Register Initialization and Power-Up Calibration. RESET Pin tRESET Power-Up Calibration Time Stop ADC conversion FIGURE 2-6: TABLE 2-4: Start register initialization and ADC recalibration Recalibration complete: • CAL Pin: High • ADC_CAL_STAT = 1 RESET Pin Timing Diagram. TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise specified, all parameters apply for TA = -40°C to +85°C, AVDD18 = DVDD18 = 1.8V, AVDD12 = DVDD12 = 1.2V, GND = 0V, SENSE = AVDD12, Differential analog input (AIN) = -1 dBFS sine wave, fIN = 70 MHz, Clock input = 200 MHz, fS = 200 Msps, PLL and decimation filters are disabled, Output load: CMOS data pin = 10 pF, LVDS = 100 termination, LVDS driver current setting = 3.5 mA, +25°C is applied for typical value. Parameters Sym. Min. Typ. Max. Units TA -40 — +85 °C JA — 40.2 — °C/W Conditions (1) Temperature Ranges Operating Temperature Range Thermal Package Resistances(2) 121L Ball-TFBGA Junction-to-Ambient Thermal Resistance (8 mm x 8 mm) Junction-to-Case Thermal Resistance 124L VTLA (9 mm x 9 mm) Note 1: 2: JC — 8.4 — °C/W Junction-to-Ambient Thermal Resistance JA — 21 — °C/W Junction-to-Case (top) Thermal Resistance JC — 8.7 — °C/W Maximum allowed power dissipation (PDMAX) = (TJMAX – TA)/JA. This parameter value is achieved by package simulations. 2015-2016 Microchip Technology Inc. DS20005395B-page 23 MCP37210-200 AND MCP37D10-200 NOTES: DS20005395B-page 24 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 3.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise specified, all parameters apply for TA = -40°C to +85°C, AVDD18 = DVDD18 = 1.8V, AVDD12 = DVDD12 = 1.2V, GND = 0V, SENSE = AVDD12, Differential Analog Input (AIN) = -1 dBFS sine wave, fIN = 70 MHz, Clock Input = 200 MHz, fS = 200 Msps, PLL and decimation filters are disabled, DIG_GAIN<7:0> = 0011-1000. When NSR is enabled, 12-bit mode is used and the noise is calculated within the NSR bandwidth (25% of sampling frequency). 0 0 fCLK= 200MHz fIN =0+]#G%)6 SNR = 65.6dB (66.6dBFS) SFDR = 97.9dBc THD = -93.3dBc HD2 = -108.3dBc HD3 = -98.8dBc -40 -60 -80 3 2 -100 -120 0 20 4 40 60 5 7 6 80 fCLK= 200MHz fIN = 14.9MHz @-4.0dBFS SNR= 62.6dB (66.6dBFS) SFDR = 95.2dBc THD = -90.3dBc HD2 = -102.0G%F HD3 = -96.3G%F -20 Amplitude (dBFS) Amplitude (dBFS) -20 -40 -60 -80 -120 0 100 20 FIGURE 3-1: FFT for 14.9 MHz Input Signal: fS = 200 Msps, AIN = -1 dBFS. fCLK= 200MHz fIN = 69.9MHz @ -1.0dBFS SNR = 65.4dB (66.4dBFS) SFDR = 81.3dBc THD = -80.9dBc HD2 = -94.4dBc HD3 = -81.4dBc -20 3 -80 -100 6 -120 0 20 -40 -60 3 4 5 40 60 7 80 100 -100 6 -120 0 20 4 60 80 7 100 0 fCLK= 200MHz fIN = 151.0MHz @ -4.0dBFS fCLK= 200MHz fIN = 151.0MHz @ -1.0dBFS SNR = 65.0dB (66.0dBFS) SFDR = 75.7dBc THD = -75.3dBc HD2 = -88.5dBc HD3 = -75.7dBc -20 6NR = 62.2dB (66.2dBFS) -60 3 -80 2 4 7 20 40 6 5 60 80 FDR = 82.6dBc 7HD = -81.3dBc -40 HD2 = -90.1dBc HD3 = -82.6dBc -60 -80 100 FIGURE 3-3: FFT for 151 MHz Input Signal: fS = 200 Msps, AIN = -1 dBFS. 3 2 -100 Frequency (MHz) 2015-2016 Microchip Technology Inc. Amplitude (dBFS) Amplitude (dBFS) 40 2 FIGURE 3-5: FFT for 69.9 MHz Input Signal: fS = 200 Msps, AIN = -4 dBFS. 0 -120 0 5 Frequency (MHz) FIGURE 3-2: FFT for 69.9 MHz Input Signal: fS = 200 Msps, AIN = -1 dBFS. -100 100 -80 )UHTXHQF\0+] -40 80 fCLK= 200MHz fIN = 69.9MHz @ -4.0dBFS SNR = 62.4dB (66.4dBFS) SFDR = 89.6dBc THD = -87.0 dBc HD2 = -97.5 dBc HD3 = -90.1dBc 2 -20 60 7 0 Amplitude (dBFS) Amplitude (dBFS) -60 40 6 5 FIGURE 3-4: FFT for 14.9 MHz Input Signal: fS = 200 Msps, AIN = -4 dBFS. 0 -40 4 Frequency (MHz) Frequency (MHz) -20 3 2 -100 -120 0 4 7 20 40 5 6 60 80 100 Frequency (MHz) FIGURE 3-6: FFT for 151 MHz Input Signal: fS = 200 Msps, AIN = -4 dBFS. DS20005395B-page 25 MCP37210-200 AND MCP37D10-200 Note: Unless otherwise specified, all parameters apply for TA = -40°C to +85°C, AVDD18 = DVDD18 = 1.8V, AVDD12 = DVDD12 = 1.2V, GND = 0V, SENSE = AVDD12, Differential Analog Input (AIN) = -1 dBFS sine wave, fIN = 70 MHz, Clock Input = 200 MHz, fS = 200 Msps, PLL and decimation filters are disabled, DIG_GAIN<7:0> = 0011-1000. When NSR is enabled, 12-bit mode is used and the noise is calculated within the NSR bandwidth (25% of sampling frequency). 0 0 Amplitude (dBFS) -20 -40 -60 7 6 -80 5 2 -100 -120 0 20 3 4 40 60 fCLK= 200MHz fIN = 14.9MHz @ G%)6 SNR = 66.6dB (70.6dBFS) SFDR = 96.0dBc THD = -92.1dBc HD2 = -96.9dBc HD3 = -101.2dBc -20 Amplitude (dBFS) fCLK= 200MHz fIN =0+]#G%)6 SNR = 69.6dB (70.6dBFS) SFDR = 98.3dBc THD = -94.9dBc HD2 = -98.3dBc HD3 = -101.4dBc -40 -60 6 7 5 -80 2 -100 80 -120 0 100 20 Frequency (MHz) 60 80 100 0 fCLK= 200MHz fIN = 49.1MHz @ -1.0dBFS SNR = 69.3dB (70.3dBFS) SFDR = 84.1dBc THD = -83.6dBc HD2 = n/a HD3 = -84.1dBc -40 -60 4 6 3 fCLK= 200MHz fIN = 49.1MHz @ -4.0dBFS SNR = 66.4dB (70.4dBFS) SFDR = 89.5dBc THD = -87.0dBc HD2 = n/a HD3 = -89.8dBc -20 2 Amplitude (dBFS) -20 Amplitude (dBFS) 40 FIGURE 3-10: FFT for 14.9 MHz Input Signal with NSR enabled: NSR = 63, fS = 200 Msps, AIN = -4 dBFS. 0 -40 -60 -80 62 4 3 5 -100 -120 0 20 40 5 -100 7 60 80 -120 0 100 20 FIGURE 3-8: FFT for 49.1 MHz Input Signal with NSR enabled: NSR = 69, fS = 200 Msps, AIN = -1 dBFS. -20 -60 3 6 -80 5 -100 -120 0 60 80 100 0 fCLK= 200MHz fIN = 69.9MHz @ -1.0dBFS SNR = 69.7dB (70.7dBFS) SFDR = 98.6dBc THD = -95.1dBc HD2 = -99.0dBc HD3 = n/a Amplitude (dBFS) -40 40 FIGURE 3-11: FFT for 49.1 MHz Input Signal with NSR enabled: NSR = 69, fS = 200 Msps, AIN = -4 dBFS. 0 -20 7 Frequency (MHz) Frequency (MHz) Amplitude (dBFS) 4 Frequency (MHz) FIGURE 3-7: FFT for 14.9 MHz Input Signal with NSR enabled: NSR = 63, fS = 200 Msps, AIN = -1 dBFS. -80 3 20 40 2 4 60 80 7 -60 3 6 -80 5 -100 100 Frequency (MHz) FIGURE 3-9: FFT for 69.9 MHz Input Signal with NSR enabled: NSR = 75, fS = 200 Msps, AIN = -1 dBFS. DS20005395B-page 26 -40 fCLK= 200MHz fIN = 69.9MHz @ -4.0dBFS SNR = 66.8dB (70.8dBFS) SFDR = 96.9dBc THD = -98.9dBc HD2 = -104.7dBc HD3 = n/a -120 0 20 40 2 4 60 80 7 100 Frequency (MHz) FIGURE 3-12: FFT for 69.9 MHz Input Signal with NSR enabled: NSR = 75, fS = 200 Msps, AIN = -4 dBFS. 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 Note: Unless otherwise specified, all parameters apply for TA = -40°C to +85°C, AVDD18 = DVDD18 = 1.8V, AVDD12 = DVDD12 = 1.2V, GND = 0V, SENSE = AVDD12, Differential Analog Input (AIN) = -1 dBFS sine wave, fIN = 70 MHz, Clock Input = 200 MHz, fS = 200 Msps, PLL and decimation filters are disabled, DIG_GAIN<7:0> = 0011-1000. When NSR is enabled, 12-bit mode is used and the noise is calculated within the NSR bandwidth (25% of sampling frequency). Amplitude (dBFS) -40 -120 0 20 40 2F2+F1 2F1+F2 F1+F2 2F2-F1 F2-F1 2F1-F2 -60 -100 60 68 95 67 90 SNR (dBFS) 85 66 80 8 65 -40 100 -20 0 Frequency (MHz) 20 40 60 THPSHUDWXUH(C) FIGURE 3-13: Two-Tone FFT: fIN1 = 17.6 MHz and fIN2 = 20.4 MHz, AIN = -7 dBFS per Tone, fS = 200 Msps. FIGURE 3-16: SNR/SFDR vs.Temperature: fS = 200 Msps, fIN = 15 MHz. 68.5 SNR (dBFS) 60 66 SNR (dBFS) 80 SFDR (dBFS) SFDR (dBFS) 67 100 69 100 68 SNR (dBFS) I6 = 200 MVSV fIN = 15 MHz AIN = -1 dBFS SFDR (dBFS) SFDR (dBFS) Mode = Single fCLK= 200MHz f1 = 17.6MHz @ -7.0dBFS f2 = 20.4MHz @ -7.0dBFS 2f1-f2 = -91.0dBc 2f2-f1 = -92.1dBc SFDR = 90.0dBc -20 -80 100 69 F2 fS = 200 Msps f IN = 15 MHz A IN = -1 dBFS 95 SFDR (dBFS) 68 90 85 67.5 80 67 SFDR (dBFS) F1 SNR (dBFS) 0 SNR (dBFS) 75 66.5 FIGURE 3-14: Frequency. 50 100 75 Input Frequency (MHz) 125 68 66 SNR (dBFS) SNR (dBFS) 65 64 62 -70 105 -75 100 -80 95 -85 85 61 60 0.2 0.4 0.6 0.8 (External VCM (V) 1 70 1.32 75 -105 70 1.2 fS = 200 Msps fIN = 15 MHz AIN = -1 dBFS -95 -100 FIGURE 3-15: SNR/SFDR vs. VCM Voltage (Externally Applied): fS = 200 Msps, fIN = 15 MHz. 2015-2016 Microchip Technology Inc. 1.26 1.20 Supply Voltage (V) -90 HD2 (dBFS) 80 SFDR (dBFS) 59 58 57 0 110 90 63 1.14 FIGURE 3-17: SNR/SFDR vs. Supply Voltage: fS = 200 Msps, fIN = 15 MHz. SNR/SFDR vs. Input 69 67 66 1.08 40 150 HDN (dBFS) 25 SFDR (dBFS) 65 0 1.08 HD3 (dBFS) 1.14 1.20 1.26 Supply Voltage (V) 1.32 FIGURE 3-18: HD2/HD3 vs. Supply Voltage: fS = 200 Msps, fIN = 15 MHz. DS20005395B-page 27 MCP37210-200 AND MCP37D10-200 Note: Unless otherwise specified, all parameters apply for TA = -40°C to +85°C, AVDD18 = DVDD18 = 1.8V, AVDD12 = DVDD12 = 1.2V, GND = 0V, SENSE = AVDD12, Differential Analog Input (AIN) = -1 dBFS sine wave, fIN = 70 MHz, Clock Input = 200 MHz, fS = 200 Msps, PLL and decimation filters are disabled, DIG_GAIN<7:0> = 0011-1000. When NSR is enabled, 12-bit mode is used and the noise is calculated within the NSR bandwidth (25% of sampling frequency). 80 SFDR (dBc) 60 67 SNR (dBFS) 40 66 SNR (dB) 6 -100 -0 -80 -20 -0 20 67 40 SNR (dB) 6 100 -80 SNR (dBFS) 60 40 SNR (dB) 20 - 0 0 ,QSXW$PSOLWXGHdBFS) FIGURE 3-20: SNR/SFDR vs. Analog Input Amplitude with NSR enabled: fS = 200 Msps, fIN = 15 MHz, AIN ≤ -0.8 dBFS for NSR. NSR Filter Number = 63. DS20005395B-page 28 100 72 SNR (dBFS) SNR (dBFS) 80 - 0 0 120 73 SNR (dB), SFDR (dBc, dBFS) 100 72 - -20 SFDR (dBFS) SFDR (dBFS) - -0 FIGURE 3-21: SNR/SFDR vs. Analog Input Amplitude: fS = 200 Msps, fIN = 70 MHz. 120 00 -0 20 ,QSXW$PSOLWXGH((dBFS) 73 70 60 SNR (dBFS) 66 0 0 FIGURE 3-19: SNR/SFDR vs. Analog Input Amplitude: fS = 200 Msps, fIN = 15 MHz. SFDR (dBc) 80 SFDR (dBc) ,QSXW$PSOLWXGH((dBFS) 71 100 68 80 SNR (dBFS) 60 71 SFDR (dBc) 40 70 20 -00 SNR (dB), SFDR (dBc, dBFS) SNR (dBFS) 68 SFDR (dBFS) SNR (dBFS) 100 SNR (dB), SFDR (dBc, dBFS) SFDR (dBFS) 120 69 SNR (dB), SFDR (dBc, dBFS) 120 69 SNR (dB) -80 -0 -0 -20 0 0 ,QSXW$PSOLWXGHG%)6 FIGURE 3-22: SNR/SFDR vs. Analog Input Amplitude with NSR enabled: fS = 200 Msps, fIN = 70 MHz, AIN ≤ -0.8 dBFS for NSR. NSR Filter Number = 75. 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 Note: Unless otherwise specified, all parameters apply for TA = -40°C to +85°C, AVDD18 = DVDD18 = 1.8V, AVDD12 = DVDD12 = 1.2V, GND = 0V, SENSE = AVDD12, Differential Analog Input (AIN) = -1 dBFS sine wave, fIN = 70 MHz, Clock Input = 200 MHz, fS = 200 Msps, PLL and decimation filters are disabled, DIG_GAIN<7:0> = 0011-1000. When NSR is enabled, 12-bit mode is used and the noise is calculated within the NSR bandwidth (25% of sampling frequency). 76 90 68 85 SNR (dBFS) 65 64 SNR (dBFS) 60 62 60 64 55 80 58 62 60 50 100 150 50 100 150 200 6DPSOH5DWH (MVSV) 6DPSOH5DWH (MVSV) FIGURE 3-23: SNR/SFDR vs. Sample Rate (Msps): fIN = 15 MHz. 105 68 90 64 63 85 62 SNR (dBFS) 95 65 66 95 65 90 64 63 85 62 80 61 80 61 100 67 SFDR (dBFS) 66 105 68 100 67 60 60 59 5 %*-LOW 0.2 75 0.6 0.8 0.4 SENSE Pin Voltage 59 5 BG-LOW0.2 7 1.0 BG-HI*H FIGURE 3-24: SNR/SFDR vs. SENSE Pin Voltage: fS = 200 Msps, fIN = 15 MHz. 75 0 0.6 0.8 SENSE Pin Voltage 7 BBG-H,*H FIGURE 3-27: SNR/SFDR vs. SENSE Pin Voltage: fS = 200 Msps, fIN = 70 MHz. 10 0.5 0.802 Resolution = 12-Bit VSENSE = AVDD12 fS = 200 MVSV fIN = 15 MHz AIN = -1 dBFS 0.4 0.8 AVDD12 = 1.26V 0.3 0.798 Gain Error (dB) Reference Voltage (Volts) 110 70 69 69 SNR (dBFS) FIGURE 3-26: SNR/SFDR vs. Sample Rate (Msps): fIN = 70 MHz. 110 70 5 250 56 250 200 0.796 AVDD12 = 1.2V 0.794 0.792 AVDD12 = 1.14V 0.79 0.2 -0.4 -0.5 -40 60 80 100 120 Temperature (&) FIGURE 3-25: VREF Vs. Temperature. 2015-2016 Microchip Technology Inc. 0 -2 -4 -0.2 0.784 -40 40 4 Offset Error -0.1 0.786 20 6 2 0 -0.3 0 8 0.1 0.788 -20 SFDR (dBFS) 66 70 66 Gain Error Offset Error (LSB) SNR/dBFS 70 75 68 SNR/dBFS 95 72 SFDR (dBFS) 70 SFDR (dBFS) SFDR/dBFS 74 72 100 fIN = 70 MHz $,1 -1 dBFS SFDR/dBFS fIN = 15 MHz A,1 = -1 dBFS 80 74 105 78 -6 -8 -20 0 20 40 60 THPSHUDWXUHC) 80 -10 100 FIGURE 3-28: Gain and Offset Error Drifts Vs. Temperature using Internal Reference, with Respect to 25°C: fS = 200 Msps. DS20005395B-page 29 MCP37210-200 AND MCP37D10-200 Note: Unless otherwise specified, all parameters apply for TA = -40°C to +85°C, AVDD18 = DVDD18 = 1.8V, AVDD12 = DVDD12 = 1.2V, GND = 0V, SENSE = AVDD12, Differential Analog Input (AIN) = -1 dBFS sine wave, fIN = 70 MHz, Clock Input = 200 MHz, fS = 200 Msps, PLL and decimation filters are disabled, DIG_GAIN<7:0> = 0011-1000. When NSR is enabled, 12-bit mode is used and the noise is calculated within the NSR bandwidth (25% of sampling frequency). 2 fCLK= 200MHz, fIN = 4.0MHz INL = 0.307LSB, AIN= 88.9%FS 12-Bit Mode (4096 Codes) 1.5 0 -2 Attenuation (dB) INL Error (LSB) 1 0.5 0 -0.5 -1 -4 -6 -8 -10 -1.5 -12 -2 1024 3072 -14 0 4096 200 400 FIGURE 3-29: INL Error Vs. Output Code: fS = 200 Msps, fIN = 4 MHz. 800 1000 FIGURE 3-32: fCLK= 200MHz, fIN = 4.0MHz DNL = 0.168LSB, AIN= 88.9%FS 0.4 1200 Input Bandwidth. 320 160 0.6 AIN = -1 dBFS 300 140 12-Bit Mode (4096 Codes) 120 DNL Error (LSB) 600 Frequency (MHz) Output Code Current (mA) 0.2 0 -0.2 re Co C ) D r A I/O fo S er LVD w o pt lP e ta xc To (e IDD_A12 100 80 280 260 IDD_D12 240 220 60 Power (mW) 0 IDD_D18 40 200 20 180 -0.4 -0.6 0 1024 2048 3072 4096 0 0 50 100 150 200 250 160 300 Sampling Frequency (MHz) Output Code FIGURE 3-30: DNL Error Vs. Output Code: fS = 200 Msps, fIN = 4 MHz. FIGURE 3-33: Power Consumption vs. Sampling Frequency (LVDS Mode). 900k 800k Resolution = 12-Bit fS = 200 Msps Occurences 700k 600k 500k 400k 300k 200k 100k 0 -10 -5 FIGURE 3-31: fS = 200 Msps. DS20005395B-page 30 0 Output Code 5 10 Shorted Input Histogram: 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 4.0 THEORY OF OPERATION 4.1 ADC Core Architecture Figure 4-1 shows the simplified block diagram of the ADC core. The ADC core consists of six stages. All stages consist of a multi-level flash ADC and DAC. Except the last stage, all have a residue amplifier with a gain of 4. Dither is added in each of the first two stages. The digital outputs from all six stages are combined in a digital error correction logic block and digitally processed for the final 12-bit output. The MCP37210-200 and MCP37D10-200 devices are single-channel, low-power, 12-bit, 200 Msps Analog-to-Digital Converters (ADC) with built-in patented features that maximize performance. The features include Harmonic Distortion Correction (HDC), DAC Noise Cancellation (DNC), Dynamic Element Matching (DEM) and flash error calibration. These devices include various built-in digital signal post-processing features. The MCP37210-200 includes FIR decimation filters and a noise-shaping requantizer. The MCP37D10-200 includes Digital Down-Conversion (DDC) in addition to the features offered by the MCP37210-200. Digital gain and offset correction features are also offered in both devices. These built-in advanced digital signal post-processing sub-blocks, which are individually enabled and controlled, can be used for various special applications such as I/Q demodulation, digital down-conversion, and imaging. The first two stages include patented digital calibration features: • Harmonic Distortion Correction (HDC) algorithm that digitally measures and cancels ADC errors arising from distortions introduced by the residue amplifiers • DAC Noise Cancellation (DNC) algorithm that corrects DAC’s nonlinearity errors • Dynamic Element Matching (DEM) which randomizes DAC errors, thereby converting harmonic distortion to white noise When the device is first powered-up, it performs internal calibrations by itself and is running with default settings. From this point, the user can configure the device registers using the SPI command. These digital correction algorithms are first applied during the Power-on Reset sequence and then operate in the background during normal operation of the pipelined ADC. These algorithms automatically track and correct any environmental changes in the ADC. More details of the system correction algorithms are shown in Section 4.10 “System Calibration”. The device samples the analog input on the rising edge of the clock. The digital output code is available after 23 clock cycles of data latency. Latency will increase if any of the digital signal post-processing (DSPP) options are enabled. The output data can be coded in two’s complement or offset binary format and can be randomized using the user option. The output data is available through the CMOS or LVDS (Low-Voltage Differential Signaling) interface. Reference Generator Clock Generation REF REF AIN+ Analog Input AIN- REF Pipeline Stage 1 Pipeline Stage 2 HDC1, DNC1 HDC2, DNC2 REF Pipeline Stage 3 REF Pipeline Stage 4 REF Pipeline Stage 5 REF Flash Stage 6 Digital Error Correction User-Programmable Options Programmable Digital Signal Post-Processing (DSPP) 12-Bit Digital Output FIGURE 4-1: ADC Core Block Diagram. 2015-2016 Microchip Technology Inc. DS20005395B-page 31 MCP37210-200 AND MCP37D10-200 4.2 Supply Voltage (DVDD, AVDD, GND) MCP37XXX The device operates from two sets of supplies and a common ground: • Digital Supplies (DVDD) for the digital section: 1.8V and 1.2V • Analog Supplies (AVDD) for the analog section: 1.8V and 1.2V • Ground (GND): Common ground for both digital and analog sections. The supply pins require an appropriate bypass capacitor (ceramic) to attenuate high-frequency noise present in most application environments. The ground pins provide the current return path. These ground pins must connect to the ground plane of the PCB through a low-impedance connection. A ferrite bead can be used to separate analog and digital supply lines if a common power supply is used for both analog and digital sections. The voltage regulators for each supply need to have sufficient output current capabilities to support a stable ADC operation. 4.3 AVDD12 Hold Sample AIN+ 40 CS = 1.6 pF 5 pF VCM AVDD12 AIN- 40 5 pF FIGURE 4-2: Hold Sample CS = 1.6 pF Equivalent Input Circuit. Analog Input Circuit The analog inputs (AIN) of all MCP37XXX devices are a differential CMOS switched capacitor sample-and-hold circuit. Figure 4-2 shows the equivalent input structure of the device. The input impedance of the device is mostly governed by the input sampling capacitor (CS = 1.6 pF) and input sampling frequency (fS). The performance of the device can be affected by the input signal conditioning network (see Figure 4-3). The analog input signal source must have sufficiently low output impedance to charge the sampling capacitors (CS = 1.6 pF) within one clock cycle. A small external resistor (e.g. 5Ω) in series with each input is recommended as it helps reduce transient currents and dampens ringing behavior. A small differential shunt capacitor at the chip side of the resistors may be used to provide dynamic charging currents and may improve performance. The resistors form a low-pass filter with the capacitor and their values must be determined by application requirements and input frequency. The VCM pin provides a common-mode voltage reference (0.55V), which can be used for a center-tap voltage of an RF transformer or balun. If the VCM pin voltage is not used, the user may provide a commonmode voltage (0.55V) from another supply. DS20005395B-page 32 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 4.3.1.1 Differential Input Configuration The device achieves optimum performance when the input is driven differentially, where common-mode noise immunity and even-order harmonic rejection are significantly improved. If the input is single-ended, it must be converted to a differential signal in order to properly drive the ADC input. The differential conversion and common-mode application can be accomplished by using an RF transformer or balun with a center-tap. Additionally, one or more anti-aliasing filters may be added for optimal noise performance and should be tuned such that the corner frequency is appropriate for the system. Figure 4-3 shows an example of the differential input circuit with transformer. Note that the input driving circuits are terminated by 50 near the ADC side through a pair of 25 resistors from each input to the common-mode (VCM) from the device. The RF transformer must be carefully selected to avoid artificially high harmonic distortion. The transformer can be damaged if a strong RF input is applied or an RF input is applied while the MCP37XXX is powered off. The transformer has to be selected to handle sufficient RF input power. Figure 4-4 shows an input configuration example when a differential output amplifier is used. 1 VCM 5 Analog Input MABAES0060 6 1 4 1 6 MABAES0060 3 3 4 25 0.1 µF 25 5 FIGURE 4-3: Configuration. AIN+ 50 3.3 pF MCP37XXX 0.1 µF 4.3.1.2 Single-Ended Input Configuration Figure 4-5 shows an example of a single-ended input configuration. SNR and SFDR performance degrades significantly when the device is operated in a single-ended configuration. The unused negative side of the input should be AC-coupled to ground using a capacitor. VCM 10 µF Analog Input 0.1 µF 50 1 k VCM 1 k 10 µF 0.1 µF FIGURE 4-5: Configuration. 4.3.2 AIN+ R C AIN- Singled-Ended Input SENSE VOLTAGE AND INPUT FULL-SCALE RANGE The device has a bandgap-based differential internal reference voltage. The SENSE pin voltage is used to select the reference voltage source and configures the input full-scale range. A comparator detects the SENSE pin voltage and configures the full-scale input range into one of the three possible modes which are summarized in Table 4-1. Figure 4-6 shows an example of how the SENSE pin should be driven. The SENSE pin can sink or source currents as high as 360 µA across all operational conditions. Therefore, it may require a driver circuit, unless the SENSE reference source provides sufficient output current. 50 AIN- Transformer Coupled Input MCP1700 50 VCM 0.1 µF R1 0.1 µF 100 + CM - AIN+ 6.8 pF 100 AIN- SENSE MCP37XXX High-Speed Differential Amplifier Analog Input 0.1 µF R MCP37XXX ANALOG INPUT DRIVING CIRCUIT R2 (Note 1) Note 1: FIGURE 4-4: DC-Coupled Input Configuration with Preamplifier: the external signal conditioning circuit and associated component values are for reference only. Typically, the amplifier manufacturer provides reference circuits and component values. 2015-2016 Microchip Technology Inc. 0.1 µF MCP37XXX 4.3.1 This voltage buffer can be removed if SENSE reference is coming from a stable source (such as MCP1700) which can provide a sufficient output current to the SENSE pin. FIGURE 4-6: SENSE Pin Voltage Setup. DS20005395B-page 33 MCP37210-200 AND MCP37D10-200 TABLE 4-1: SENSE PIN VOLTAGE AND INPUT FULL-SCALE RANGE SENSE Pin Voltage (VSENSE) Selected Reference Voltage (VREF) Full-Scale Input Voltage Range (AFS) LSb Size (AFS/212) Tied to GND 0.4V 0.9 VP-P 219.72 µV Low-Reference Mode(2) 0.4V – 0.8 V 0.4V – 0.8V 0.9 VP-P to 1.8 VP-P(1) Adjustable Sense Mode(3) Tied to AVDD12 0.8V 1.8 VP-P 439.45 µV High-Reference Mode(2) Note 1: 2: 3: Condition AFS = 2.25 VP-P x (VSENSE) = 0.9 VP-P to 1.8 VP-P Based on internal bandgap voltage Based on VSENSE 4.3.2.1 SENSE Selection Vs. SNR/SFDR Performance The SENSE pin is used to configure the full-scale input range of the ADC. Depending on the application conditions, the SNR, SFDR and dynamic range performance are affected by the SENSE pin configuration. Table 4-2 summarizes these settings. • High-Reference Mode This mode is enabled by setting the SENSE pin to AVDD12 (1.2V). This mode provides the highest input full-scale range (1.8 VP-P) and the highest SNR performance. Figures 3-19 and 3-21 show SNR/SFDR versus input amplitude in High-Reference mode. • Low-Reference Mode This mode is enabled by setting the SENSE pin to ground. This mode is suitable for applications which have a smaller input full-scale range. This mode provides improved SFDR characteristics, but SNR is reduced by -6 dB compared to the High-Reference mode. • NSR Mode The use of Noise-Shaping Requantizer (NSR), further described in Section 4.6.1 “Noise-Shaping Requantizer (NSR)”, is best suited for applications which require an improved SNR and a wide dynamic range within a relatively narrow bandwidth. When the NSR is enabled, the noise level in a selected portion of the frequency band is reduced, while the noise level outside of this band is higher. This is an optimum selection for applications where the full Nyquist bandwidth of the ADC is not needed and where the digital signal post-processing of the ADC data is capable of removing the out-of-band noise added by the NSR. Figures 3-20 and 3-22 show the SNR/SFDR versus input amplitude when NSR is enabled. • SENSE Mode This mode is enabled by driving the SENSE pin with an external voltage source between 0.4V and 0.8V. This mode allows the user to adjust the input full-scale range such that SNR and dynamic range are optimized in a given application system environment. TABLE 4-2: SENSE VS. SNR/SFDR PERFORMANCE SENSE Descriptions High-Reference Mode (SENSE pin = AVDD12) High-input full-scale range (1.8 VP-P) and optimized SNR Low-Reference Mode (SENSE pin = ground) Low-input full-scale range (0.9 VP-P) and reduced SNR, but optimized SFDR Sense Mode (SENSE pin = 0.4V to 0.8V) Adjustable-input full-scale range (0.9 VP-P - 1.8 VP-P). Dynamic trade-off between High-Reference and Low-Reference modes can be used. Noise-Shaping Requantizer (NSR) Optimized SNR, but reduced usable bandwidth DS20005395B-page 34 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 4.3.3 4.3.3.1 DECOUPLING CIRCUITS FOR INTERNAL VOLTAGE REFERENCE AND BANDGAP OUTPUT Decoupling Circuits for REF Pins 4.4 External Clock Input For optimum performance, the MCP37XXX requires a low-jitter differential clock input at the CLK+ and CLK− pins. Figure 4-8 shows the equivalent clock input circuit. The internal reference is available at REF pins. This internal reference requires external capacitors for stable operation. VTLA-124 Package Device: Figure 4-7 shows the recommended circuit for the REF pins. A 2.2 µF ceramic capacitor with two additional optional capacitors (22 nF and 220 nF) is recommended between the positive and negative reference pins. The negative reference pin (REF-) is then grounded through a 220 nF capacitor. The capacitors should be placed as close to the ADC as possible with short and thick traces. Vias on the PCB are not recommended for this reference pin circuit. TFBGA-121 Package Device: The decoupling capacitor is embedded in the package. Therefore, no external circuit is required on the PCB. 4.3.3.2 MCP37XXX AVDD12 AVDD12 ~300 fF CLK+ 300 AVDD12 12 k 100 fF 2 pF Clock Buffer 300 CLK- 100 fF ~300 fF Decoupling Circuit for VBG Pin The bandgap circuit is a part of the reference circuit and the output is available at the VBG pin. VTLA-124 Package Device: VBG pin needs an external decoupling capacitor (2.2 µF) as shown in Figure 4-7. TFBGA-121 Package Device: The decoupling capacitor is embedded in the package. Therefore, no external circuit is required on the PCB. REF+ VBG REF2.2 µF 2.2 µF 22 nF (optional) FIGURE 4-8: Circuit. Equivalent Clock Input The clock input amplitude range is between 300 mVP-P and 800 mVP-P. When a single-ended clock source is used, an RF transformer or balun can be used to convert the clock into a differential signal for the best ADC performance. Figure 4-9 shows an example clock input circuit. The common-mode voltage is internally generated and a center-tap is not required. The back-to-back Schottky diodes across the transformer’s secondary current limit the clock amplitude to approximately 0.8 VP-P differential. This limiter helps prevent large voltage swings of the input clock while preserving the high slew rate that is critical for low jitter. 220 nF FIGURE 4-7: External Circuit for Voltage Reference and VBG pins for the VTLA-124 Package. Note that this external circuit is not required for the TFBGA-121 package. Note: The internal reference output (REF+/REF-) and bandgap voltage output (VBG) should not be driven. 2015-2016 Microchip Technology Inc. Clock Source Coilcraft WBC1-1TL 6 1 4 3 50 0.1 µF Schottky Diodes (HSMS-2812) MCP37XXX CLK+ 220 nF CLK- FIGURE 4-9: Transformer-Coupled Differential Clock Input Configuration. DS20005395B-page 35 MCP37210-200 AND MCP37D10-200 4.4.1 CLOCK JITTER AND SNR PERFORMANCE In a high-speed pipelined ADC, the SNR performance is directly limited by thermal noise and clock jitter. Thermal noise is independent of input clock and dominant term at low input frequency. On the other hand, the clock jitter becomes a dominant term as input frequency increases. Equation 4-1 shows the SNR jitter component, which is expressed in terms of the input frequency (fIN) and the total amount of clock jitter (TJitter), where TJitter is a sum of the following two components: • Input clock jitter (phase noise) • Internal aperture jitter (due to noise of the clock input buffer). EQUATION 4-1: SNR VS.CLOCK JITTER SNR Jitter dBc = – 20 log 10 2 f IN T Jitter where the total jitter term (Tjitter) is given by: T Jitter = 2 2 t Jitter , Clock Input + t Aperture , ADC The clock jitter can be minimized by using a high-quality clock source and jitter cleaners as well as a band-pass filter at the external clock input, while a faster clock slew rate improves the ADC aperture jitter. With a fixed amount of clock jitter, the SNR degrades as the input frequency increases. This is illustrated in Figure 4-10. If the input frequency increases from 10 MHz to 20 MHz, the maximum achievable SNR degrades about 6 dB. For every decade (e.g. 10 MHz to 100 MHz), the maximum achievable SNR due to clock jitter is reduced by 20 dB. 160 Jitter = 0.0625 ps 140 Jitter = 0.125 ps SNR (dBc) 120 Jitter = 0.25 ps Jitter = 0.5 ps Jitter = 1 ps 100 80 60 40 20 0 1 10 100 Input Frequency (fIN, MHz) FIGURE 4-10: DS20005395B-page 36 1000 SNR vs. Clock Jitter. 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 4.5 ADC Clock Selection This section describes the ADC clock selection and how to use the built-in Delay-Locked Loop (DLL) and Phase-Locked Loop (PLL) blocks. When the device is first powered-up, the external clock input (CLK+/-) is directly used for the ADC timing as default. After this point, the user can enable the DLL or PLL circuit by setting the register bits. Figure 4-11 shows the clock control blocks. Table 4-3 shows an example of how to select the ADC clock depending on the operating conditions. TABLE 4-3: ADC CLOCK SELECTION (EXAMPLE) Features (1) Operating Conditions Control Bit Settings Input Clock Duty Cycle Correction DCLK Output Phase Delay Control EN_DLL = 0 EN_DLL_DCLK = 0 EN_PHDLY = 0 Not Available Not Available EN_DLL = 1 EN_DLL_DCLK = 0 EN_PHDLY = 0 Available • DLL output is used • Decimation is not used EN_DLL = 1 EN_DLL_DCLK = 1 EN_PHDLY = 1 Available • DLL output is not used • Decimation is used(4) EN_DLL = 0 EN_DLL_DCLK = X EN_PHDLY = 1 Not Available EN_DLL = 1 EN_DLL_DCLK = 0 EN_PHDLY = 1 Available CLK_SOURCE = 0 (Default)(2) • DLL output is not used • Decimation is not used (Default)(3) Available CLK_SOURCE = 1(5) • Decimation is not used EN_DLL = X EN_DLL_DCLK = X EN_PHDLY = 0 • Decimation is used(4) EN_DLL = X EN_DLL_DCLK = X EN_PHDLY = 1 Note 1: 2: 3: 4: 5: Not Available Available See Addresses 0x52, 0x53, and 0x64 for bit settings. The sampling frequency (fS) of the ADC core comes directly from the input clock buffer Output data is synchronized with the output data clock (DCLK), which comes directly from the input clock buffer. While using decimation, output clock rate and phase delay are controlled by the digital clock output control block The sampling frequency (fS) is generated by the PLL circuit. The external clock input is used as the reference input clock for the PLL block. 2015-2016 Microchip Technology Inc. DS20005395B-page 37 MCP37210-200 AND MCP37D10-200 fS EN_DLL Clock Input (fCLK): < 250 MHz RESET_DLL EN_DLL_DCLK = 0 EN_DLL = 0 EN_CLK Input Clock Buffer DLL Circuit if CLK_SOURCE = 0 EN_PHDLY DCLK Phase Delay Duty Cycle Correction (DCC) DCLK_PHDLY_DLL<2:0> EN_DLL_DCLK EN_DUTY DLL Block See Addresses 0x52 and 0x64<7> for details if CLK_SOURCE = 1 if digital decimation is used See Addresses 0x7A, 0x7B, 0x7C, and 0x81 EN_PHDLY DCLK_PHDLY_DEC<2:0> Digital Output Clock Phase Delay Control (when decimation filter is used) DCLK Digital Output Clock Rate Control OUT_CLKRATE<3:0> Digital Clock Output Control Block See Addresses 0x64 and 0x02 for control parameters fREF (5 MHz to 250 MHz) EN_PLL EN_PLL_BIAS Loop Filter Control Parameters: C1: PLL_CAP1<4:0> C3 C2 C1 C3: PLL_CAP3<4:0> R1 PLL_REFDIV<9:0> R1: PLL_RES<4:0> ÷R EN_PLL_REFDIV C2: PLL_CAP2<4:0> if digital decimation is used See Addresses 0x7A, 0x7B, 0x7C, and 0x81 fS (80 MHz - 250 MHz) EN_PLL_OUT fQ Phase/Freq. Detector Current Charge Pump Loop Filter (3rd Order) fVCO Output/Div DCLK Delay DCLK VCO Loop Filter Control PLL_CHAGPUMP<3:0> ÷N PLL_PRE<11:0> EN_PLL_CLK DCLK_DLY_PLL<2:0> PLL_OUTDIV<3:0> PLL Output Control Block See Addresses 0x55 and 0x6D for control parameters PLL Block See Addresses 0x54 - 0x5D for Control Parameters Note: VCO output range is 1.075 GHz – 1.325 GHz by setting PLL_REFDIV<10:0> and PLL_PRE<11:0>, with fREF = 5 MHz - 250 MHz range. N = ---- f = 1.075 – 1.325 GHz VCO R REF f FIGURE 4-11: DS20005395B-page 38 Timing Clock Control Blocks. 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 4.5.1 USING DLL MODE Using the DLL block is the best option when output clock phase control is needed while the clock multiplication and the digital decimation are not required. When the DLL block is enabled, the user can control the input clock Duty Cycle Correction (DCC) and the output clock phase delay. TABLE 4-4: See the DLL block in Figure 4-11 for details. Table 4-4 summarizes the DLL control register bits. See also Table 4-18 for the output clock phase control. DLL CONTROL REGISTER BITS Control Parameter Register Descriptions CLK_SOURCE 0x53 CLK_SOURCE = 0: External clock input becomes input of the DLL block EN_DLL 0x52 EN_DLL = 1: Enable DLL block EN_DUTY 0x52 Input clock duty cycle correction control bit(1) EN_DLL_DCLK 0x52 DLL output clock enable bit EN_PHDLY 0x64 Enable digital output clock phase delay control DCLK_PHDLY_DLL<2:0> 0x52 Phase delay control bits of digital output clock (DCLK) when DLL is used(2) RESET_DLL 0x52 Reset control bit for the DLL block Note 1: 2: 4.5.1.1 Duty cycle correction is not recommended when a high-quality external clock is used. If decimation is used, the output clock phase delay is controlled using DCLK_PHDLY_DEC<2:0> in Address 0x64. Input Clock Duty Cycle Correction The ADC performance is sensitive to the clock duty cycle. The ADC achieves optimum performance with 50% duty cycle, and all performance characteristics are ensured when the duty cycle is 50% with ±1% tolerance. When CLK_SOURCE = 0, the external clock is used as the sampling frequency (fS) of the ADC core. When the external input clock is not high quality (for example, duty cycle is not 50%), the user can enable the internal clock duty cycle correction circuit by setting the EN_DUTY bit in Address 0x52 (Register 5-7). When duty cycle correction is enabled (EN_DUTY = 1), only the falling edge of the clock signal is modified (rising edge is unaffected). The duty cycle correction process adds additional jitter noise to the clock signal. Therefore, using this option is only recommended when an asymmetrical input clock source causes significant performance degradation or when the input clock source is not stable. Note: The clock duty cycle correction is only applicable when DLL black is enabled (EN_DLL=1). It is not applicable for the PLL output. 2015-2016 Microchip Technology Inc. 4.5.1.2 DLL Block Reset Event The DLL must be reset if the clock is removed or the clock frequency is changed. The DLL reset is controlled by using the RESET_DLL bit in Address 0x52 (Register 5-7). The DLL has an automatic reset with the following events: • During power-up: Stay in reset until the RESET_DLL bit is cleared. • When the SOFT_RESET command is issued while the DLL is enabled: the RESET_DLL bit is automatically cleared after reset. 4.5.2 USING PLL MODE The PLL block is mainly used when clock multiplication is needed. When CLK_SOURCE = 1, the sampling frequency (fS) of the ADC core is coming from the internal PLL block. The recommended PLL output clock range is from 80 MHz to 250 MHz. The external clock input is used as the PLL reference frequency. The range of the clock input frequency is from 5 MHz to 250 MHz. Note: The PLL mode is only supported for sampling frequencies between 80 MHz and 250 MHz. DS20005395B-page 39 MCP37210-200 AND MCP37D10-200 4.5.2.1 PLL Output Frequency and Output Control Parameters The internal PLL can provide a stable timing output ranging from 80 MHz to 250 MHz. Figure 4-11 shows the PLL block using a charge-pump-based integer N PLL and the PLL output control block. The PLL block includes various user control parameters for the desired output frequency. Table 4-5 summarizes the PLL control register bits and Table 4-6 shows an example of register bit settings for the PLL charge pump and loop filter. The PLL block consists of: • • • • • • Reference Frequency Divider (R) Prescaler - which is a feedback divider (N) Phase/Frequency Detector (PFD) Current Charge Pump Loop Filter – a 3rd order RC low-pass filter Voltage-Controlled Oscillator (VCO) The external clock at the CLK+ and CLK- pins is the input frequency to the PLL. The range of input frequency (fREF) is from 5 MHz to 250 MHz. This input frequency is divided by the reference frequency divider (R) which is controlled by the 10-bit-wide PLL_REFDIV<9:0> setting. In the feedback loop, the VCO frequency is divided by the prescaler (N) using PLL_PRE<11:0>. The ADC core sampling frequency (fS), ranging from 80 MHz to 250 MHz, is obtained after the output frequency divider (PLL_OUTDIV<3:0>). For stable operation, the user needs to configure the PLL with the following limits: • Input clock frequency (fREF) = 5 MHz to 250 MHz • Charge pump input frequency = 4 MHz to 50 MHz (after PLL reference divider) • VCO output frequency = 1.075 to 1.325 GHz • PLL output frequency after output divider = 80 MHz to 250 MHz The charge pump is controlled by the PFD, and forces sink (DOWN) or source (UP) current pulses onto the loop filter. The charge pump bias current is controlled by the PLL_CHAGPUMP<3:0> bits: approximately 25 µA per step. The loop filter consists of a 3rd order passive RC filter. Table 4-6 shows the recommended settings of the charge pump and loop filter parameters, depending on the charge pump input frequency range (output of the reference frequency divider). When the PLL is locked, it tracks the input frequency (fREF) with the ratio of dividers (N/R). The PLL operating status is monitored by the PLL status indication bits: <PLL_VCOL_STAT> and <PLL_VCOH_STAT> in Address 0xD1 (Register 5-69). EQUATION 4-2: VCO OUTPUT FREQUENCY N fVCO = ---- fREF = 1.075 GHz to 1.325 GHz R Where: N = 1 to 4095 controlled by PLL_PRE<11:0> R = 1 to 1023 controlled by PLL_REFDIV<9:0> See Addresses 0x54 to 0x57 (Register 5-9 to 5-12) for these bit settings. The tuning range of the VCO is 1.075 GHz to 1.325 GHz. N and R values must be chosen such that the VCO is within this range. In general, lower values of the VCO frequency (fVCO) and higher values of the charge pump frequency (fQ) should be chosen to optimize the clock jitter. Once the VCO output frequency is determined to be within this range, the user needs to set the final ADC sampling frequency (fS) with the PLL output divider using PLL_OUTDIV<3:0>. Equation 4-3 shows how to obtain the ADC core sampling frequency: EQUATION 4-3: SAMPLING FREQUENCY fVCO f S = -------------------------------------- = 80 MHz to 250 MHz PLL_OUTDIV Table 4-7 shows an example of generating fS = 200 MHz output using the PLL control parameters. 4.5.2.2 PLL Calibration The PLL should be recalibrated following a change in clock input frequency or in the PLL Configuration register bit settings (Addresses 0x54 - 0x57; Registers 5-9 – 5-12). The PLL can be calibrated by toggling the PLL_CAL_TRIG bit in Address 0x6B (Register 5-27) or by sending a SOFT_RESET command (See Address 0x00, Register 5-1). The PLL calibration status is observed by the PLL_CAL_STAT bit in Address 0xD1 (Register 5-69). 4.5.2.3 Monitoring of PLL Drifts The PLL drifts can be monitored using the status monitoring bits in Address 0xD1 (Register 5-69). Under normal operation, the PLL maintains lock across all temperature ranges. It is not necessary to actively monitor the PLL unless extreme variations in the supply voltage are expected or if the input reference clock frequency has been changed. Equation 4-2 shows the VCO output frequency (fVCO) as a function of the two dividers and reference frequency: DS20005395B-page 40 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 TABLE 4-5: PLL CONTROL REGISTER BITS Control Parameter Register Descriptions PLL Calibration and Status Indication Bits PLL Global Control Bits EN_PLL 0x59 Master enable bit for the PLL circuit EN_PLL_OUT 0x5F Master enable bit for the PLL output EN_PLL_BIAS 0x5F Master enable bit for the PLL bias EN_PLL_REFDIV 0x59 Master enable bit for the PLL reference divider PLL Block Setting Bits PLL_REFDIV<9:0> 0x54-0x55 PLL reference divider (R) (See Table 4-7) PLL_PRE<11:0> 0x56-0x57 PLL prescaler (N) (See Table 4-7) PLL_CHAGPUMP<3:0> 0x58 PLL charge pump bias current control: from 25 µA to 375 µA, 25 µA per step PLL_RES<4:0> 0x5A PLL loop filter resistor value selection (See Table 4-6) PLL_CAP3<4:0> 0x5B PLL loop filter capacitor 3 value selection (See Table 4-6) PLL_CAP2<4:0> 0x5D PLL loop filter capacitor 2 value selection (See Table 4-6) PLL_CAP1<4:0> 0x5C PLL loop filter capacitor 1 value selection (See Table 4-6) PLL_OUTDIV<3:0> 0x55 PLL output divider (See Table 4-7) DCLK_DLY_PLL<2:0> 0x6D Delay DCLK output up to 15 cycles of VCO clocks EN_PLL_CLK 0x6D EN_PLL_CLK = 1 enable PLL output clock to the ADC circuits PLL_VCOL_STAT 0xD1 PLL drift status monitoring bit PLL_VCOH_STAT 0xD1 PLL drift status monitoring bit 0x6B Forcing recalibration of the PLL SOFT_RESET 0x00 PLL is calibrated when exiting soft reset mode PLL_CAL_STAT 0xD1 PLL auto-calibration status indication PLL Output Control Bits PLL Drift Monitoring Bits PLL Block Calibration Bits PLL_CAL_TRIG 2015-2016 Microchip Technology Inc. DS20005395B-page 41 MCP37210-200 AND MCP37D10-200 TABLE 4-6: RECOMMENDED PLL CHARGE PUMP AND LOOP FILTER BIT SETTINGS PLL Charge Pump and Loop Filter Parameter fQ = fREF/PLL_REFDIV fQ < 5 MHz 5 MHz ≤ fQ < 25 MHz fQ ≥ 25 MHz PLL_CHAGPUMP<3:0> 0x04 0x04 0x04 PLL_RES<4:0> 0x1F 0x1F 0x07 PLL_CAP3<4:0> 0x07 0x02 0x07 PLL_CAP2<4:0> 0x07 0x01 0x08 PLL_CAP1<4:0> 0x07 0x01 0x08 TABLE 4-7: EXAMPLE OF PLL CONTROL BIT SETTINGS FOR fS = 200 MHz WITH fREF = 100 MHz PLL Control Parameter Value Descriptions fREF 100 MHZ fREF is coming from the external clock input Target fS(1) 200 MHZ ADC sampling frequency 1.2 GHZ Range of fVCO = 1.0375 GHz – 1.325 GHz 10 MHZ fQ = fREF/PLL_REFDIV (See Table 4-6) Target Target fVCO(2) fQ(3) PLL Reference Divider (R) 10 PLL_REFDIV<9:0> = 0x0A PLL Prescaler (N) 120 PLL_PRE<11:0> = 0x78 PLL Output Divider 6 Note 1: 2: 3: PLL_OUTDIV<3:0> = 0x06 fS = fVCO/PLL_OUTDIV = 1.2 GHz/6 = 200 MHz fVCO = (N/R) x fREF = (12) x 100 MHz = 1.2 GHz fQ should be maximized for the best noise performance DS20005395B-page 42 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 Digital Signal Post-Processing (DSPP) Options While the device converts the analog input signals to digital output codes, the user can enable various Digital Signal Post-Processing (DSPP) options for special applications. These options are individually enabled or disabled by setting the Configuration bits. Table 4-8 summarizes the DSPP options that are available for each device. TABLE 4-8: DIGITAL SIGNAL POST PROCESSING (DSPP) OPTIONS Digital Signal Post Processing Option Offering Device FIR Decimation Filters MCP37210-200 Digital Gain and Offset Correction MCP37D10-200 Noise-Shaping Requantizer (NSR) Digital Down-Conversion (DDC) 4.6.1 MCP37D10-200 NOISE-SHAPING REQUANTIZER (NSR) The device includes 11-bit and 12-bit digital Noise-Shaping Requantizer (NSR) options. When this function is enabled (see Register 5-35), the output data bits are requantized to 11-bit or 12-bit, respectively. The NSR reshapes the requantization noise function, which pushes most of the noise outside the frequency band of interest. As a result, the noise floor within the selected bandwidth becomes lower. To ensure the stability of the NSR, the input signal to the NSR should be limited to less than -0.8 dBFS (90% of full-scale). This can be achieved either by limiting the analog input level or by adjusting the digital gain control. See Section 4.7 “Digital Offset and Digital Gain Settings” and Registers 5-60 to 5-67 for details on the digital gain control. Input levels higher than -0.8 dBFS may corrupt the NSR output and should be avoided. The NSR block consists of a series of filters, which are selectable using the NSR<6:0> register bit setting. Each filter is defined by a specific percentage bandwidth and center frequency. The available percentage bandwidths are: • 11-bit mode: 22% and 25% of the sampling frequency • 12-bit mode: 25% and 29% of the sampling frequency The center frequency of the band is tunable such that the frequency band of interest can be placed anywhere within the Nyquist band. Table 4-9 lists all NSR-related registers. Equations 4-4 and 4-5 describe the NSR bandwidth of the 11-bit and 12-bit option, respectively. 2015-2016 Microchip Technology Inc. EQUATION 4-4: NSR BANDWIDTH FOR 11-BIT OPTION (a) 22% BW: f Center 0.26 ---------------- = 0.12 + ---------- NSR fS 20 where 0 NSR 20 (b) 25% BW: f Center 0.25 ---------------- = 0.125 + ---------- NSR – 21 fS 20 where 21 NSR 41 EQUATION 4-5: NSR BANDWIDTH FOR 12-BIT OPTION (a) 25% BW: f Center 0.25 ---------------- = 0.125 + ---------- NSR – 42 fS 20 where 42 NSR 62 (b) 29% BW: f Center 0.2 ---------------- = 0.15 + ------- NSR – 63 fS 12 where 63 NSR 76 In these two equations, NSR is the NSR filter number. Figure 4-12 shows a graphical demonstration of the NSR bandwidth, which is a percentage of the ADC sampling frequency. I,1 $PSOLWXGHG%)6 4.6 I/ I&HQWHU I+ ELWQRLVHIORRU WKHUPDOQRLVHIORRU I% I6 )UHTXHQF\ I6 FIGURE 4-12: Graphical Demonstration of the NSR Filter’s Transfer Function. Note that fB is controlled as a percentage of the sampling frequency (fS). DS20005395B-page 43 MCP37210-200 AND MCP37D10-200 Tables 4-10 and 4-11 show the NSR filter selections. The selectable filters (tuning word) for each mode are: • 11-bit mode: 0 to 41 • 12-bit mode: 42 to 76 In the plots, SNR and SFDR are measured within the 12-bit-mode NSR bandwidth (25% of the sampling frequency). When the NSR block is disabled, the ADC data is provided directly to the output. NSR does not affect harmonic distortion. Various FFT spectrum plots when NSR is applied are shown in Figures 3-7 to 3-12. SNR and SFDR performance versus input amplitude when NSR is enabled are shown in Figures 3-20 and 3-22. TABLE 4-9: REGISTER CONTROL PARAMETERS FOR NSR Control Parameter Register Descriptions NSR Enable Bits <EN_NSR_11> 0x7A Enable 11-bit NSR <EN_NSR_12> 0x7A Enable 12-bit NSR 0x78 NSR filter settings 0x78 Resets NSR in the event of overload NSR Filter Setting NSR<6:0> NSR Block Reset Control <EN_NSR_RESET> TABLE 4-10: 11-BIT NSR FILTER SELECTION(1) NSR Filter No. fB /f (1) f (Tuning Word) Center S (% of fS) TABLE 4-11: NSR<6:0> 12-BIT NSR FILTER SELECTION(1) NSR Filter No. fB /f (1) NSR<6:0> f (% of fS) (Tuning Word) Center S 0 0.12 22 000-0000 42 0.125 25 010-1010 1 0.133 22 000-0001 43 0.1375 25 010-1011 2 0.146 22 000-0010 44 0.15 25 010-1100 — — — 19 0.367 22 61 0.3625 25 011-1101 001-0011 62 0.375 25 011-1110 0.15 29 011-1111 20 0.38 22 001-0100 63 21 0.125 25 001-0101 64 0.1667 29 100-0000 22 0.1375 25 001-0110 65 0.1833 29 100-0001 23 0.15 25 001-0111 — — — — 75 0.35 29 100-1011 0.3667 29 100-1100 40 0.3625 25 010-1000 76 41 0.375 25 010-1001 Note 1: Note 1: Filters 0 - 41 are used for 11-bit mode only. If these are used for 12-bit mode, the output becomes unknown state. DS20005395B-page 44 Filters 42 - 76 are used for 12-bit mode only. If these are used for 11-bit mode, the output becomes unknown state. 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 4.6.2 DECIMATION FILTERS Figure 4-13 shows a simplified decimation filter block diagram, and Table 4-13 summarizes the related control parameters for using decimation filters. • MCP37210-200: Decimation rate is controlled by FIR_A<8:0> in Addresses 0x7A and 0x7B (Registers 5-35 - 5-36). The FIR_A<8:0> provides a maximum programmable decimation rate up to 512x using nine cascaded decimation stages. • MCP37D10-200: (a) When DDC mode is not required, only FIR A is used; (b) When digital down-conversion (DDC) is used for I and Q data filtering, both FIR A and FIR B filters are used (see Figure 4-13). In this case, both are set to the same decimation rate. Note that stage 1A in FIR A is unused: the user must clear FIR_A<0> in Address 0x7A (Register 5-35). 4.6.2.2 In the MCP37D10, the decimation feature can be used in conjunction with DDC. When DDC is enabled, the I and Q outputs can be decimated using I and Q channels. Since the half-band filter already includes a 2x decimation, the maximum possible decimation rate is 256x for each I and Q data using FIR A and FIR B filters (128x each from FIR A and B). Note: DECIMATION RATE VS. SNR PERFORMANCE Decimation Rate SNR (dBFS) 1x 65.9 2x 67.8 4x 69.9 Output Data Rate and Clock Phase Control when Decimation is used When decimation is used, it also reduces the output clock rate and output bandwidth by a factor equal to the decimation rate applied: the output clock rate is therefore no longer equal to the ADC sampling clock. The user needs to adjust the output clock and data rates in Address 0x02 (Register 5-3) based on the decimation applied. This allows the output data to be synchronized to the output data clock. Digital Gain/Offset adjustment and DDC for I/Q data options occur prior to the decimation filters if they are enabled. TABLE 4-12: The overall SNR performance can be improved with higher decimation rate. In theory, 3 dB improvement is expected with each successive stage of decimation (2x per stage), but the actual improvement is approximately 2.5 dB per stage due to finite attenuation in the FIR filters. 4.6.2.1 Using Decimation with Digital Down-Conversion (MCP37D10-200) 8x 71.3 16x 72.4 32x 73 64x 128x 256x 512x Note: 73.5 73.7 The above data is valid with fS = 200 Msps, fIN = 1 MHz, AIN = -1dBFS.The data may vary in other conditions. Phase shifts in the output clock can be achieved using DCLK_PHDLY_DEC<2:0> in Address 0x64 (Register 5-22). Only four output sampling phases are available when a 2x decimation rate is used, while all eight clock phases are available for other decimation rates. See Section 4.9.8 “Output Data And Clock Rates” for more details. 2015-2016 Microchip Technology Inc. DS20005395B-page 45 MCP37210-200 AND MCP37D10-200 TABLE 4-13: REGISTER CONTROL PARAMETERS FOR USING DECIMATION FILTERS Control Parameter Register Descriptions Decimation Filter Settings FIR_A<8:0> 0x7A, 0x7B FIR_B<7:0> 0x7C FIR A configuration. I-Channel in I/Q-Channel mode FIR B configuration for Q-Channel in I/Q-Channel mode (1) Output Data Rate and Clock Rate Settings OUT_DATARATE<3:0> 0x02 Output data rate: Equal to decimation rate OUT_CLKRATE<3:0> 0x02 Output clock rate: Equal to decimation rate Output Clock Phase Control Settings(2) EN_PHDLY 0x64 Enable digital output phase delay when decimation filter is used DCLK_PHDLY_DEC<2:0> 0x64 Digital output clock phase delay control Note 1: 2: The output data and clock rates must be updated when decimation rates are changed. Output clock (DCLK) phase control is used when the output clock is divided by OUT_CLKRATE<3:0> bit settings. D4 Single D2 Single Decimation Input Stage 1A FIR A 2 (Note 1) I and Q Data in DDC Mode (MCP37D10 only) Stage 2A FIR A Input DeMUX (Note 2) 2 D8 Single Stage 3A FIR A 2 Stage 3B FIR B 2 Stage 9A FIR A Q-Channel Output MUX Note 1: (Note 3) I-Channel Stage 9B FIR B D512 Single 2 2 Output MUX D128 I/Q D2 I/Q Stage 1A FIR is the first stage of the FIR A filter. 2: (a) Decimation Input (Not in DDC mode): Only FIR_A<8:0> is used. (b) DDC Input for I/Q filtering in DDC mode: FIR_A<8:1> for I data and FIR_B<7:0> for Q data are used. 3: Maximum Decimation Rate: (a) When DDC is not used: 512x. (b) When DDC is used: 128x each for FIR A and FIR B. FIGURE 4-13: DS20005395B-page 46 Simplified Block Diagram of Decimation Filters. 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 4.6.3 DIGITAL DOWN-CONVERSION (MCP37D10-200 ONLY) The Digital Down-Conversion (DDC) feature is available in MCP37D10-200. This feature can be combined with the decimation filter and used to: • translate the input frequency spectrum to lower frequency band • remove the unwanted out-of-band portion • output the resulting signal as either I/Q data or a real signal centered at ¼ of the output data rate. Figure 4-14 shows the DDC configuration. The DDC includes a 32-bit complex numerically controlled oscillator (NCO), a selectable (high/low) half-band filter, optional decimation and two output modes (I/Q or fS/8). Frequency translation is accomplished with the NCO. The NCO frequency is programmable from 0 Hz to fS. Phase and amplitude dither can be enabled to improve spurious performance of the NCO. Each of the processing sub-blocks are individually controlled. Examples of setting registers for selected output type are shown in Tables 4-14 and 4-15 in Section 4.6.4 “Examples of Register Settings for DDC and Decimation”. This DDC feature can be used in a variety of highspeed signal-processing applications, including digital radio, wireless base stations, radar, cable modems, digital video, MRI imaging, etc. Example: If the ADC is sampling an input at 200 Msps but the user is only interested in a 5 MHz span centered at 67 MHz, the digital down-conversion may be used to mix the sampled ADC data with 67 MHz to convert it to DC. The resulting signal can then be decimated by 16x such that the bandwidth of the ADC output is 6.25 MHz (200 Msps/16x decimation gives 12.5 Msps with 6.25 MHz Nyquist bandwidth). If fS/8 mode is selected, then a single 25 Msps channel is output, where 6.25 MHz in the output data corresponds to 67 MHz at the ADC input. If I/Q mode is selected, then two 12.5 Msps channels are output, where DC corresponds to 67 MHz and the channels represent In-Phase (I) and Quadrature (Q) components of the down-conversion. (Note 5) I or IDEC Q or QDEC (Note 3) I ADC DATA Q COS Half-Band Filter A LP/HP HBFILTER_A SIN NCO (32-bit) (Note 2) EN_NCO FIR A Decimation Filter FIR B Decimation Filter NCO ( fS/8 DER ) EN_DDC_FS/8 FIR_B<7:0> (Note 4) Real or RealDEC EN_DDC2 EN_DDC1 Down-Converting and Decimation (Note 1) Note 1: FIR_A<8:1> Decimation and Output Frequency Translation (Note 1) See Addresses 0x80 - 0x81 (Registers 5-38 – 5-39) for the Control Parameters. 2: See Figure 4-15 for details of NCO control block. 3: Half-band Filter A includes a single-stage decimation filter. 4: See Figure 4-13 for details. 5: Switches are closed if decimation filter is not used and open if decimation filter is used. FIGURE 4-14: Simplified DDC Block Diagram for Single-Channel Mode. See Tables 4-14 and 4-15 for using this DDC Block. 2015-2016 Microchip Technology Inc. DS20005395B-page 47 MCP37210-200 AND MCP37D10-200 4.6.3.1 Numerically Controlled Oscillator (NCO) Figure 4-15 shows the control signals associated with the NCO. The on-board Numerically Controlled Oscillator (NCO) provides the frequency reference for the In-Phase and Quadrature mixers in the digital down-converter (DDC). Note: The NCO is only used for DDC. It should be disabled when not in use. The NCO serves as a quadrature local oscillator, capable of producing an NCO frequency of between 0 Hz and fS with a resolution of fS/232 where fS is the ADC core sampling frequency. Phase Offset Control NCO_PHASE<15:0> Phase Dither Amplitude Dither EN_LFSR Sine/Cosine Signal Generator NCO Tuning EN_NCO EN_PHSDITH EN_AMPDITH EN_LFSR NCO Output NCO_TUNE<31:0> FIGURE 4-15: NCO Block Diagram. • NCO Frequency Control: 4.6.3.2 The NCO frequency is programmed from 0 Hz to fS, using the 32-bit-wide unsigned register variable NCO_TUNE<31:0> in Addresses 0x82 – 0x85 (Registers 5-40 – 5-43). The EN_AMPDITH and EN_PHSDITH parameters in Address 0x80 (Register 5-38) can be used for amplitude and phase dithering, respectively. In principle, these will dither the quantization error created by the use of digital circuits in the mixer and local oscillator, thus reducing spurs at the expense of noise. In practice, the DDC circuitry has been designed with sufficient noise and spurious performance for most applications. In the worst-case scenario, the NCO has an SFDR of greater than 116 dB when the amplitude dither is enabled and 112 dB when disabled. Although the SNR ( 93 dB) of the DDC is not significantly affected by the dithering option, using the NCO with dithering options enabled is always recommended for the best performance. The following equation is NCO_TUNE<31:0> register: EQUATION 4-6: used to set the NCO FREQUENCY 32 Mod f NCO f S NCO_TUNE<31:0> = round 2 ---------------------------------------- fS Where: fS = sampling frequency (Hz) fNCO = desired NCO frequency (Hz) Mod (fNCO, fS) = gives the remainder of fNCO/fS Mod() is a remainder function. For Mod(5, 2) = 1 and Mod(1.999, 2) = 1.999. example, Example 1: If fNCO is 100 MHz and fS is 200 MHz: Mod f NCO f S = Mod 100 200 = 100 32 Mod 100 200 NCO_TUNE<31:0> = round 2 -------------------------------------- 200 = 0x8000 0000 Example 2: If fNCO is 199.99999994 MHz and fS is 200 MHz: 4.6.3.3 NCO Amplitude and Phase Dither NCO for fS/8 and fS/(8xDER) The output of the first down-conversion block (DDC1) is a complex signal (comprising I and Q data) which can then be optionally decimated further up to 128x to provide both a lower output data rate and input channel filtering. If fS/8 mode is enabled, a second mixer stage (DDC2) will convert the I/Q signals from the DDC1 to a real signal centered at half of the current Nyquist frequency; i.e., if the current output data rate for I and Q is 25 Msps each (12.5 MHz Nyquist), then in fS/ 8 mode the output data rate would be 50 Msps (25 Msps x2 for I and Q) and the resulting real signal after combining the two would be re-centered around 12.5 MHz. This second frequency translation by DDC2 is accomplished after the decimation filters (if used) as shown in Figure 4-14. Mod f NCO fS = Mod 199.99999994 200 = 199.99999994 32 Mod 199.99999994 200 NCO_TUNE<31:0> = round 2 --------------------------------------------------------------- 200 = 0xFFFF FFFF DS20005395B-page 48 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 When decimation is enabled, the I/Q outputs are up-converted by fS/(8xDER), where DER is the additional decimation rate added by the FIR decimation filters. This provides a decimated output signal centered at fS/8 or fS/(8xDER) in the frequency domain. 4.6.3.4 NCO Phase Offset Control The user can add phase offset to the NCO frequency using the NCO phase offset control registers (Addresses 0x86 to 0x87 – Registers 5-44 – 5-45). NCO_PHASE<15:0> is the 16-bit wide NCO phase offset control parameter. The phase offset can be controlled from 0° to 359.995° with 0.005° per step. The following equation is used to program the NCO phase offset register: EQUATION 4-7: The user can select a high- or low-pass half-band filter using the HBFILTER_A and HBFILTER_B bits in Address 0x80 (Register 5-38). These filters provide greater than 90 dB of attenuation in the attenuation band, and less than 1 mdB (10-3 dB) of ripple in the passband region of 20% of the input sampling rate. For example, for an ADC sample rate of 200 Msps, these filters provide less than 1 mdB of ripple over a bandwidth of 40 MHz. The filter responses shown in Figures 4-16 and 4-17 indicate a ripple of 0.5 mdB and an alias rejection of 90 dB. The output of the half-band filter is a DC-centered complex signal (I and Q). This I and Q signal is then carried to the next down-conversion stage (DDC2) for frequency translation (up-conversion), if the DDC is enabled. NCO PHASE OFFSET NCO_PHASE<15:0> = 2 16 Offset Value ( --------------------------------------- Where: Note: 360 The half-band filter delays the data output by 80 clock cycles: 2 (due to decimation) x 40 cycles (due to filter group delay) Offset Value () = desired phase offset value in degrees In-Band Ripple 0.0005 A decimal number is used for the binary contents of the NCO_PHASE<15:0>. 0 -0.0005 0 In-Phase and Quadrature Signals When the first down-conversion is enabled, it produces In-phase (I) and Quadrature (Q) components given by: EQUATION 4-8: I AND Q SIGNALS I = ADC COS 2 f NCO t + Q = ADC SIN 2 fNCO t + 2 = 0.005493164 NCO_PHASE<15:0> 0.5 -60 -90 In-Band Ripple 0.0005 0 ADC = output of the ADC block t = k/fS, with k =1, 2, 3,..., n fNCO = NCO frequency I and Q data are output in an interleaved fashion where I data is output on the rising edge of the WCK. Half-Band Filter The frequency translation is followed by a half-band digital filter, which is used to reduce the sample rate by a factor of two while rejecting aliases that fall into the band of interest. 2015-2016 Microchip Technology Inc. -0.0005 0 0.1 0.2 0.3 0.4 Half-Band Filter Frequency Response 0.5 0.1 0.5 0 Amplitude (dBc) = NCO phase offset defined by NCO_PHASE<15:0> in Address 0x86 0.2 0.3 0.4 Fraction of Input Sample Rate FIGURE 4-16: High-Pass (HP) Response of Half-Band Filter. where: 4.6.3.6 0.1 -30 0 NCO_PHASE<15:0> 0.5 -120 where: = 360 ---------------------------------------------------16 0.1 0.2 0.3 0.4 Half-Band Filter Frequency Response 0 Amplitude (dBc) 4.6.3.5 -30 -60 -90 -120 0 FIGURE 4-17: Half-Band Filter. 0.2 0.3 0.4 Fraction of Input Sample Rate Low-Pass (LP) Response of DS20005395B-page 49 MCP37210-200 AND MCP37D10-200 4.6.4 EXAMPLES OF REGISTER SETTINGS FOR DDC AND DECIMATION The following tables show examples of setting registers to use digital down-conversion (DDC) with decimation depending on the output type selection. This feature is available in the MCP37D10-200 device only. DDC Mode Address 0x02(2) 0x7A<6> (FIR_A<0>) 0x7B (FIR_A<8:1>) 0x7C (FIR_B<7:0>) 0x80<5,1,0>(3) 0x81<6>(4) REGISTER SETTINGS FOR DDC AND DECIMATION OPTIONS – EXAMPLE Decimation Rate (by FIR A and FIR B)(1) TABLE 4-14: 0 Disabled 0x00 0 0x00 0x00 0,0,0 0 ADC 8 Disabled 0x33 1 0x03 0x00 0,0,0 0 ADC with decimation (÷8) 512 Disabled 0x99 1 0xFF 0x00 0,0,0 0 ADC with decimation (÷512) 0 I/Q 0x00(5) 0 0x00 0x00 1,0,1 0 I/Q Data FIR A Filter FIR B Filter DDC1 DDC2 Output 8 I/Q 0x33 0 0x07 0x07 1,0,1 0 Decimated I/Q (÷8) 0 fS/8 0x11(6) 0 0x00 0x00 1,1,1 0 Real without additional decimation fS/8 0x44 0 0x07 0x07 1,0,1 1 Real with decimation (÷16) 8 Note 1: 2: 3: 4: 5: 6: When DDC is used, the actual total decimation is 2x larger since 2x is included from the DDC Half-Band Filter. Example: Decimation = 8x with DDC-I/Q option actually has 16x decimation with 8x provided by the decimation filter and 2x from the DDC Half-Band Filter. Output data and clock rate control register. 0x80<5,1,0> = <EN_NCO, EN_DDC_FS/8, EN_DDC1>. 0x81<6> = <EN_DDC2>. Each of I/Q has 1/2 of fS bandwidth. The combined bandwidth is the same as the fS bandwidth. Therefore, the data rate adjustment is not needed. The Half-Band Filter A includes decimation of 2. DS20005395B-page 50 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 TABLE 4-15: Output Type OUTPUT TYPE VS. CONTROL PARAMETERS FOR DDC – EXAMPLE Control Parameter Complex: I and Q EN_DDC1 = 1 0x80 Enable DDC1 block 0x80 Enable 32-bit NCO HBFILTER_A = 1 0x80 Enable Half-Band Filter A, includes 2x decimation EN_DDC_FS/8 = 0 0x80 NCO (fS/8/DER) is disabled EN_DDC2 = 0 0x81 DDC2 is disabled FIR_A<8:1> = 0x00 0x7B FIR A decimation filter is disabled FIR_B<7:0> = 0x00 0x7C FIR B decimation filter is disabled OUT_CLKRATE<3:0> 0x02 Output clock rate is not affected (no need to change) 2: 3: 4: 0x80 Enable DDC1 block 0x80 Enable 32-bit NCO HBFILTER_A = 1 0x80 Enable Half-Band Filter A, includes 2x decimation EN_DDC_FS/8 = 0 0x80 NCO (fS/8/DER) is disabled EN_DDC2 = 0 0x81 DDC2 is disabled FIR_A<8:1> 0x7B Program FIR A filter for extra decimation(1) FIR_B<7:0> 0x7C Program FIR B filter for extra decimation(1) OUT_CLKRATE<3:0> 0x02 Adjust the output clock rate to the decimation rate Real: RealA after EN_DDC1 = 1 DDC(fS/8/DER) EN_NCO = 1 without using HBFILTER_A = 1 Decimation Filter EN_DDC_FS/8 = 1 Note 1: Descriptions EN_NCO = 1 Decimated I and Q: EN_DDC1 = 1 IDEC, QDEC EN_NCO = 1 Decimated Real: RealA_DEC after Decimation Filter and DDC(fS/8/DER) Regist er 0x80 Enable DDC1 block 0x80 Enable 32-bit NCO 0x80 Enable Half-Band Filter A, includes 2x decimation 0x80 NCO (fS/8/DER) is enabled. This translates the input signal from DC to fS/8(2) EN_DDC2 = 1 0x81 DDC2 is enabled FIR_A<8:1> = 0x00 0x7B Decimation filter FIR A is disabled FIR_B<7:0> = 0x00 0x7C Decimation filter FIR B is disabled OUT_CLKRATE<3:0> = 0001 0x02 Adjust the output clock rate to divided by 2(3) EN_DDC1 = 1 0x80 Enable DDC1 block EN_NCO = 1 0x80 Enable 32-bit NCO HBFILTER_A = 1 0x80 Enable Half-Band Filter A, includes 2x decimation EN_DDC_FS/8 = 1 0x80 NCO (fS/8/DER) is enabled. This translates the input signal from DC to fS/8/DER(2) EN_DDC2 = 1 0x81 DDC2 is enabled FIR_A<8:1> 0x7B Program FIR B filter for extra decimation(4) FIR_B<7:0> 0x7C Program FIR B filter for extra decimation(4) OUT_CLKRATE<3:0> 0x02 Adjust the output clock rate to the total decimation rate including the 2x decimation by the Half-Band Filter A For I/Q decimation, the maximum decimation rate for the FIR A and FIR B filters is 128x each since the input is already decimated by 2x in the Half-Band Filter. See Figure 4-13 for details. DER is the decimation rate setting of the FIR A and FIR B filters. The Half-Band Filter A includes decimation of 2. When this filter is used, the up-conversion frequency is reduced by the extra decimation rates (DER). 2015-2016 Microchip Technology Inc. DS20005395B-page 51 MCP37210-200 AND MCP37D10-200 4.7 Digital Offset and Digital Gain Settings Figure 4-18 shows a simplified block diagram of the digital offset and gain settings. Offset is applied prior to the gain. Offset and gain adjustments occur prior to DDC or decimation when these features are used. 4.7.1 DIGITAL OFFSET SETTINGS The offset can be controlled using two combined digital offset correction registers: DIG_OFFSET<15:0> in Addresses 0x66 - 0x67. 4.7.2 DIGITAL GAIN SETTINGS The digital gain can be controlled using DIG_GAIN<7:0> in Addresses 0x96 - 0x9D. All DIG_GAIN<7:0> in Addresses 0x96 - 0x9D must be programmed with the same value. When the device is first powered-up or has hardware reset, DIG_GAIN<7:0> is set with a default setting (‘0011-1100’). The user may program the DIG_GAIN<7:0> to ‘0011-1000’ for higher SNR performance (0.5 dB higher than the default setting). Corrected ADC Output ADC Output Digital Offset Control Digital Gain Control DIG_GAIN<7:0> DIG_OFFSET<15:0> FIGURE 4-18: Simplified Block Diagram for Digital Offset and Gain Settings. DS20005395B-page 52 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 4.8 Output Data Format Table 4-16 shows the relationship between the analog input voltage, the digital data output bits and the overrange bit. By default, the output data format is two’s complement. The device can output the ADC data in offset binary or two’s complement. The data format is selected by the DATA_FORMAT bit in Address 0x62 (Register 5-20). TABLE 4-16: ADC OUTPUT CODE VS. INPUT VOLTAGE Input Range Offset Binary (1) Two’s Complement (1) Overrange (OVR) AIN > AFS 1111-1111-1111 0111-1111-1111 1 AIN = AFS 1111-1111-1111 0111-1111-1111 0 AIN = AFS – 1 LSb 1111-1111-1110 0111-1111-1110 0 AIN = AFS – 2 LSb 1111-1111-1100 0111-1111-1100 0 • • • AIN = AFS/2 1100-0000-0000 0100-0000-0000 0 AIN = 0 1000-0000-0000 0000-0000-0000 0 AIN = -AFS/2 0011-1111-1111 1011-1111-1111 0 1000-0000-0010 0 • • • AIN = -AFS + 2 LSb 0000-0000-0010 AIN = -AFS + 1 LSb 0000-0000-0001 1000-0000-0001 0 AIN = -AFS 0000-0000-0000 1000-0000-0000 0 AIN < - AFS 0000-0000-0000 1000-0000-0000 1 Note 1: 4.9 MSb is sign bit. Digital Output The MCP37210-200 and MCP37D10-200 can operate in one of the following two digital output modes: • Full-Rate CMOS • Double-Data-Rate (DDR) LVDS The outputs are powered by DVDD18 and GND. LVDS mode is recommended for data rates above 80 Msps. The digital output mode is selected by the OUTPUT_MODE<1:0> bits in Address 0x62 (Register 5-20). Figures 2-1 – 2-2 show the timing diagrams of the digital output. 4.9.1 FULL-RATE CMOS MODE In full-rate CMOS mode, the data outputs (Q11 to Q0), over-range indicator (OVR), word clock (WCK) and the data output clock (DCLK+, DCLK-) have CMOS output levels. The WCK is disabled, except for the I/Q data output mode in the MCP37D10. The digital output should drive minimal capacitive loads. If the load capacitance is larger than 10 pF, a digital buffer should be used. 4.9.2 In I/Q Data Output mode in the MCP37D10-200, I and Q data are clocked out sequentially with the WCK that is synchronized to I data. OVR and WCK are an LVDS pair. The device outputs the following LVDS output pairs: • Output data: Q5+/Q5- through Q0+/Q0• Output clock: DCLK+/DCLK• OVR/WCK Note that WCK is logic ‘0’ except in I/Q mode. A 100Ω differential termination resistor is required for each LVDS output pin pair. The termination resistor should be located as close as possible to the LVDS receiver. By default, the outputs are standard LVDS levels: 3.5 mA output current with a 1.15V output common-mode voltage on 100 differential load. See Address 0x63 (Register 5-21) for more details of the LVDS mode control. Note: LVDS output polarity can be controlled independently for each LVDS pair. See POL_LVDS<5:0> setting in Address 0x65 (Register 5-23) DOUBLE-DATA-RATE LVDS MODE The Double-Data-Rate (DDR) LVDS mode is a parallel data stream which changes on each edge of the output clock. See Figure 2-2 for details. 2015-2016 Microchip Technology Inc. DS20005395B-page 53 MCP37210-200 AND MCP37D10-200 4.9.3 OVERRANGE BIT (OVR) The input overrange status bit is asserted (logic high) when the analog input has exceeded the full-scale range of the ADC in either the positive or negative direction. The OVR bit has the same pipeline latency as the ADC data bits. See Address 0x68 (Register 5-26) for OVR control options. If DSPP option is enabled, OVR pipeline latency will be unaffected; however, the data will incur additional delay. This has the effect of allowing the OVR indicator to precede the affected data. 4.9.3.1 OVR Bit in LVDS DDR Output Mode (a) Normal ADC Output Mode: The device outputs the OVR bit on the falling edge of the data output clock. (b) I and Q Output Mode in MCP37D10-200: The OVR bit is multiplexed with the word clock (WCK) output bit, such that OVR is output on the falling edge of the data output clock and WCK on the rising edge. 4.9.4 WORD CLOCK (WCK) • MCP37210-200: WCK is disabled. • MCP37D10-200: WCK is available in I/Q data output mode only. WCK is asserted coincidentally with the I data. See Address 0x68 (Register 5-26) for OVR and WCK control options. 4.9.5 LVDS OUTPUT POLARITY CONTROL In LVDS mode, the output polarity can be controlled independently for each LVDS pair. Table 4-17 summarizes the LVDS output polarity control register bits. TABLE 4-17: Control Parameter LVDS OUTPUT POLARITY CONTROL Register Descriptions POL_LVDS<5:0> 0x65 Control polarity of LVDS data pairs POL_OVR_WCK 0x68 Control polarity of OVR and WCK bit pair DS20005395B-page 54 4.9.6 PROGRAMMABLE LVDS OUTPUT CURRENT In LVDS mode, the default output driver current is 3.5 mA. This current can be adjusted by using the LVDS_IMODE<2:0> bit setting in Address 0x63 (Register 5-21). Available output drive currents are: 1.8 mA, 3.5 mA, 5.4 mA, and 7.2 mA. 4.9.7 OPTIONAL LVDS DRIVER INTERNAL TERMINATION In most cases, using an external 100Ω termination resistor will give excellent LVDS signal integrity. In addition, an optional internal 100Ω termination resistor can be enabled by setting the LVDS_LOAD bit in Address 0x63 (Register 5-21). The internal termination helps absorb any reflections caused by imperfect impedance termination at the receiver. 4.9.8 OUTPUT DATA AND CLOCK RATES The user can reduce output data and output clock rates using Address 0x02 (Register 5-3). When decimation or digital down-conversion (DDC) is used, the output data rate has to be reduced to synchronize with the reduced output clock rate. 4.9.9 PHASE SHIFTING OF OUTPUT CLOCK (DCLK) In full-rate CMOS mode, the data output bit transition occurs at the rising edge of DCLK+ so the falling edge of DCLK+ can be used to latch the output data. In double-data-rate LVDS mode, the data transition occurs at both the rising and falling edges of DCLK+. For adequate setup and hold time when latching the data into the external host device, the user can shift the phase of the digital clock output (DCLK+/DCLK-) relative to the data output bits. The output phase shift (delay) is controlled by each unique register depending on which timing source is used or if decimation is used. Table 4-18 shows the output clock phase control registers for each Configuration mode: (a) when DLL is used; (b) when decimation is used; and (c) when PLL is used. Figure 4-19 shows an example of the output clock phase delay control using the DCLK_PHDLY_DLL<2:0> when DLL is used. 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 TABLE 4-18: OUTPUT CLOCK (DCLK) PHASE CONTROL PARAMETERS Operating Condition(1) Control Parameter Register EN_PHDLY 0x64 EN_PHDLY = 1: Enable output clock phase delay control DCLK_PHDLY_DLL<2:0> 0x52 DCLK phase delay control when DLL is used. Decimation is not used. When DLL is used: When decimation is used: EN_PHDLY 0x64 DCLK_PHDLY_DEC<2:0> EN_PHDLY = 1: Enable output clock phase delay control DCLK phase delay control when decimation filter is used. The phase delay is controlled in digital clock output control block. When PLL is used: DCLK_DLY_PLL<2:0> Note 1: 0x6D DCLK delay control when PLL is used See Figure 4-11 for details. LVDS Data Output: Phase Shift: 0° Output Clock (DCLK+) (Default)(1) DCLK_PHDLY_DLL<2:0> = 0 0 0 45° + Default 0 0 1 90° + Default 0 1 0 135° + Default 0 1 1 180° + Default 1 0 0 225° + Default 1 0 1 270° + Default 1 1 0 315° + Default 1 1 1 Note 1: Default value may not be 0° in all operations FIGURE 4-19: Example of Phase Shifting of Digital Output Clock (DCLK+) when DLL is used. 2015-2016 Microchip Technology Inc. DS20005395B-page 55 MCP37210-200 AND MCP37D10-200 4.9.10 DIGITAL OUTPUT RANDOMIZER Depending on PCB layout considerations and power supply coupling, SFDR may be improved by decorrelating the ADC input from the ADC digital output data. The device includes an output data randomizer option. When this option is enabled, the digital output is randomized by applying an exclusive-OR logic operation between the LSb (D0) and all other data output bits. To decode the randomized data, the reverse operation is applied: an exclusive-OR operation is applied between the LSb (D0) and all other bits. The DCLK, OVR, WCK, and LSb (D0) outputs are not affected. Figure 4-20 shows the block diagram of the data randomizer and decoder logic. The output randomizer is enabled by setting the EN_OUT_RANDOM bit in Address 0x07 (Register 5-5). MCP37XXX DCLK OVR WCK Data Acquisition Device DCLK DCLK OVR OVR WCK WCK Q11 Q11 Q10 Q10 Q0 Q11 Q0 Q10 Q2 Q2 Q0 Q1 Q1 Q0 Q2 Q1 EN_OUT_RANDOM Q0 Q0 Q0 (a) Data Randomizer FIGURE 4-20: 4.9.11 Logic Diagram for Digital Output Randomizer and Decoder. OUTPUT DISABLE The digital output can be disabled by setting OUTPUT_MODE<1:0> = 00 in Address 0x62 (Register 5-20). All digital outputs are disabled, including OVR, DCLK, etc. 4.9.12 (b) Data Decoder OUTPUT TEST PATTERNS To facilitate testing of the I/O interface, the device can produce various predefined or user-defined patterns on the digital outputs. See TEST_PATTERNS<2:0> in Address 0x62 (Register 5-20) for the predefined test patterns. For the user-defined test patterns, Addresses 0x74 – 0x77 (Registers 5-29 – 5-32) can be used. When an output test mode is enabled, the ADC’s analog section can still be operational but does not drive the digital outputs. The outputs are driven only with the selected test pattern. 4.9.12.1 Pseudo-Random Number (PN) Sequence Output When TEST_PATTERNS<2:0> = 111, the device outputs a pseudo-random number (PN) sequence which is defined by the polynomial of degree 16, as shown in Equation 4-9. Figure 4-21 shows the block diagram of a 16-bit Linear Feedback Shift Register (LFSR) for the PN sequence. EQUATION 4-9: POLYNOMIAL FOR PN 4 13 15 Px = 1 + x + x + x + x 16 Since the output test pins (TP, TP1 and TP2) can toggle during this test, always leave these test pins floating (not connected) to avoid contention and excess current draws. DS20005395B-page 56 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 The output PN[15:4] is directly applied to the output pins Qn[11:0]. In addition to the output at the Qn[11:0] pins, PN[15] is copied to OVR pin and PN[14] is copied to WCK pin. In CMOS output mode, the pattern is always applied to all CMOS I/O pins, regardless whether or not they are enabled. In LVDS output mode, the pattern is only applied to the LVDS pairs that are enabled. PN[3] PN[12] Z-9 -4 Z PN[14] Z-2 PN[15] Z -1 XOR FIGURE 4-21: Block Diagram of 16-bit LFSR for Pseudo-Random Number (PN) Sequence for Output Test Pattern. 4.10 System Calibration HDC and DNC correct the nonlinearity in the residue amplifier and DAC, respectively. The system calibration is performed by: • Power-up calibration, which takes place during the Power-on Reset sequence (requires 3×226 clock cycles) • Background calibration, which takes place during normal operation (per 230 clock cycles). Background calibration time is invisible to the user and primarily affects the ADC's ability to track variations in ambient temperature. The calibration status is monitored by CAL pin or the ADC_CAL_STAT bit in Address 0xC0 (Register 5-68). See also Address 0x07 (Register 5-5) and 0x1E (Register 5-6) for time delay control of the autocalibration. Table 4-19 shows the calibration time for various ADC core sample rates. RESET COMMAND Although the background calibration will track changes in temperature or supply voltage, changes in clock frequency or register configuration should be followed by a recalibration of the ADC. This can be accomplished via either the Hard or the Soft Reset command. The recalibration time is the same as the power-up calibration time. Resetting the device is highly recommended when exiting from Shutdown or Standby mode after an extended amount of time. During the reset, the device has the following state: • No ADC output • No change in power-on condition of internal reference • Most of the internal clocks are not distributed • Contents of internal user registers: - Not affected by Soft Reset - Reset to default values by Hardware Reset • Current consumption of the digital section is negligible, but no change in the analog section. 4.10.1.1 The built-in system calibration algorithm includes: • Harmonic Distortion Correction (HDC) • DAC Noise Cancellation (DNC) • Dynamic Element Matching (DEM) TABLE 4-19: 4.10.1 Hardware Reset A hard reset is triggered by toggling the RESET pin. On the rising edge, all internal calibration registers and user registers are initialized to their default states and recalibration of the ADC begins. The recalibration time is the same as the power-up calibration time. See Figure 2-6 for the timing details of the hardware RESET pin. 4.10.1.2 Soft Reset The user can issue a Soft Reset command for a fast recalibration of the ADC by setting the SOFT_RESET bit to ‘0’ in Address 0x00 (Register 5-1). During Soft Reset, all internal calibration registers are initialized to their initial default states. User registers are unaffected. When exiting the Soft Reset (changing from ‘0’ to ‘1’), an automatic device calibration takes place. CALIBRATION TIME VS. ADC CORE SAMPLE RATE fS (Msps) 200 150 100 70 50 Power-Up Calibration Time (s) 1.01 1.34 2.01 2.88 4.03 Background Calibration Time (s) 5.37 7.16 10.73 15.34 21.48 2015-2016 Microchip Technology Inc. DS20005395B-page 57 MCP37210-200 AND MCP37D10-200 4.11 Power Dissipation and Power Savings The power dissipation of the ADC core is proportional to the sample rate (fS). The digital power dissipation of the CMOS outputs is determined primarily by the strength of the digital drivers and the load condition on each output pin. The maximum digital load current (ILOAD) can be calculated as: EQUATION 4-10: I LOAD = DV CMOS OUTPUT LOAD CURRENT DD 1.8 f DCLK N C LOAD Where: N = Number of bits CLOAD = Capacitive load of output pin The capacitive load presented at the output pins needs to be minimized to minimize digital power consumption. The output load current of the LVDS output is constant, since it is set by LVDS_IMODE<2:0> in Address 0x63 (Register 5-21). 4.11.1 POWER-SAVING MODES This device has two power-saving modes: • Shutdown • Standby They are set by the SHUTDOWN and STANDBY bits in Address 0x00 (Register 5-1). In Shutdown mode, most of the internal circuitry, including the reference and clock, are turned off with the exception of the SPI interface. During Shutdown mode, the device consumes 25 mA (typical), primarily due to digital leakage. When exiting from Shutdown mode, issuing a Soft Reset at the same time is highly recommended. This will perform a fast recalibration of the ADC. The contents of the internal registers are not affected by the Soft Reset. In Standby mode, most of the internal circuitry is disabled except for the reference, clock and SPI interface. If the device has been in standby for an extended period of time, the current calibration value may not be accurate. Therefore, when exiting from Standby mode, executing the device Soft Reset at the same time is highly recommended. DS20005395B-page 58 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 5.0 SERIAL PERIPHERAL INTERFACE (SPI) The user can configure the ADC for specific functions or optimized performance by setting the device’s internal registers through the Serial Peripheral Interface (SPI). The SPI communication uses three pins: CS, SCLK and SDIO. Table 5-1 summarizes the SPI pin functions. The SCLK is used as serial timing clock and can be used up to 50 MHz. SDIO (Serial Data Input/Output) is a dual-purpose pin that allows data to be sent or read from the internal registers. The Chip Select (CS) pin enables SPI communication when active-low. The falling edge of CS followed by a rising edge of SCLK determines the start of the SPI communication. When CS is tied to high, the SPI communication is disabled and SPI pins are placed in high-impedance mode. The internal registers are accessible by their address. TABLE 5-1: Pin Name CS SCLK SDIO Figures 5-1 and 5-2 show the SPI data communication protocols for this device with MSb-first and LSb-first options, respectively. The communication protocol consists of: • 16-bit wide instruction header + Data byte 1 + Data byte 2 +. . .+ Data Byte N Table 5-2 summarizes the bit functions. The R/W bit of the instruction header indicates whether the command is a read (‘1’) or a write (‘0’): • If the R/W bit is ‘1’, the SDIO pin changes direction from an input (SDI) to an output (SDO) after the 16-bit-wide instruction header. By selecting the R/W bit, the user can write the register or read back the register contents. The W1 and W2 bits in the instruction header indicate the number of data bytes to transmit or receive in the following data frame. A2 – A0 bits are the SPI device address bits. These bits are used when multiple devices are used in the same SPI bus. A2 is internally hard-coded to ‘0’. The A1 and A0 bits correspond to the logic level of ADR1 and ADR0 pins, respectively. Note: In VTLA-124 package, ADR1 is internally bonded to ground (logic ‘0’). The R9 – R0 bits represent the starting address of the configuration register to write or read. The data bytes following the instruction header are the register data. All register data is eight bits wide. Data can be sent in MSb-first mode (default) or in LSb-first mode, which is determined by the <LSB_ FIRST> bit setting in Address 0x00 (Register 5-1). In Write mode, the data is clocked in at the rising edge of the SCLK. In Read mode, the data is clocked out at the falling edge of the SCLK. 2015-2016 Microchip Technology Inc. Descriptions Chip Select pin. SPI mode is initiated at the falling edge. It needs to maintain active-low for the entire period of the SPI communication. The device exits the SPI communication at the rising edge. Serial clock input pin. • Writing to the device: Data is latched at the rising edge of SCLK • Reading from the device: Data is latched at the falling edge of SCLK Serial data input/output pin. This pin is initially an input pin (SDI) during the first 16-bit instruction header. After the instruction header, its I/O status can be changed depending on the R/W bit: • if R/W = 0: Data input pin (SDI) for writing • if R/W = 1: Data output pin (SDO) for reading TABLE 5-2: Bit Name R/W SPI PIN FUNCTIONS SPI DATA PROTOCOL BIT FUNCTIONS Descriptions 1 = Read Mode 0 = Write Mode 00 = Data for one register (1 byte) W1, W0 (Data Length) 01 = Data for two registers (2 bytes) 10 = Data for three registers (3 bytes) 11 = Continuous reading or writing by clocking SCLK(1) A2 - A0 Device SPI Address for multiple devices in SPI bus. A2: Internally hard-coded to ‘0’ A1: Logic level of ADR1 pin A0: Logic level of ADR0 pin R9 - R0 Address of starting register. D7 - D0 Register data. MSb or LSb first, depending on the LSB_FIRST bit setting in 0x00. Note 1: The register address counter is incremented by one per step. The counter does not automatically reset to 0x00 after reaching the last address (0x15D). Be aware that the user-registers are not sequentially allocated. DS20005395B-page 59 MCP37210-200 AND MCP37D10-200 CS SCLK SDIO R/W W1 W0 A2 A1 A0 R9 R8 R7 R6 R5 R4 R3 Device Address R2 R1 R0 D7 D6 D5 D4 D3 Address of Starting Register D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 Register Data 2 Register Data of Starting Register Defined by R9 - R0 16-Bit Instruction Header D2 D1 D0 Register Data N Register Data FIGURE 5-1: SPI Serial Data Communication Protocol with MSb-first. See Figures 2-5 and 2-6 for Timing Specifications. CS SCLK SDIO R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 A0 A1 A2 W0 W1 R/W D0 D1 D2 D3 D4 D5 D6 D7 D0 Address of Starting Register D1 D2 D3 D4 D5 D6 D7 Register Data 2 Device Address 16-Bit Instruction Header D5 D6 D7 Register Data N Register Data of starting register defined by R9 - R0 Register Data FIGURE 5-2: SPI Serial Data Communication Protocol with LSb-First. See Figures 2-5 and 2-6 for Timing Specifications. 5.1 Register Initialization The internal configuration registers are initialized to their default values by two different ways: • After 220 clock cycles of delay from the Power-on Reset (POR). • Reset by the hardware reset pin (RESET). Figures 2-5 and 2-6 show the timing details. 5.2 Configuration Registers Table 5-3 shows the user-configuration memory map, and Registers 5-1 to 5-71 show the details of the register bit functions. Note 1: All addresses and bit locations that are not included in the following register map table should not be written or modified by the user. 2: Some registers include factory-controlled bits (FCB). Do not overwrite these bits. The internal registers are mapped from address 0x00 to 0x15D. These user registers are not sequentially located. Some user configuration registers include factory-controlled bits. The factory-controlled register bits should not be overwritten by the user. All user configuration registers are read/write, except for the last four registers, which are read-only. Each register is made of an 8-bit-wide volatile memory bit, and their default values are loaded during the power-up sequence or by using the hardware RESET pin. All registers are accessible by the SPI command using the register address. DS20005395B-page 60 2015-2016 Microchip Technology Inc. REGISTER MAP TABLE Bits Addr. Register Name b7 0x00 SPI Bit Ordering and ADC Mode Selection 0x01 Independency Control of Output Data and Clock Divider 0x02 Output Data and Clock Rate Control b6 b5 b4 SHUTDOWN LSb-First SOFT_RESET STANDBY STANDBY SOFT_RESET LSb-First SHUTDOWN 1 = Shutdown 1 = LSb first 0 = MSb first 0 = Soft Reset 1 = Standby 1 = Standby 0 = Soft Reset 1 = LSb first 0 = MSb first 1 = Shutdown EN_DATCLK_IND b3 b2 SPI SDO Timing Control SDO_TIME 0x07 Output Randomizer and WCK Polarity Control POL_WCK 0x1E Auto-Calibration Time Delay Control 0x52 DLL Control 0x53 Clock Source Selection 0x54 PLL Reference Divider 0x55 PLL Output and Reference Divider b0 FCB<6:0> = 000 1111 OUT_CLKRATE<3:0> 0x9F FCB<4:0> = 10001 EN_OUT_ RANDOM AUTOCAL_TIMEDLY<7:0> EN_DUTY DCLK_PHDLY_DLL<2:0> FCB<6:4>= 010 0x62 0x80 EN_DLL_DCLK EN_DLL CLK_SOURCE EN_CLK RESET_DLL FCB<3:0>= 0101 0x0A 0x45 PLL_REFDIV<7:0> PLL_OUTDIV<3:0> 0x24 0x00 FCB<6:0> = 001 1111 EN_AUTOCAL_ TIMEDLY Default Value 0x0F OUT_DATARATE<3:0> 0x04 b1 0x00 FCB<1:0> = 10 PLL_REFDIV<9:8> PLL_PRE (LSB)<7:0> 0x48 0x56 PLL Prescaler (LSB) 0x57 PLL Prescaler (MSB) 0x78 0x58 PLL Charge Pump 0x59 PLL Enable Control 1 U FCB<4:3> = 10 0x5A PLL Loop Filter Resistor U FCB<1:0> = 01 PLL_RES<4:0> 0x2F FCB<3:0> = 0100 FCB<2:0> = 000 PLL_BIAS EN_PLL_REFDIV PLL_PRE (MSB)<11:8> 0x40 PLL_CHAGPUMP<3:0> 0x12 FCB<2:1> = 00 EN_PLL FCB<0> = 1 0x41 DS20005395B-page 61 0x5B PLL Loop Filter Cap3 U FCB<1:0> = 01 PLL_CAP3<4:0> 0x27 0x5C PLL Loop Filter Cap1 U FCB<1:0> = 01 PLL_CAP1<4:0> 0x27 0x5D PLL Loop Filter Cap2 U FCB<1:0> = 01 PLL_CAP2<4:0> 0x5F PLL Enable Control 2 0x62 Output Data Format and Output Test Pattern 0x63 LVDS Output Load and Driver Current Control 0x64 Output Clock Phase Control when Decimation Filter is used 0x65 LVDS Output Polarity Control 0x66 Digital Offset Correction - Lower Byte Legend: Note 1: FCB<5:2> = 1111 U FCB<0> = 0 EN_PLL_OUT DATA_FORMAT OUTPUT_MODE<1:0> FCB<3:0> = 0000 EN_PHDLY FCB<1:0> = 01 TEST_PATTERNS<2:0> LVDS_LOAD LVDS_IMODE<2:0> FCB<3:0> = 0011 DCLK_PHDLY_DEC<2:0> DIG_OFFSET<7:0> 1 = bit is set 0 = bit is cleared 0xF1 0x10 0x01 0x03 NO EFFECT<1:0> POL_LVDS<5:0> U = Unimplemented bit, read as ‘0’. FCB = Factory-Controlled bits. Do not program. Read-only register. Preprogrammed at the factory for internal use. 0x27 EN_PLL_BIAS 0x00 0x00 x = bit is unknown MCP37210-200 AND MCP37D10-200 2015 Microchip Technology Inc. TABLE 5-3: REGISTER MAP TABLE (CONTINUED) Bits Addr. Register Name b7 0x67 Digital Offset Correction - Upper Byte b6 b5 b4 b3 b2 b1 b0 DIG_OFFSET<15:8> FCB<5:2> = 0010 0x68 OVR and WCK Bit Control 0x6B PLL Calibration 0x6D PLL Output and Output Clock Phase 0x74 User-Defined Output Pattern A - Lower Byte 0x75 User-Defined Output Pattern A - Upper Byte 0x76 User-Defined Output Pattern B - Lower Byte 0x77 User-Defined Output Pattern B - Upper Byte 0x78 Noise-Shaping Requantizer (NSR) Filter NSR_RESET 0x00 POL_OVR_WCK FCB<6:2> = 00001 U<1:0> EN_PLL_CLK FCB<1> = 0 EN_OVR_WCK FCB<1:0> = 00 0x24 PLL_CAL_TRIG FCB<1:0> = 00 0x08 DCLK_DLY_PLL<2:0> PATTERN A<3:0> FCB<0> = 0 Do not use (Leave these bits as ‘0000’) 0x00 Do not use (Leave these bits as ‘0000’) PATTERN B<3:0> 0x00 PATTERN B<11:4> 0x79 I/Q-Channel DSPP Control EN_DSPP_I/Q FIR_A0 Bit and Noise-Shaping Requantizer (NSR) Filter Selection FCB<4> = 0 0x00 NSR <6:0> 0x00 FCB<6:0> = 000 0000 FIR_A<0> 0x00 0x00 PATTERN A<11:4> 0x7A Default Value 0x00 FCB<3:0> = 0000 EN_NSR_11 EN_NSR_12 0x00 DS20005395B-page 62 0x7B FIR A Filter FIR_A<8:1> 0x7C FIR B Filter FIR_B<7:0> 0x80 Digital Down-Converter Control 1 FCB<0> = 0 HBFILTER_A EN_NCO 0x81 Digital Down-Converter Control 2 FCB<5> = 0 EN_DDC2 GAIN_HBF_DDC 0x82 Numerically Controlled Oscillator (NCO) Tuning - Lower Byte NCO_TUNE<7:0> 0x00 0x83 Numerically Controlled Oscillator (NCO) Tuning - Middle-Lower Byte NCO_TUNE<15:8> 0x00 0x84 Numerically Controlled Oscillator (NCO) Tuning - Middle-Upper Byte NCO_TUNE<23:16> 0x00 0x85 Numerically Controlled Oscillator (NCO) Tuning - Upper Byte NCO_TUNE<31:24> 0x00 0x86 NCO Phase Offset in DDC Mode - Lower Byte NCO_PHASE<7:0> 0x00 Legend: Note 1: U = Unimplemented bit, read as ‘0’. FCB = Factory-Controlled bits. Do not program. Read-only register. Preprogrammed at the factory for internal use. EN_AMPDITH 0x00 0x00 EN_PHSDITH EN_LFSR FCB<4:0> = 00000 1 = bit is set 0 = bit is cleared x = bit is unknown EN_DDC_FS/8 EN_DDC1 0x00 0x00 MCP37210-200 AND MCP37D10-200 2015 Microchip Technology Inc. TABLE 5-3: REGISTER MAP TABLE (CONTINUED) Bits Addr. Register Name b7 b6 b5 b4 b3 b2 b1 b0 Default Value 0x87 NCO Phase Offset in DDC Mode - Upper Byte NCO_PHASE<15:8> 0x00 0x88 NCO Phase Offset in DDC Mode - Lower Byte NCO_PHASE<7:0> - Repeat of Address 0x86 0x00 0x89 NCO Phase Offset in DDC Mode - Upper Byte NCO_PHASE<15:8> - Repeat of Address 0x87 0x00 0x8A NCO Phase Offset in DDC Mode - Lower Byte NCO_PHASE<7:0> - Repeat of Address 0x86 0x00 0x8B NCO Phase Offset in DDC Mode - Upper Byte NCO_PHASE<15:8> - Repeat of Address 0x87 0x00 0x8C NCO Phase Offset in DDC Mode - Lower Byte NCO_PHASE<7:0> - Repeat of Address 0x86 0x00 0x8D NCO Phase Offset in DDC Mode - Upper Byte NCO_PHASE<15:8> - Repeat of Address 0x87 0x00 0x8E NCO Phase Offset in DDC Mode - Lower Byte NCO_PHASE<7:0> - Repeat of Address 0x86 0x00 0x8F NCO Phase Offset in DDC Mode - Upper Byte NCO_PHASE<15:8> - Repeat of Address 0x87 0x00 0x90 NCO Phase Offset in DDC Mode - Lower Byte NCO_PHASE<7:0> - Repeat of Address 0x86 0x00 0x91 NCO Phase Offset in DDC Mode - Upper Byte NCO_PHASE<15:8> - Repeat of Address 0x87 0x00 0x92 NCO Phase Offset in DDC Mode - Lower Byte NCO_PHASE<7:0> - Repeat of Address 0x86 0x00 0x93 NCO Phase Offset in DDC Mode - Upper Byte NCO_PHASE<15:8> - Repeat of Address 0x87 0x00 0x94 NCO Phase Offset in DDC Mode - Lower Byte NCO_PHASE<7:0> - Repeat of Address 0x86 0x00 0x95 NCO Phase Offset in DDC Mode - Upper Byte NCO_PHASE<15:8> - Repeat of Address 0x87 0x00 0x3C 0x96 Digital Gain Control DIG_GAIN<7:0> 0x97 Digital Gain Control DIG_GAIN<7:0> - Repeat of Address 0x96 0x3C 0x98 DIG_GAIN<7:0> - Repeat of Address 0x96 0x3C DS20005395B-page 63 0x99 DIG_GAIN<7:0> - Repeat of Address 0x96 0x3C 0x9A DIG_GAIN<7:0> - Repeat of Address 0x96 0x3C 0x9B DIG_GAIN<7:0> - Repeat of Address 0x96 0x3C 0x9C DIG_GAIN<7:0> - Repeat of Address 0x96 0x3C 0x9D DIG_GAIN<7:0> - Repeat of Address 0x96 Legend: Note 1: U = Unimplemented bit, read as ‘0’. FCB = Factory-Controlled bits. Do not program. Read-only register. Preprogrammed at the factory for internal use. 1 = bit is set 0 = bit is cleared 0x3C x = bit is unknown MCP37210-200 AND MCP37D10-200 2015 Microchip Technology Inc. TABLE 5-3: REGISTER MAP TABLE (CONTINUED) Bits Addr. Register Name b7 b6 b5 b4 b3 b1 b0 Calibration Status Indication (Read only) 0xD1 PLL Calibration Status and PLL Drift Status Indication (Read only) 0x15C CHIP ID - Lower Byte(1) (Read only) CHIP_ID<7:0> ─ 0x15D CHIP ID - Upper Byte(1) (Read only) CHIP_ID<15:8> ─ FCB<4:3> = xx FCB<6:0> = 000-0000 Default Value 0xC0 Legend: Note 1: ADC_CAL_STAT b2 PLL_CAL_STAT U = Unimplemented bit, read as ‘0’. FCB = Factory-Controlled bits. Do not program. Read-only register. Preprogrammed at the factory for internal use. FCB<2:1> = xx 1 = bit is set 0 = bit is cleared ─ PLL_VCOL_STAT x = bit is unknown PLL_VCOH_STAT FCB<0> = x ─ 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 DS20005395B-page 64 TABLE 5-3: MCP37210-200 AND MCP37D10-200 REGISTER 5-1: ADDRESS 0X00 – SPI BIT ORDERING AND ADC MODE SELECTION(1) R/W-0 R/W-0 R/W-1 R/W-0 R/W-0 R/W-1 R/W-0 R/W-0 SHUTDOWN LSb_FIRST SOFT_RESET STANDBY STANDBY SOFT_RESET LSb_FIRST SHUTDOWN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 SHUTDOWN: Shutdown mode setting for power saving(2) 1 = ADC in Shutdown mode 0 = Not in Shutdown mode (Default) bit 6 LSB_FIRST: Select SPI communication bit order 1 = Start SPI communication with LSb first 0 = Start SPI communication with MSb first (Default) bit 5 SOFT_RESET: Soft Reset control bit(3) 1 = Not in Soft Reset mode (Default) 0 = ADC in Soft Reset bit 4 STANDBY: Send the device into a power-saving Standby mode(4) 1 = ADC in Standby mode 0 = Not in Standby mode (Default) bit 3 STANDBY: Send the device into a power-saving Standby mode(4) 1 = ADC in Standby mode 0 = Not in Standby mode (Default) bit 2 SOFT_RESET: Soft Reset control bit(3) 1 = Not in Soft Reset mode (Default) 0 = ADC in Soft Reset bit 1 LSB_FIRST: Select SPI communication bit order 1 = Start SPI communication with LSb first 0 = Start SPI communication with MSb first (Default) bit 0 SHUTDOWN: Shutdown mode setting for power-saving(2) 1 = ADC in Shutdown mode 0 = Not in Shutdown mode (Default) Note 1: 2: 3: 4: x = Bit is unknown Upper and lower nibble are mirrored, which makes the MSb- or LSb-first mode interchangeable. The lower nibble (bit <3:0>) has a higher priority when the mirrored bits have different values. During Shutdown mode, most of the internal circuits including the reference and clock are turned-off except for the SPI interface. When exiting from shutdown (changing from ‘1’ to ‘0’), executing the device Soft Reset simultaneously is highly recommended for a fast recalibration of the ADC. The internal user registers are not affected. This bit forces the device into Soft Reset mode, which initializes the internal calibration registers to their initial default states. The user-registers are not affected. When exiting Soft Reset mode (changing from ‘0’ to ‘1’), the device performs an automatic device calibration including PLL calibration if PLL is enabled. DLL is reset if enabled. During Soft Reset, the device has the following states: - no ADC output - no change in power-on condition of internal reference - most of the internal clocks are not distributed. - power consumption: (a) digital section - negligible, (b) analog section - no change. During Standby mode, most of the internal circuits are turned off except for the reference, clock and SPI interface. When exiting from Standby mode (changing from ‘1’ to ‘0’) after an extended amount of time, executing Soft Reset simultaneously is highly recommended. The internal user registers are not affected. 2015-2016 Microchip Technology Inc. DS20005395B-page 65 MCP37210-200 AND MCP37D10-200 REGISTER 5-2: R/W-0 ADDRESS 0X01 – INDEPENDENCY CONTROL OF OUTPUT DATA AND CLOCK DIVIDER R/W-0 R/W-0 EN_DATCLK_IND R/W-0 R/W-1 R/W-1 R/W-1 R/W-1 FCB<6:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 EN_DATCLK_IND: Enable data and clock divider independently(1) 1 = Enabled 0 = Disabled (Default) bit 6-0 FCB<6:0>: Factory-Controlled bits. This is not for the user. Do not change default settings. Note 1: EN_DATCLK_IND = 1 enables OUT_CLKRATE<3:0> settings in Address 0x02 (Register 5-3). DS20005395B-page 66 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 REGISTER 5-3: R/W-0 ADDRESS 0X02 – OUTPUT DATA AND CLOCK RATE CONTROL(1) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 OUT_CLKRATE<3:0> OUT_DATARATE<3:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 OUT_DATARATE<3:0>: Output data rate control bits 1111 = Output data is all 0’s 1110 = Output data is all 0’s 1101 = Output data is all 0’s 1100 = Internal test only(2) 1011 = Internal test only(2) 1010 = Internal test only(2) 1001 = Full speed divided by 512 1000 = Full speed divided by 256 0111 = Full speed divided by 128 0110 = Full speed divided by 64 0101 = Full speed divided by 32 0100 = Full speed divided by 16 0011 = Full speed divided by 8 0010 = Full speed divided by 4 0001 = Full speed divided by 2 0000 = Full speed rate (Default) bit 3-0 OUT_CLKRATE<3:0>: Output clock rate control bits(3, 4) 1111 = Full speed rate 1110 = No clock output 1101 = No clock output 1100 = No clock output 1011 = No clock output 1010 = No clock output 1001 = Full speed divided by 512 1000 = Full speed divided by 256 0111 = Full speed divided by 128 0110 = Full speed divided by 64 0101 = Full speed divided by 32 0100 = Full speed divided by 16 0011 = Full speed divided by 8 0010 = Full speed divided by 4 0001 = Full speed divided by 2 0000 = No clock output (Default) Note 1: 2: 3: 4: x = Bit is unknown This register should be used when the decimation filter selection option (see Addresses 0x7B and 0x7C - Registers 536 and 5-37) or digital down-conversion (DDC) option (see Address 0x80 - Register 5-38) is used. 1100 - 1010: Do not reprogram. These settings are used for the internal test only. If these bits are reprogrammed with different settings, the outputs will be in an undefined state. Bits <3:0> become active if EN_DATCLK_IND = 1 in Address 0x01 (Register 5-2). When no clock output is selected (Bits 1110 - 1010): clock output is not available at the DCLK+/DCLK- pins. 2015-2016 Microchip Technology Inc. DS20005395B-page 67 MCP37210-200 AND MCP37D10-200 REGISTER 5-4: ADDRESS 0X04 – SPI SDO OUTPUT TIMING CONTROL R/W-1 R/W-0 R/W-0 R/W-1 SDO_TIME R/W-1 R/W-1 R/W-1 R/W-1 FCB<6:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 SDO_TIME: SPI SDO output timing control bit 1 = SDO output at the falling edge of clock (Default) 0 = SDO output at the rising edge of clock bit 6-0 FCB<6:0>: Factory-Controlled bits. This is not for the user. Do not change default settings. REGISTER 5-5: ADDRESS 0X07 – OUTPUT RANDOMIZER AND WCK POLARITY CONTROL R/W-0 R/W-1 POL_WCK EN_AUTOCAL_TIMEDLY R/W-1 R/W-0 R/W-0 R/W-0 R/W-1 FCB<4:0> R/W-0 EN_OUT_RANDOM bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 POL_WCK: WCK polarity control bit in DDC mode(1) 1 = Inverted 0 = Not inverted (Default) bit 6 EN_AUTOCAL_TIMEDLY: Auto-calibration starter time delay counter control bit(2) 1 = Enabled (Default) 0 = Disabled bit 5-1 FCB<4:0>: Factory-Controlled bits. This is not for the user. Do not change default settings. bit 0 EN_OUT_RANDOM: Output randomizer control bit 1 = Enabled: ADC data output is randomized 0 = Disabled (Default) Note 1: 2: Applicable in the MCP37D10-200 only. See Address 0x68 (Register 5-26) for OVR/WCK pair control. This bit enables the AUTOCAL_TIMEDLY<7:0> settings. See Address 0x1E (Register 5-6). DS20005395B-page 68 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 REGISTER 5-6: R/W-1 ADDRESS 0X1E – AUTOCAL TIME DELAY CONTROL(1) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 AUTOCAL_TIMEDLY<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown AUTOCAL_TIMEDLY<7:0>: Auto-calibration start time delay control bits 1111-1111 = Maximum value ••• 1000-0000 = (Default) ••• 0000-0000 = Minimum value EN_AUTOCAL_TIMEDLY in Address 0x07 (Register 5-5) enables this register setting. This register controls the time delay before the auto-calibration starts. The value increases linearly with the bit settings, from minimum to maximum values. REGISTER 5-7: R/W-0 ADDRESS 0X52 – DLL CONTROL R/W-0 EN_DUTY R/W-0 R/W-0 DCLK_PHDLY_DLL<2:0> R/W-1 R/W-0 R/W-1 R/W-0 EN_DLL_DCLK EN_DLL EN_CLK RESET_DLL bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 EN_DUTY: Enable DLL circuit for duty cycle correction (DCC) of input clock(1) 1 = Correction is ON 0 = Correction is OFF (Default) bit 6-4 DCLK_PHDLY_DLL<2:0>: Select the phase delay of the digital clock output when using DLL(2) 111 = +315°phase-shifted from default 110 = +270° phase-shifted from default ••• 010 = +90° phase-shifted from default 001 = +45° phase-shifted from default 000 = (Default) bit 3 EN_DLL_DCLK: Enable DLL digital clock output 1 = Enabled (Default) 0 = Disabled: DLL digital clock is turned off. ADC output is not available when DLL is used. bit 2 EN_DLL: Enable DLL circuitry to provide a selectable phase clock to digital output clock. 1 = Enabled 0 = Disabled. DLL block is disabled (Default) bit 1 EN_CLK: Enable clock input buffer 1 = Enabled (Default). 0 = Disabled. No clock is available to the internal circuits, ADC output is not available. bit 0 RESET_DLL: DLL circuit reset control(3) 1 = DLL is active 0 = DLL circuit is held in reset (Default) Note 1: 2: 3: Enable the DLL circuitry for the duty cycle correction. These bits have an effect only if EN_PHDLY = 1 and decimation is not used. DLL reset control procedure: Set this bit to ‘0’ (reset) and then to ‘1’. 2015-2016 Microchip Technology Inc. DS20005395B-page 69 MCP37210-200 AND MCP37D10-200 REGISTER 5-8: ADDRESS 0X53 – CLOCK SOURCE SELECTION R/W-0 R/W-1 R/W-0 FCB<6:4> R/W-0 R/W-0 R/W-1 CLK_SOURCE R/W-0 R/W-1 FCB<3:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-5 FCB<6:4>: Factory-Controlled bits. This is not for the user. Do not change default settings. bit 4 CLK_SOURCE: Select internal timing source 1 = PLL output is selected as timing source 0 = External clock input is selected as timing source (Default) bit 3-0 FCB<3:0>: Factory-Controlled bits. This is not for the user. Do not change default settings. REGISTER 5-9: R/W-0 ADDRESS 0X54 – PLL REFERENCE DIVIDER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PLL_REFDIV<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown PLL_REFDIV<7:0>: PLL Reference clock divider control bits(1) 1111-1111 = PLL reference divided by 255 (if PLL_REFDIV<9:8> = 00) 1111-1110 = PLL reference divided by 254 (if PLL_REFDIV<9:8> = 00) ••• 0000-0011 = PLL reference divided by 3 (if PLL_REFDIV<9:8> = 00) 0000-0010 = Do not use (No effect) 0000-0001 = PLL reference divided by 1 (if PLL_REFDIV<9:8> = 00) 0000-0000 = PLL reference not divided (if PLL_REFDIV<9:8> = 00) (Default) PLL_REFDIV is a 10-bit-wide setting. See Address 0x55 (Register 5-10) for the upper two bits and Table 4-5 for PLL_REFDIV<9:0> bit settings. This setting controls the clock division ratio of the PLL reference clock (external clock input at the clock input pin) before the PLL phase-frequency detector circuitry. Note that the divider value of 2 is not supported. EN_PLL_REFDIV in Address 0x59 (Register 5-14) must be set. DS20005395B-page 70 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 REGISTER 5-10: R/W-0 ADDRESS 0X55 – PLL OUTPUT AND REFERENCE DIVIDER R/W-1 R/W-0 R/W-0 R/W-1 PLL_OUTDIV<3:0> R/W-0 R/W-0 FCB<1:0> R/W-0 PLL_REFDIV<9:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-4 PLL_OUTDIV<3:0>: PLL output divider control bits(1) 1111 = PLL output divided by 15 1110 = PLL output divided by 14 ••• 0100 = PLL output divided by 4 (Default) 0011 = PLL output divided by 3 0010 = PLL output divided by 2 0001 = PLL output divided by 1 0000 = PLL output not divided bit 3-2 FCB<1:0>: Factory-Controlled bits. This is not for the user. Do not change default settings. bit 1-0 PLL_REFDIV<9:8>: Upper two MSb bits of PLL_REFDIV<9:0>(2) 00 = see Table 5-4. (Default) Note 1: 2: PLL_OUTDIV<3:0> controls the PLL output clock divider: VCO output is divided by the PLL_OUTDIV<3:0> setting. See Address 0x54 (Register 5-9) and Table 5-4 for PLL_REFDIV<9:0> bit settings. EN_PLL_REFDIV in Address 0x59 (Register 5-14) must be set. TABLE 5-4: Example – PLL Reference Divider Bit Settings Vs. PLL Reference Input Frequency PLL_REFDIV<9:0> PLL Reference Frequency 11-1111-1111 Reference frequency divided by 1023 11-1111-1110 Reference frequency divided by 1022 — — 00-0000-0011 Reference frequency divided by 3 00-0000-0010 Do not use (Not supported) 00-0000-0001 Reference frequency divided by 1 00-0000-0000 Reference frequency divided by 1 2015-2016 Microchip Technology Inc. DS20005395B-page 71 MCP37210-200 AND MCP37D10-200 REGISTER 5-11: R/W-0 ADDRESS 0X56 – PLL PRESCALER (LSB) R/W-1 R/W-1 R/W-1 R/W-1 R/W-0 R/W-0 R/W-0 PLL_PRE<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared PLL_PRE<7:0>: PLL prescaler selection(1) 1111-1111 = VCO clock divided by 255 (if PLL_PRE<11:8> = 0000) ••• 0111-1000 = VCO clock divided by 120 (if PLL_PRE<11:8> = 0000) (Default) ••• 0000-0010 = VCO clock divided by 2 (if PLL_PRE<11:8> = 0000) 0000-0001 = VCO clock divided by 1 (if PLL_PRE<11:8> = 0000) 0000-0000 = VCO clock not divided (if PLL_PRE<11:8> = 0000) bit 7-0 Note 1: x = Bit is unknown PLL_PRE is a 12-bit-wide setting. The upper four bits (PLL_PRE<11:8>) are defined in Address 0x57. See Table 4-5 for the PLL_PRE<11:0> bit settings. The PLL Prescaler is used to divide down the VCO output clock in the PLL phasefrequency detector loop circuit. REGISTER 5-12: R/W-0 ADDRESS 0X57 – PLL PRESCALER (MSB) R/W-1 R/W-0 R/W-0 R/W-0 R/W-0 FCB<3:0> R/W-0 R/W-0 PLL_PRE<11:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-4 FCB<3:0>: Factory-Controlled bits. This is not for the user. Do not change default settings. bit 3-0 PLL_PRE<11:8>: PLL prescaler selection(1) 1111 = 212 - 1 (max), if PLL_PRE<7:0> = 0xFF ••• 0000 = (Default) Note 1: PLL_PRE is a 12-bit-wide setting. See the lower eight bit settings (PLL_PRE<7:0>) in Address 0x56 (Register 5-11). See Table 5-5 for the PLL_PRE<11:0> bit settings for PLL feedback frequency. TABLE 5-5: Example: PLL Prescaler Bit Settings and PLL Feedback Frequency PLL_PRE<11:0> PLL Feedback Frequency 1111-1111-1111 VCO clock divided by 4095 (212 - 1) 1111-1111-1110 VCO clock divided by 4094 (212 - 2) — — 0000-0000-0011 VCO clock divided by 3 0000-0000-0010 VCO clock divided by 2 0000-0000-0001 VCO clock divided by 1 0000-0000-0000 VCO clock divided by 1 DS20005395B-page 72 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 REGISTER 5-13: R/W-0 ADDRESS 0X58 – PLL CHARGE PUMP R/W-0 R/W-0 R/W-1 FCB<2:0>: R/W-0 R/W-0 PLL_BIAS R/W-1 R/W-0 PLL_CHAGPUMP<3:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-5 FCB<2:0>: Factory-Controlled bits. This is not for the user. Do not change default settings. bit 4 PLL_BIAS: PLL charge pump bias source selection bit 1 = Self-biasing coming from AVDD (Default) 0 = Bandgap voltage from the reference generator (1.2V) bit 3-0 PLL_CHAGPUMP<3:0>: PLL charge pump bias current control bits(1) 1111 = Maximum current ••• 0010 = (Default) ••• 0000 = Minimum current Note 1: PLL_CHAGPUMP<3:0> bits should be set based on the phase detector comparison frequency. The bias current amplitude increases linearly with increasing the bit setting values. The increase is from approximately 25 µA to 375 µA, 25 µA per step. See Section 4.5.2.1 “PLL Output Frequency and Output Control Parameters” for more details of the PLL block. REGISTER 5-14: U-0 ADDRESS 0X59 – PLL ENABLE CONTROL 1 R/W-1 — R/W-0 FCB<4:3> R/W-0 EN_PLL_REFDIV R/W-0 R/W-0 FCB<2:1> R/W-0 R/W-1 EN_PLL FCB<0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 x = Bit is unknown Unimplemented: Not used. bit 6-5 FCB<4:3>: Factory-Controlled bits. This is not for the user. Do not change default settings. bit 4 EN_PLL_REFDIV: Enable PLL Reference Divider (PLL_REFDIV<9:0>). 1 = Enabled 0 = Reference divider is bypassed (Default) bit 3-2 FCB<2:1>: Factory-Controlled bits. This is not for the user. Do not change default settings. bit 1 EN_PLL: Master enable bit for PLL circuit. 1 = Enabled 0 = Disabled (Default) bit 0 FCB<0>: Factory-Controlled bit. This is not for the user. Do not change default setting. 2015-2016 Microchip Technology Inc. DS20005395B-page 73 MCP37210-200 AND MCP37D10-200 REGISTER 5-15: U-0 ADDRESS 0X5A – PLL LOOP FILTER RESISTOR R/W-0 — R/W-1 R/W-0 R/W-1 R/W-1 FCB<1:0> R/W-1 R/W-1 PLL_RES<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 Unimplemented: Not used. bit 6-5 FCB<1:0>: Factory-Controlled bits. This is not for the user. Do not change default settings. bit 4-0 PLL_RES<4:0>: Resistor value selection bits for PLL loop filter(1) 11111 = Maximum value ••• 01111= (Default) ••• 00000 = Minimum value Note 1: PLL_RES<4:0> bits should be set based on the phase detector comparison frequency. The resistor value increases linearly with the bit settings, from minimum to maximum values. See the PLL loop filter section in Section 4.5.2.1 “PLL Output Frequency and Output Control Parameters”. REGISTER 5-16: U-0 ADDRESS 0X5B – PLL LOOP FILTER CAP3 R/W-0 — R/W-1 FCB<1:0> R/W-0 R/W-0 R/W-1 R/W-1 R/W-1 PLL_CAP3<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 Unimplemented: Not used. bit 6-5 FCB<1:0>: Factory-Controlled bits. This is not for the user. Do not change default settings. bit 4-0 PLL_CAP3<4:0>: Capacitor 3 value selection bits for PLL loop filter(1) 11111= Maximum value ••• 00111= (Default) ••• 00000= Minimum value Note 1: This capacitor is in series with the shunt resistor, which is set by PLL_RES<4:0> bits. The capacitor value increases linearly with the bit settings, from minimum to maximum values. This setting should be set based on the phase detector comparison frequency. DS20005395B-page 74 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 REGISTER 5-17: U-0 ADDRESS 0X5C – PLL LOOP FILTER CAP1 R/W-0 — R/W-1 R/W-0 R/W-0 FCB<1:0> R/W-1 R/W-1 R/W-1 PLL_CAP1<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 Unimplemented: Not used. bit 6-5 FCB<1:0>: Factory-Controlled bits. This is not for the user. Do not change default settings. bit 4-0 PLL_CAP1<4:0>: Capacitor 1 value selection bits for PLL loop filter(1) 11111= Maximum value ••• 00111= (Default) ••• 00000= Minimum value Note 1: This capacitor is located between the charge pump output and ground, and in parallel with the shunt resistor which is defined by the PLL_RES<4:0>. The capacitor value increases linearly with the bit settings, from minimum to maximum values. This setting should be set based on the phase detector comparison frequency. REGISTER 5-18: U-0 ADDRESS 0X5D – PLL LOOP FILTER CAP2 R/W-0 — R/W-1 FCB<1:0> R/W-0 R/W-0 R/W-1 R/W-1 R/W-1 PLL_CAP2<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 Unimplemented: Not used. bit 6-5 FCB<1:0>: Factory-Controlled bits. This is not for the user. Do not change default settings. bit 4-0 PLL_CAP2<4:0>: Capacitor 2 value selection bits for PLL loop filter(1) 11111= Maximum value ••• 00111= (Default) ••• 00000= Minimum value Note 1: This capacitor is located between the charge pump output and ground, and in parallel with CAP1 which is defined by the PLL_CAP1<4:0>. The capacitor value increases linearly with the bit settings, from minimum to maximum values. This setting should be set based on the phase detector comparison frequency. 2015-2016 Microchip Technology Inc. DS20005395B-page 75 MCP37210-200 AND MCP37D10-200 ADDRESS 0X5F – PLL ENABLE CONTROL 2(1) REGISTER 5-19: R/W-1 R/W-1 R/W-1 FCB<5:2> R/W-1 R/W-0 R/W-0 EN_PLL_OUT EN_PLL_BIAS R/W-0 R/W-1 FCB<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-4 FCB<5:2>: Factory-Controlled bits. This is not for the user. Do not change default settings. bit 3 EN_PLL_OUT: Enable PLL output. 1 = Enabled 0 = Disabled (Default) bit 2 EN_PLL_BIAS: Enable PLL bias 1 = Enabled 0 = Disabled (Default) bit 1-0 Note 1: FCB<1:0>: Factory-Controlled bits. This is not for the user. Do not change default settings. To enable PLL output, EN_PLL_OUT, EN_PLL_BIAS and EN_PLL in Address 0x59 (Register 5-14) must be set. DS20005395B-page 76 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 REGISTER 5-20: ADDRESS 0X62 – OUTPUT DATA FORMAT AND OUTPUT TEST PATTERN U-0 R/W-0 R/W-0 — FCB<0> DATA_FORMAT R/W-1 R/W-0 OUTPUT_MODE<1:0> R/W-0 R/W-0 R/W-0 TEST_PATTERNS<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 Unimplemented: Not used. bit 6 FCB<0>: Factory-controlled bit. This is not for the user. Do not change default setting. bit 5 DATA_FORMAT: Output data format selection 1 = Offset binary (unsigned) 0 = Two’s complement (Default) bit 4-3 OUTPUT_MODE<1:0>: Output mode selection(1) 11 = Do not use. Output is undefined 10 = Select DDR LVDS output mode with even bit first(2) (Default) 01 = Select CMOS output mode 00 = Output disabled bit 2-0 TEST_PATTERNS<2:0>: Test output data pattern selection(3) 111 = Output data is pseudo-random number (PN) sequence(4) 110 = Sync Pattern for LVDS output Output: '11111111 0000' 101 = Alternating Sequence for LVDS mode Output: ‘01010101 1010’ 100 = Alternating Sequence for CMOS mode Output: ‘11111111 1111’ alternating with ‘00000000 0000’ 011 = Alternating Sequence for CMOS Output: ‘01010101 0101’ alternating with ‘10101010 1010’ 010 = Ramp Pattern: Output (Q0) is incremented by1 LSb per 64 clock cycles 001 = Double Custom Patterns Output: Alternating custom pattern A (see Addresses 0X74 - 0X75 – Registers 5-29 – 5-30) and custom pattern B (see Address 0X76 - 0X77 – Registers 5-31 – 5-32)(5) 000 = Normal Operation. Output: ADC data (Default) Note 1: 2: 3: 4: 5: See Figures 2-1 – 2-2 for the timing diagrams. Rising edge: Q10, Q8, Q6, Q4, Q2, Q0. Falling edge: Q11, Q9, Q7, Q5, Q3, Q1. See Section 4.9.12 “Output Test Patterns” for more details. (a) In LVDS mode: only the active pins (per register settings) are active. Inactive output pins are in High Z state. (b) In CMOS mode: all data output pins (Q11-Q0), output test pins (TP, TP1, TP2), OVR and WCK pins are active, even if they are disabled by register settings. Since the output test pins (TP, TP1, TP2) can toggle during this test, the output test pins can draw extra current if they are connected to the supply pin or ground. To avoid the extra current draws, always leave the test pins floating (not connected). Pseudo-random number (PN) code is generated by the linear feedback shift register (LFSR). See Section 4.9.12.1 “Pseudo-Random Number (PN) Sequence Output” for more details. Pattern A<11:0> and B<11:0> are applied to Q<11:0>. Q11 = OVR, Q10 = WCK. 2015-2016 Microchip Technology Inc. DS20005395B-page 77 MCP37210-200 AND MCP37D10-200 REGISTER 5-21: R/W-0 ADDRESS 0X63 – LVDS OUTPUT LOAD AND DRIVER CURRENT CONTROL R/W-0 R/W-0 R/W-0 R/W-0 FCB<3:0> R/W-0 LVDS_LOAD R/W-0 R/W-1 LVDS_IMODE<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-4 FCB<3:0>: Factory-controlled bits. This is not for the user. Do not change default settings. bit 3 LVDS_LOAD: Enable internal LVDS load termination 1 = Enabled 0 = Disabled (Default) bit 2-0 LVDS_IMODE<2:0>: LVDS driver current control bits 111 = 7.2 mA 011 = 5.4 mA 001 = 3.5 mA (Default) 000 = 1.8 mA Do not use the following settings(1): 110, 101, 100, 010 Note 1: These settings can result in unknown outputs currents. REGISTER 5-22: R/W-0 EN_PHDLY ADDRESS 0X64 – OUTPUT CLOCK PHASE CONTROL WHEN DECIMATION FILTER IS USED R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-1 R/W-1 FCB<3:0> DCLK_PHDLY_DEC<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 EN_PHDLY: Enable digital output clock phase delay control when DLL or decimation filter is used. 1 = Enabled 0 = Disabled (Default) bit 6-4 DCLK_PHDLY_DEC<2:0>: Digital output clock phase delay control when decimation filter is used(1) 111 = +315° phase-shifted from default(2) 110 = +270° phase-shifted from default 101 = +225° phase-shifted from default(2) 100 = +180° phase-shifted from default 011 = +135° phase-shifted from default(2) 010 = +90° phase-shifted from default 001 = +45° phase-shifted from default(2) 000 = Default(3) bit 3-0 FCB<3:0>: Factory-Controlled bits. This is not for the user. Do not change default settings. Note 1: 2: 3: These bits have an effect only if EN_PHDLY = 1. See Address 0x52 (Register 5-7) for the same feature when DLL is used. Only available when the decimation filter setting is greater than 2. When FIR_A/B <8:1> = 0’s (default) and FIR_A<6> = 0, only 4-phase shifts are available (+45°, +135°, +225°, +315°) from default. See Addresses 0x7A, 0x7B and 0x7C (Registers 5-35 –5-37). See address 0x6D and 0x52 for DCLK (Registers 5-28 and 5-7) phase shift for other modes. The phase delay for all other settings is referenced to this default phase. DS20005395B-page 78 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 REGISTER 5-23: R/W-0 ADDRESS 0X65 – LVDS OUTPUT POLARITY CONTROL R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 POL_LVDS<5:0> R/W-0 NO EFFECT<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-2 POL_LVDS<5:0>: Control polarity of LVDS data pairs (Q5+/Q5- – Q0+/Q0-) 111111 = Invert all LVDS pairs 111110 = Invert all LVDS pairs except the LSb pair ••• 100000 = Invert MSb LVDS pair ••• 000001 = Invert LSb LVDS pair 000000 = No inversion of LVDS bit pairs (Default) bit 1-0 NO EFFECT<1:0>: No effect bits. REGISTER 5-24: R/W-0 ADDRESS 0X66 – DIGITAL OFFSET CORRECTION (LOWER BYTE) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 DIG_OFFSET <7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared DIG_OFFSET <7:0>: Lower byte of DIG_OFFSET<15:0>(1) 0000-0000 = Default bit 7-0 Note 1: x = Bit is unknown Offset is added to the ADC output. Setting is two’s complement using two combined registers (16 bits wide). - 0 LSb if DIG_OFFSET<15:0>=0x0000 - Step size: 0.25 LSb per each bit setting - Setting Range: (-215 to 215 - 1) × 0.25 LSb or (-32768 to +32767) × 0.25 LSb REGISTER 5-25: R/W-0 ADDRESS 0X67 – DIGITAL OFFSET CORRECTION (UPPER BYTE) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 DIG_OFFSET<15:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown DIG_OFFSET <15:8>: Upper byte of DIG_OFFSET<15:0>(1) 0000-0000 = Default See Note 1 in Address 0x66 (Register 5-24). 2015-2016 Microchip Technology Inc. DS20005395B-page 79 MCP37210-200 AND MCP37D10-200 REGISTER 5-26: R/W-0 ADDRESS 0X68 – OVR AND WCK BIT CONTROL R/W-0 R/W-1 R/W-0 FCB<5:2> R/W-0 R/W-1 POL_OVR_WCK EN_OVR_WCK R/W-0 R/W-0 FCB<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-4 FCB<5:2>: Factory-Controlled bits. This is not for the user. Do not change default settings. bit 3 POL_OVR_WCK: Polarity control for OVR and WCK bit pair in LVDS mode 1 = Inverted 0 = Not inverted (Default) bit 2 EN_OVR_WCK: Enable OVR and WCK output bit pair 1 = Enabled (Default) 0 = Disabled bit 1-0 FCB<1:0>: Factory-Controlled bits. This is not for the user. Do not change default settings. REGISTER 5-27: R/W-0 R/W-0 ADDRESS 0X6B – PLL CALIBRATION R/W-0 R/W-0 R/W-1 FCB<6:2> R/W-0 R/W-0 PLL_CAL_TRIG R/W-0 FCB<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-3 FCB<6:2>: Factory-Controlled bits. This is not for the user. Do not change default settings. bit 2 PLL_CAL_TRIG: Manually force recalibration of the PLL at the state of bit transition(1) Toggle from ‘1’ to ‘0’, or ‘0’ to ‘1’ = Start PLL calibration bit 1-0 Note 1: FCB<1:0>: Factory-Controlled bits. This is not for the user. Do not change default settings. See PLL_CAL_STAT in Address 0xD1 (Register 5-69) for calibration status indication. DS20005395B-page 80 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 REGISTER 5-28: U-0 ADDRESS 0X6D – PLL OUTPUT AND OUTPUT CLOCK PHASE(1) U-0 ─ R/W-0 R/W-0 EN_PLL_CLK FCB<1> R/W-0 R/W-0 R/W-0 DCLK_DLY_PLL<2:0> R/W-0 FCB<0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 Unimplemented: Not used bit 5 EN_PLL_CLK: Enable PLL output clock 1 = PLL output clock is enabled to the ADC core 0 = PLL clock output is disabled (Default) bit 4 FCB<1>: Factory-Controlled bit. This is not for the user. Do not change default setting. bit 3-1 DCLK_DLY_PLL<2:0>: Output clock is delayed by the number of VCO clock cycles from the nominal PLL output(2) 111 = Delay of 15 cycles 110 = Delay of 14 cycles ••• 001 = Delay of one cycle 000 = No delay (Default) bit 0 FCB<0>: Factory-Controlled bit. This is not for the user. Do not change default setting. Note 1: 2: This register has effect only when the PLL clock is selected by CLK_SOURCE bit in Address 0x53 (Register 5-8) and PLL circuit is enabled by EN_PLL bit in Address 0x59 (Register 5-14). This bit setting enables the output clock phase delay. This phase delay control option is applicable when PLL is used as the clock source and decimation is not used. REGISTER 5-29: R/W-0 ADDRESS 0X74 – USER-DEFINED OUTPUT PATTERN A (LOWER BYTE) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 Do not use (Leave these bits as ‘0000’) PATTERN_A<3:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 PATTERN_A<3:0>: Lower nibble of PATTERN_A<11:0>(1) bit 3-0 Do not use: Leave these bits to default settings (‘0000’)(2) Note 1: 2: x = Bit is unknown See PATTERN_A<11:4> in Address 0x75 (Register 5-30) and TEST_PATTERNS<2:0> in Address 0x62 (Register 5-20). The output from these bit settings is on “Unused Output Pattern Test Pins”, which are recommended to not be connected to the host device. Therefore, the effect of these bit settings is not monitored. Leave these bits at default settings (‘0000’) all the time. 2015-2016 Microchip Technology Inc. DS20005395B-page 81 MCP37210-200 AND MCP37D10-200 REGISTER 5-30: R/W-0 ADDRESS 0X75 – USER-DEFINED OUTPUT PATTERN A (UPPER BYTE) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PATTERN_A<11:4> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared PATTERN_A<11:4>: Upper byte of PATTERN_A<11:0>(1) bit 7-0 Note 1: x = Bit is unknown See PATTERN_A<3:0> in Address 0x74 (Register 5-29) and TEST_PATTERNS<2:0> in Address 0x62 (Register 5-20). REGISTER 5-31: R/W-0 ADDRESS 0X76 – USER-DEFINED OUTPUT PATTERN B (LOWER BYTE) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 Do not use (Leave these bits as ‘0000’) PATTERN_B<3:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 PATTERN_B<3:0>: Lower nibble of PATTERN_B<11:0>(1) bit 3-0 Do not use: Leave these bits at default settings (‘0000’)(2) Note 1: 2: x = Bit is unknown See PATTERN_B<11:4> in Address 0x77 (Register 5-32) and TEST_PATTERNS<2:0> in Address 0x62 (Register 5-20). The output from these bit settings is on “Unused Output Pattern Test Pins”, which are recommended to not be connected to the host device. Therefore, the effect of these bit settings is not monitored. Leave these bits at default settings (‘0000’) all the time. REGISTER 5-32: R/W-0 ADDRESS 0X77 – USER-DEFINED OUTPUT PATTERN B (UPPER BYTE) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PATTERN_B<11:4> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown PATTERN_B<11:4>: Upper byte of PATTERN_B<15:0>(1) See PATTERN_B<3:0> in Address 0x76 (Register 5-31) and TEST_PATTERNS<2:0> in Address 0x62 (Register 5-20). DS20005395B-page 82 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 REGISTER 5-33: ADDRESS 0X78 – NOISE-SHAPING REQUANTIZER (NSR) FILTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 NSR_RESET R/W-0 R/W-0 R/W-0 NSR<6:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 NSR_RESET: Toggling this bit causes a reset of the NSR filter. - Toggle from ‘1’ to ‘0’ or from ‘0’ to ‘1’ = Reset of NSR filter. - Otherwise = No effect (Default) bit 6-0 NSR<6:0>: NSR filter setting. See Table 4-10 T and Table 4-11 for the NSR filter settings. REGISTER 5-34: ADDRESS 0X79 – I/Q CHANNEL DIGITAL SIGNAL POST-PROCESSING CONTROL R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 EN_DSPP_I/Q R/W-0 R/W-0 R/W-0 FCB<6:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 EN_DSPP_I/Q: Enable all digital signal post-processing functions for I/Q-channel operation. 1 = Enabled 0 = Disabled (Default) bit 6-0 FCB<6:0>: Factory-Controlled bits. This is not for the user. Do not change default settings. REGISTER 5-35: ADDRESS 0X7A – FIR_A0 BIT AND NOISE-SHAPING REQUANTIZER (NSR) SELECTION R/W-0 R/W-0 FCB<4> FIR_A<0> R/W-0 R/W-0 R/W-0 R/W-0 FCB<3:0> R/W-0 R/W-0 EN_NSR_11 EN_NSR_12 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 FCB<4>: Factory-Controlled bit. This is not for the user. Do not change default setting. bit 6 FIR_A<0>: Enable the first 2x decimation (Stage 1A in FIR A)(1) 1 = Enabled 0 = Disabled (Default) bit 5-2 FCB<3:0>: Factory-Controlled bits. This is not for the user. Do not change default settings. bit 1 EN_NSR_11: Enable 11-bit noise-shaping requantizer 1 = Enabled 0 = Disabled (Default) bit 0 EN_NSR_12: Enable 12-bit noise-shaping requantizer 1 = Enabled 0 = Disabled (Default) Note 1: Set FIR_A<0> = 0 for I and Q channels in DDC mode (MCP37D10-200). See Address 0x7B (Register 5-36) for FIR_A<8:1>. 2015-2016 Microchip Technology Inc. DS20005395B-page 83 MCP37210-200 AND MCP37D10-200 REGISTER 5-36: R/W-0 R/W-0 ADDRESS 0X7B – FIR A FILTER(1, 4) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 FIR_A<8:1> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 x = Bit is unknown FIR_A<8:1>: Decimation Filter FIR A settings(2) Normal Decimation Operation: FIR_A<8:0> = 1-1111-1111 = Enabled stage 1 - 9 filters (decimation rate: 512) 0-1111-1111 = Enabled stage 1 - 8 filters 0-0111-1111 = Enabled stage 1 - 7 filters 0-0011-1111 = Enabled stage 1 - 6 filters 0-0001-1111 = Enabled stage 1 - 5 filters 0-0000-1111 = Enabled stage 1 - 4 filters 0-0000-0111 = Enabled stage 1 - 3 filters (decimation rate = 8) 0-0000-0011 = Enabled stage 1 - 2 filters (decimation rate = 4) 0-0000-0001 = Enabled stage 1 filter (decimation rate = 2) 0-0000-0000 = Disabled all FIR A filters. (Default) In-Phase (I) Data Channel in DDC Mode (MCP37D10-200):(3) FIR_A<8:0> = 1-1111-1100 = Enabled stage 3 - 9 filters (decimation rate: 128) 0-1111-1100 = Enabled stage 3 - 8 filters 0-0111-1100 = Enabled stage 3 - 7 filters 0-0011-1100 = Enabled stage 3 - 6 filters 0-0001-1100 = Enabled stage 3 - 5 filters 0-0000-1100 = Enabled stage 3 - 4 filters 0-0000-0100 = Enabled stage 3 filter (decimation rate = 2) 0-0000-0000 = Disabled all FIR A filters. (Default) Note 1: 2: 3: 4: The register values are thermometer encoded. FIR_A<0> is placed in Address 0x7A (Register 5-35). In I and Q channel operation, it starts with the 3rd stage filter. SNR is improved by approximately 2.5 dB per each filter stage, but output data rate is reduced by a factor of 2 per stage. The data and clock rates in Address 0X02 (Register 5-3) need to be updated accordingly when this register is updated. Address 0x64 (Register 5-22) setting is also affected. The maximum decimation factor is 512, and 128 for the I and Q channel operation in DDC mode (MCP37D10). DS20005395B-page 84 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 REGISTER 5-37: R/W-0 R/W-0 ADDRESS 0X7C – FIR B FILTER(1) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 FIR_B<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown FIR_B<7:0>:Decimation Filter FIR B settings for Quadrature (Q) data channel 1111-1111 = Enabled stage 3 - 9 filters (decimation rate: 128) 0111-1111 = Enabled stage 3 - 8 filters 0011-1111 = Enabled stage 3 - 7 filters 0001-1111 = Enabled stage 3 - 6 filters 0000-1111 = Enabled stage 3 - 5 filters 0000-0111 = Enabled stage 3 - 4 filters 0000-0011 = Enabled stage 3 filter (decimation rate = 2) 0000-0001 = No effect 0000-0000 = Disabled all FIR B filters. (Default) This register is used only for Q data channel in DDC mode (MCP37D10-200). The register values are thermometer encoded. 2015-2016 Microchip Technology Inc. DS20005395B-page 85 MCP37210-200 AND MCP37D10-200 REGISTER 5-38: ADDRESS 0X80 – DIGITAL DOWN-CONVERTER CONTROL 1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 FCB<0> HBFILTER_A EN_NCO EN_AMPDITH EN_PHSDITH EN_LFSR EN_DDC_FS/8 EN_DDC1 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 FCB<0>: Factory-Controlled bit. This is not for the user. Do not change default setting. bit 6 HBFILTER_A: Select half-bandwidth filter at DDC output of channel A(1) 1 = Select High-Pass filter at DDC output 0 = Select Low-Pass filter at DDC output (Default) bit 5 EN_NCO: Enable NCO of DDC1 1 = Enabled 0 = Disabled (Default) bit 4 EN_AMPDITH: Enable amplitude dithering for NCO(2, 3) 1 = Enabled 0 = Disabled (Default) bit 3 EN_PHSDITH: Enable phase dithering for NCO(2, 3) 1 = Enabled 0 = Disabled (Default) bit 2 EN_LFSR: Enable linear feedback shift register (LFSR) for amplitude and phase dithering for NCO 1 = Enabled 0 = Disabled (Default) bit 1 EN_DDC_FS/8: Enable NCO for the DDC2 to center the DDC output signal to be around fS/8/DER(4) 1 = Enabled 0 = Disabled (Default) bit 0 EN_DDC1: Enable digital down-converter 1 (DDC1) 1 = Enabled(5) 0 = Disabled (Default) Note 1: 2: 3: 4: 5: This filter includes a decimation of 2. This requires the LFSR to be enabled: <EN_LFSR>=1 EN_AMPDITH = 1 and EN_PHSDITH = 1 are recommended for the best performance. DER is the decimation rate defined by FIR A or FIR B filter. If up-converter is disabled, output is I/Q data. DDC and NCO are enabled. For DDC function, bits 0, 2 and 5 need to be enabled together. REGISTER 5-39: ADDRESS 0X81 – DIGITAL DOWN-CONVERTER CONTROL 2 R/W-0 R/W-0 R/W-0 FCB<5> EN_DDC2 GAIN_HBF_DDC R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 FCB<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 FCB<5>: Factory-Controlled bit. This is not for the user. Do not change default setting. bit 6 EN_DDC2: Enable DDC2 after the digital half-band filter (HBF) in DDC 1 = Enabled 0 = Disabled (Default) bit 5 GAIN_HBF_DDC: Gain select for the output of the digital half-band filter (HBF) in DDC 1 = x2 0 = x1 (Default) bit 4-0 FCB<4:0>: Factory-Controlled bits. This is not for the user. Do not change default settings. DS20005395B-page 86 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 REGISTER 5-40: R/W-0 R/W-0 ADDRESS 0X82 – NUMERICALLY CONTROLLED OSCILLATOR (NCO) TUNING (LOWER BYTE) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 NCO_TUNE<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown NCO_TUNE <7:0>: Lower byte of NCO_TUNE<31:0>(1) 0000-0000 = DC (0 Hz) when NCO_TUNE<31:0> = 0x00000000 (Default) See Note 1 and Note 2 in Address 0x85 (Register 5-43). REGISTER 5-41: R/W-0 R/W-0 ADDRESS 0X83 – NUMERICALLY CONTROLLED OSCILLATOR (NCO) TUNING (MIDDLE-LOWER BYTE) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 NCO_TUNE<15:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown NCO_TUNE<15:8>: Middle-lower byte of NCO_TUNE<31:0>(1) 0000-0000 = Default See Note 1 and Note 2 in Address 0x85 (Register 5-43). REGISTER 5-42: R/W-0 R/W-0 ADDRESS 0X84 – NUMERICALLY CONTROLLED OSCILLATOR (NCO) TUNING (MIDDLE-UPPER BYTE) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 NCO_TUNE<23:16> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown NCO_TUNE<23:16>: Middle-upper byte of NCO_TUNE<31:0>(1) 0000-0000 = Default See Note 1 and Note 2 in Address 0x85 (Register 5-43). 2015-2016 Microchip Technology Inc. DS20005395B-page 87 MCP37210-200 AND MCP37D10-200 REGISTER 5-43: R/W-0 R/W-0 ADDRESS 0X85 – NUMERICALLY CONTROLLED OSCILLATOR (NCO) TUNING (UPPER BYTE)(1) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 NCO_TUNE<31:24> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown NCO_TUNE<31:24>: Upper byte of NCO_TUNE<31:0>(2) 1111-1111 = fS if NCO_TUNE<31:0> = 0xFFFF FFFF ••• 0000-0000 = Default bit 7-0 Note 1: 2: This register is used only when DDC is enabled: EN_DDC1 = 1 in Address 0x80 (Register 5-38). See Section 4.6.3.1 “Numerically Controlled Oscillator (NCO)” for the details of NCO. NCO frequency = (NCO_TUNE<31:0>/232) × fS, where fS is the ADC core sampling frequency. REGISTER 5-44: R/W-0 R/W-0 ADDRESS 0X86 – NCO PHASE OFFSET IN DDC MODE (LOWER BYTE)(1,3) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 NCO_PHASE<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: 2: 3: x = Bit is unknown NCO_PHASE<7:0>: Lower byte of NCO_PHASE<15:0>(2) 1111-1111 = 1.4° when NCO_PHASE<15:0> = 0x00FF ••• 0000-0000 = 0° when NCO_PHASE<15:0> = 0x0000 (Default) This register has effect only when DDC mode is used in MCP37D10-200. NCO_PHASE_OFFSET<15:0> = 216 × Phase Offset Value/360. When this register is used, the same setting must be repeated in Addresses 0x88, 0x8A, 0x8C, 0x8E, 0x90, 0x92 and 0x94. REGISTER 5-45: R/W-0 R/W-0 ADDRESS 0X87 – NCO PHASE OFFSET IN DDC MODE (UPPER BYTE)(1) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 NCO_PHASE<15:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: 2: x = Bit is unknown NCO_PHASE<15:8>: Upper byte of NCO_PHASE<15:0>(2) 1111-1111 = 359.995° when NCO_PHASE<15:0> = 0xFFFF ••• 0000-0000 = 0° when NCO_PHASE<15:0> = 0x0000 (Default) See Note 1 and Note 2 in Register 5-44. When this register is used, the same setting must be repeated in Addresses 0x89, 0x8B, 0x8D, 0x8F, 0x91, 0x93, and 0x95. DS20005395B-page 88 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 REGISTER 5-46: R/W-0 R/W-0 ADDRESS 0X88 – NCO PHASE OFFSET (REPEAT) IN DDC MODE (LOWER BYTE)(1) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 NCO_PHASE<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown NCO_PHASE<7:0>: Lower byte of NCO_PHASE<15:0>(1) 0000-0000 = 0° when NCO_PHASE<15:0> = 0x0000 (Default) See Note 1 in Register 5-44. Keep this register setting the same as in Address 0x86. REGISTER 5-47: R/W-0 R/W-0 ADDRESS 0X89 – NCO PHASE OFFSET (REPEAT) IN DDC MODE (UPPER BYTE)(1) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 NCO_PHASE<15:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown NCO_PHASE<15:8>: Upper byte of NCO_PHASE<15:0>(1) 0000-0000 = 0° when NCO_PHASE<15:0> = 0x0000 (Default) See Note 1 in Register 5-44. Keep this register setting the same as in Address 0x87. REGISTER 5-48: R/W-0 R/W-0 ADDRESS 0X8A – NCO PHASE OFFSET (REPEAT) IN DDC MODE (LOWER BYTE)(1) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 NCO_PHASE<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown NCO_PHASE<7:0>: Lower byte of NCO_PHASE<15:0>(1) 0000-0000 = 0° when NCO_PHASE<15:0> = 0x0000 (Default) See Note 1 in Register 5-44. Keep this register setting the same as in Address 0x86. REGISTER 5-49: R/W-0 R/W-0 ADDRESS 0X8B – NCO PHASE OFFSET (REPEAT) IN DDC MODE (UPPER BYTE)(1) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 NCO_PHASE<15:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown NCO_PHASE<15:8>: Upper byte of NCO_PHASE<15:0>(1) 0000-0000 = 0° when NCO_PHASE<15:0> = 0x0000 (Default) See Note 1 in Register 5-44. Keep this register setting the same as in Address 0x87. 2015-2016 Microchip Technology Inc. DS20005395B-page 89 MCP37210-200 AND MCP37D10-200 REGISTER 5-50: R/W-0 R/W-0 ADDRESS 0X8C – NCO PHASE OFFSET (REPEAT) IN DDC MODE (LOWER BYTE)(1) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 NCO_PHASE<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown NCO_PHASE<7:0>: Lower byte of NCO_PHASE<15:0>(1) 0000-0000 = 0° when NCO_PHASE<15:0> = 0x0000 (Default) See Note 1 in Register 5-44. Keep this register setting the same as in Address 0x86. REGISTER 5-51: R/W-0 R/W-0 ADDRESS 0X8D – NCO PHASE OFFSET (REPEAT) IN DDC MODE (UPPER BYTE)(1) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 NCO_PHASE<15:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown NCO_PHASE<15:8>: Upper byte of NCO_PHASE<15:0>(1) 0000-0000 = 0° when NCO_PHASE<15:0> = 0x0000 (Default) See Note 1 in Register 5-44. Keep this register setting the same as in Address 0x87. REGISTER 5-52: R/W-0 R/W-0 ADDRESS 0X8E – NCO PHASE OFFSET (REPEAT) IN DDC MODE (LOWER BYTE)(1) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 NCO_PHASE<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown NCO_PHASE<7:0>: Lower byte of NCO_PHASE<15:0>(1) 0000-0000 = 0° when NCO_PHASE<15:0> = 0x0000 (Default) See Note 1 in Register 5-44. Keep this register setting the same as in Address 0x86. REGISTER 5-53: R/W-0 R/W-0 ADDRESS 0X8F – NCO PHASE OFFSET (REPEAT) IN DDC MODE (UPPER BYTE)(1) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 NCO_PHASE<15:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown NCO_PHASE<15:8>: Upper byte of NCO_PHASE<15:0>(1) 0000-0000 = 0° when NCO_PHASE<15:0> = 0x0000 (Default) See Note 1 in Register 5-44. Keep this register setting the same as in Address 0x87. DS20005395B-page 90 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 REGISTER 5-54: R/W-0 R/W-0 ADDRESS 0X90 – NCO PHASE OFFSET (REPEAT) IN DDC MODE (LOWER BYTE)(1) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 NCO_PHASE<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown NCO_PHASE<7:0>: Lower byte of NCO_PHASE<15:0>(1) 0000-0000 = 0° when NCO_PHASE<15:0> = 0x0000 (Default) See Note 1 in Register 5-44. Keep this register setting the same as in Address 0x86. REGISTER 5-55: R/W-0 R/W-0 ADDRESS 0X91 – NCO PHASE OFFSET (REPEAT) IN DDC MODE (UPPER BYTE)(1) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 NCO_PHASE<15:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown NCO_PHASE<15:8>: Upper byte of NCO_PHASE<15:0>(1) 0000-0000 = 0° when NCO_PHASE<15:0> = 0x0000 (Default) See Note 1 in Register 5-44. Keep this register setting the same as in Address 0x87. REGISTER 5-56: R/W-0 R/W-0 ADDRESS 0X92 – NCO PHASE OFFSET (REPEAT) IN DDC MODE (LOWER BYTE)(1) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 NCO_PHASE<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown NCO_PHASE<7:0>: Lower byte of NCO_PHASE<15:0>(1) 0000-0000 = 0° when NCO_PHASE<15:0> = 0x0000 (Default) See Note 1 in Register 5-44. Keep this register setting the same as in Address 0x86. REGISTER 5-57: R/W-0 R/W-0 ADDRESS 0X93 – NCO PHASE OFFSET (REPEAT) IN DDC MODE (UPPER BYTE)(1) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 NCO_PHASE<15:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown NCO_PHASE<15:8>: Upper byte of NCO_PHASE<15:0>(1) 0000-0000 = 0° when NCO_PHASE<15:0> = 0x0000 (Default) See Note 1 in Register 5-44. Keep this register setting the same as in Address 0x87. 2015-2016 Microchip Technology Inc. DS20005395B-page 91 MCP37210-200 AND MCP37D10-200 REGISTER 5-58: R/W-0 R/W-0 ADDRESS 0X94 – NCO PHASE OFFSET (REPEAT) IN DDC MODE (LOWER BYTE)(1) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 NCO_PHASE<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown NCO_PHASE<7:0>: Lower byte of NCO_PHASE<15:0>(1) 0000-0000 = 0° when NCO_PHASE<15:0> = 0x0000 (Default) See Note 1 in Register 5-44. Keep this register setting the same as in Address 0x86. REGISTER 5-59: R/W-0 R/W-0 ADDRESS 0X95 – NCO PHASE OFFSET (REPEAT) IN DDC MODE (UPPER BYTE)(1) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 NCO_PHASE<15:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown NCO_PHASE<15:8>: Upper byte of NCO_PHASE<15:0>(1) 0000-0000 = 0° when NCO_PHASE<15:0> = 0x0000 (Default) See Note 1 in Register 5-44. Keep this register setting the same as in Address 0x87. DS20005395B-page 92 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 REGISTER 5-60: R/W-0 R/W-0 ADDRESS 0X96 – DIGITAL GAIN CONTROL(1,2) R/W-1 R/W-1 R/W-1 R/W-1 R/W-0 R/W-0 DIG_GAIN<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown DIG_GAIN<7:0>: Digital gain setting(3) 1111-1111 = -0.03125 1111-1110 = -0.0625 1111-1101 = -0.09375 1111-1100 = -0.125 ••• 1000-0011 = -3.90625 1000-0010 = -3.9375 1000-0001 = -3.96875 1000-0000 = -4 0111-1111 = 3.96875 (MAX) 0111-1110 = 3.9375 0111-1101 = 3.90625 0111-1100 = 3.875 ••• 0011-1100 = 1.875 (Default) 0011-1011 = 1.84375 0011-1010 = 1.8125 0011-1001 = 1.78125 0011-1000 = 1.75 (Optimum)(3) bit 7-0 ••• 0000-0011 = 0.09375 0000-0010 = 0.0625 0000-0001 = 0.03125 0000-0000 = 0.0 Note 1: 2: 3: When this setting is updated, the same setting must be repeated in Addresses 0x97 - 0x9D. Max = 0x7F(3.96875), Min = 0x80 (-4), Step size = 0x01 (0.03125). Bit range from 0x81-0xFF is two’s complementary of 0x00-0x80. Negative gain setting inverts output. This setting improves SNR by 0.5 dB from the default setting. This setting is recommended for optimum SNR performance. 2015-2016 Microchip Technology Inc. DS20005395B-page 93 MCP37210-200 AND MCP37D10-200 REGISTER 5-61: R/W-0 R/W-0 ADDRESS 0X97 – DIGITAL GAIN CONTROL (REPEAT)(1,2) R/W-1 R/W-1 R/W-1 R/W-1 R/W-0 R/W-0 DIG_GAIN<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown DIG_GAIN<7:0>: Digital gain setting(3) 0011-1100 = 1.875 (Default) Keep this register setting the same as in Address 0x96. See Notes 1 - 3 in Register 5-60. REGISTER 5-62: R/W-0 R/W-0 ADDRESS 0X98 – DIGITAL GAIN CONTROL (REPEAT)(1,2) R/W-1 R/W-1 R/W-1 R/W-1 R/W-0 R/W-0 DIG_GAIN<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown DIG_GAIN<7:0>: Digital gain setting(3) 0011-1100 = 1.875 (Default) Keep this register setting the same as in Address 0x96. See Notes 1 - 3 in Register 5-60. REGISTER 5-63: R/W-0 R/W-0 ADDRESS 0X99 – DIGITAL GAIN CONTROL (REPEAT)(1,2) R/W-1 R/W-1 R/W-1 R/W-1 R/W-0 R/W-0 DIG_GAIN<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown DIG_GAIN<7:0>: Digital gain setting(3) 0011-1100 = 1.875 (Default) Keep this register setting the same as in Address 0x96. See Notes 1 - 3 in Register 5-60. REGISTER 5-64: R/W-0 R/W-0 ADDRESS 0X9A – DIGITAL GAIN CONTROL (REPEAT)(1,2) R/W-1 R/W-1 R/W-1 R/W-1 R/W-0 R/W-0 DIG_GAIN<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown DIG_GAIN<7:0>: Digital gain setting(3) 0011-1100 = 1.875 (Default) Keep this register setting the same as in Address 0x96. See Notes 1 - 3 in Register 5-60. DS20005395B-page 94 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 REGISTER 5-65: R/W-0 R/W-0 ADDRESS 0X9B – DIGITAL GAIN CONTROL (REPEAT)(1,2) R/W-1 R/W-1 R/W-1 R/W-1 R/W-0 R/W-0 DIG_GAIN<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown DIG_GAIN<7:0>: Digital gain setting(3) 0011-1100 = 1.875 (Default) Keep this register setting the same as in Address 0x96. See Notes 1 - 3 in Register 5-60. REGISTER 5-66: R/W-0 R/W-0 ADDRESS 0X9C – DIGITAL GAIN CONTROL (REPEAT)(1,2) R/W-1 R/W-1 R/W-1 R/W-1 R/W-0 R/W-0 DIG_GAIN<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown DIG_GAIN<7:0>: Digital gain setting(3) 0011-1100 = 1.875 (Default) Keep this register setting the same as in Address 0x96. See Notes 1 - 3 in Register 5-60. REGISTER 5-67: R/W-0 R/W-0 ADDRESS 0X9D – DIGITAL GAIN CONTROL (REPEAT)(1,2) R/W-1 R/W-1 R/W-1 R/W-1 R/W-0 R/W-0 DIG_GAIN<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown DIG_GAIN<7:0>: Digital gain setting(3) 0011-1100 = 1.875 (Default) Keep this register setting the same as in Address 0x96. See Notes 1 - 3 in Register 5-60. 2015-2016 Microchip Technology Inc. DS20005395B-page 95 MCP37210-200 AND MCP37D10-200 REGISTER 5-68: R-0 ADDRESS 0XC0 – CALIBRATION STATUS INDICATION R-0 R-0 R-0 R-0 ADC_CAL_STAT R-0 R-0 R-0 FCB<6:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 ADC_CAL_STAT: Power-Up auto-calibration status indication flag bit 1 = Device power-up calibration is completed 0 = Device power-up calibration is not completed bit 6-0 FCB<6:0>: Factory-Controlled bits. These bits are readable and have no meaning for the user. REGISTER 5-69: R-x R-x FCB<4:3> ADDRESS 0XD1 – PLL CALIBRATION STATUS AND PLL DRIFT STATUS INDICATION R-x PLL_CAL_STAT R-x R-x FCB<2:1> R-x R-x R-x PLL_VCOL_STAT PLL_VCOH_STAT FCB<0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 FCB<4:3>: Factory-Controlled bits. These bits are read only and have no meaning for the user. bit 5 PLL_CAL_STAT: PLL auto-calibration status indication flag bit(1) 1 = Complete: PLL auto-calibration is completed 0 = Incomplete: PLL auto-calibration is not completed bit 4-3 FCB<2:1>: Factory-Controlled bits. These bits are read only and have no meaning for the user. bit 2 PLL_VCOL_STAT: PLL drift status indication bit 1 = PLL drifts out of lock with low VCO frequency 0 = PLL operates as normal bit 1 PLL_VCOH_STAT: PLL drift status indication bit 1 = PLL drifts out of lock with high VCO frequency 0 = PLL operates as normal bit 0 FCB<0>: Factory-Controlled bit. This bit is read only and has no meaning for the user. Note 1: See PLL_CAL_TRIG bit setting in Address 0x6B (Register 5-27). DS20005395B-page 96 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 REGISTER 5-70: R-x R-x ADDRESS 0X15C – CHIP ID (LOWER BYTE)(1) R-x R-x R-x R-x R-x R-x CHIP_ID<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown CHIP_ID<7:0>: Chip ID of the device: Lower byte of the CHIP ID<15:0> Read-only register. Preprogrammed at the factory for internal use. Example: MCP37210-200: '0001000000110000’ MCP37D10-200: '0001001000110000’ REGISTER 5-71: R-x R-x ADDRESS 0X15D – CHIP ID (UPPER BYTE)(1) R-x R-x R-x R-x R-x R-x CHIP_ID<15:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown CHIP_ID<15:8>: Chip ID of the device: Upper byte of the CHIP_ID<15:0> Read-only register. Preprogrammed at the factory for internal use. Example: MCP37210-200: '0001000000110000’ MCP37D10-200: '0001001000110000’ 2015-2016 Microchip Technology Inc. DS20005395B-page 97 MCP37210-200 AND MCP37D10-200 NOTES: DS20005395B-page 98 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 6.0 DEVELOPMENT SUPPORT Microchip offers a high-speed ADC evaluation platform which can be used to evaluate Microchip’s high-speed ADC products. The platform consists of an MCP37XX0-200 evaluation board, an FPGA-based data capture card board and PC-based Graphical User Interface (GUI) software for ADC and evaluation. Figure 6-1 and Figure 6-2 show this evaluation tool. This evaluation platform allows users to quickly evaluate the ADC’s performance for their specific application requirements. More information is available at http://www.microchip.com. (a) MCP37XX0 Evaluation Board FIGURE 6-1: MCP37XX0 Evaluation Kit. FIGURE 6-2: PC-Based Graphical User Interface Software. 2015-2016 Microchip Technology Inc. (b) Data Capture Board DS20005395B-page 99 MCP37210-200 AND MCP37D10-200 NOTES: DS20005395B-page 100 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 7.0 TERMINOLOGY Analog Input Bandwidth (Full-Power Bandwidth) The analog input frequency at which the spectral power of the fundamental frequency (as determined by FFT analysis) is reduced by 3 dB. Aperture Delay or Sampling Delay The time delay between the rising edge of the input sampling clock and the actual time at which the sampling occurs. Aperture Uncertainty The sample-to-sample variation in aperture delay. Aperture Delay Jitter The variation in the aperture delay time from conversion to conversion. This random variation will result in noise when sampling an AC input. The signal-to-noise ratio due to the jitter alone will be: EQUATION 7-1: SNRJITTER = – 20 log 2 fIN t JITTER Calibration Algorithms This device utilizes two patented analog and digital calibration algorithms, Harmonic Distortion Correction (HDC) and DAC Noise Cancellation (DNC), to improve the ADC performance. The algorithms compensate various sources of linear impairments such as capacitance mismatch, charge injection error and finite gain of operational amplifiers. These algorithms execute in both power-up sequence (foreground) and background mode: • Power-Up Calibration: The calibration is conducted within the first 3×226 clock cycles after power-up. The user needs to wait this Power-Up Calibration period after the device is powered-up for an accurate ADC performance. • Background Calibration: This calibration is conducted in the background while the ADC is performing conversions. The update rate is about once every 230 clock cycles. Pipeline Delay (LATENCY) LATENCY is the number of clock cycles between the initiation of conversion and when that data is presented to the output pins. Data for any given input sample is available after the pipeline delay plus the output delay after that sample is taken. New data is available at 2015-2016 Microchip Technology Inc. every clock cycle, but the data lags the conversion by the pipeline delay plus the output delay. Latency is increased if digital signal post-processing is used. Clock Pulse Width and Duty Cycle The clock duty cycle is the ratio of the time the clock signal remains at a logic high (clock pulse width) to one clock period. Duty cycle is typically expressed as a percentage. A perfect differential sine-wave clock results in a 50% duty cycle. Differential Nonlinearity (DNL, No Missing Codes) An ideal ADC exhibits code transitions that are exactly 1 LSb apart. DNL is the deviation from this ideal value. No missing codes to 12-bit resolution indicates that all 4096 codes must be present over all the operating conditions. Integral Nonlinearity (INL) INL is the maximum deviation of each individual code from an ideal straight line drawn from negative full scale through positive full scale. Signal-to-Noise Ratio (SNR) SNR is the ratio of the power of the fundamental (PS) to the noise floor power (PN), below the Nyquist frequency and excluding the power at DC and the first nine harmonics. EQUATION 7-2: PS SNR = 10 log ------- PN SNR is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dB to full-scale) when the power of the fundamental is extrapolated to the converter full-scale range. Signal-to-Noise and Distortion (SINAD) SINAD is the ratio of the power of the fundamental (PS) to the power of all the other spectral components including noise (PN) and distortion (PD) below the Nyquist frequency, but excluding DC: EQUATION 7-3: PS SINAD = 10 log ---------------------- PD + P N = – 10 log 10 SNR – ----------10 – 10 THD – -----------10 DS20005395B-page 101 MCP37210-200 AND MCP37D10-200 SINAD is given in either units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dB to full-scale) when the power of the fundamental is extrapolated to the converter full-scale range. Total Harmonic Distortion (THD) THD is the ratio of the power of the fundamental (PS) to the summed power of the first 13 harmonics (PD). PS THD = 10 log -------- PD Effective Number of Bits (ENOB) The effective number of bits for a sine wave input at a given input frequency can be calculated directly from its measured SINAD using the following formula: THD is typically given in units of dBc (dB to carrier). THD is also shown by: EQUATION 7-4: EQUATION 7-5: SINAD – 1.76 ENOB = ---------------------------------6.02 Gain Error Gain error is the deviation of the ADC’s actual input full-scale range from its ideal value. The gain error is given as a percentage of the ideal input full-scale range. Gain error is usually expressed in LSb or as a percentage of full-scale range (%FSR). Gain-Error Drift Gain-error drift is the variation in gain error due to a change in ambient temperature, typically expressed in ppm/°C. Offset Error The major carry transition should occur for an analog value of ½ LSb below AIN+ = AIN−. Offset error is defined as the deviation of the actual transition from that point. Temperature Drift The temperature drift for offset error and gain error specifies the maximum change from the initial (+25°C) value to the value across the TMIN to TMAX range. 2 2 2 2 V2 + V3 + V4 + + Vn THD = – 20 log -----------------------------------------------------------------2 V1 Where: V1 = RMS amplitude of the fundamental frequency V1 through Vn = Amplitudes of the second through nth harmonics Two-Tone Intermodulation Distortion (Two-Tone IMD, IMD3) Two-tone IMD is the ratio of the power of the fundamental (at frequencies fIN1 and fIN2) to the power of the worst spectral component at either frequency 2fIN1 – fIN2 or 2fIN2 – fIN1. Two-tone IMD is a function of the input amplitudes and frequencies (fIN1 and fIN2). It is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dB to full-scale) when the power of the fundamental is extrapolated to the ADC full-scale range. Common-Mode Rejection Ratio (CMRR) The maximum clock rate at which parametric testing is performed. Common-mode rejection is the ability of a device to reject a signal that is common to both sides of a differential input pair. The common-mode signal can be an AC or DC signal or a combination of the two. CMRR is measured using the ratio of the differential signal gain to the common-mode signal gain and expressed in dB with the following equation: Minimum Conversion Rate EQUATION 7-6: Maximum Conversion Rate The minimum clock rate at which parametric testing is performed. Spurious-Free Dynamic Range (SFDR) SFDR is the ratio of the power of the fundamental to the highest other spectral component (either spur or harmonic). SFDR is typically given in units of dBc (dB to carrier) or dBFS. DS20005395B-page 102 Where: A DIFF CMRR = 20 log ------------------ ACM ADIFF = Output Code/Differential Voltage ADIFF = Output Code/Common Mode Voltage 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 8.0 PACKAGING INFORMATION 8.1 Package Marking Information 121-Lead TFBGA (8x8 mm) Example A1 A1 XXXXXXXXXXX XXXXXXXXXXX XXXXXXXXXXX XXXXXXXXXXX XXXXXXXXXXX XXXXXXXXXXX YYWWNNN XXXXXXXXXXX YYWWNNN MICROCHIP MCP37210 200/TE e1 ^^ 160991C 124-Lead VTLA (9x9x0.9 mm) Example A1 A1 XXXXXXXXXXX XXXXXXXXXXX XXXXXXXXXXX YYWWNNN Legend: XX...X Y YY WW NNN e1 e4 * Note: MCP37210 200-I/TL e4 ^^ 160991C Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for SnAgCu Pb-free JEDEC® designator for NiPdAu This package is Pb-free. The Pb-free JEDEC designator ( e1 or e4 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2015-2016 Microchip Technology Inc. DS20005395B-page 103 MCP37210-200 AND MCP37D10-200 121-Ball Thin Fine Pitch Ball Grid Array (TE) - 8x8 mm Body [TFBGA] System In Package Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B NOTE 1 E (DATUM B) (DATUM A) 2X 0.15 C 2X 0.15 C TOP VIEW A 0.10 C C SEATING PLANE A2 0.10 C A1 SIDE VIEW D1 eD L K J H eE G E1 F E D C B A 1 A1 BALL PAD CORNER 2 3 4 5 6 7 8 9 10 11 BOTTOM VIEW DETAIL A Microchip Technology Drawing C04-212A Sheet 1 of 2 DS20005395B-page 104 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 121-Ball Thin Fine Pitch Ball Grid Array (TE) - 8x8 mm Body [TFBGA] System In Package Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 121X Øb 0.15 0.08 C A B C DETAIL A Units Dimension Limits Number of Terminals N eE Pitch eD Pitch Overall Height A Standoff A1 Cap Thickness A2 Overall Width E Overall Pitch E1 Overall Length D Overall Pitch D1 b Terminal Diameter MIN 0.21 0.40 .035 MILLIMETERS NOM 121 0.65 BSC 0.65 BSC 0.32 0.45 8.00 BSC 6.50 BSC 8.00 BSC 6.50 BSC 0.40 MAX 1.08 0.50 0.45 Notes: 1. Terminal A1 visual index feature may vary, but must be located within the hatched area. 2. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-212A Sheet 2 of 2 2015-2016 Microchip Technology Inc. DS20005395B-page 105 MCP37210-200 AND MCP37D10-200 121-Ball Thin Fine Pitch Ball Grid Array (TE) - 8x8 mm Body [TFBGA] System In Package Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E C2 121X ØB E C1 SILK SCREEN RECOMMENDED LAND PATTERN Units Dimension Limits Contact Pitch E Contact Pad Spacing C1 Contact Pad Spacing C2 Contact Pad Diameter (X121) B MIN MILLIMETERS NOM 0.65 BSC 6.50 6.50 0.35 MAX Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing No. C04-2212B-TE DS20005395B-page 106 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 2015-2016 Microchip Technology Inc. DS20005395B-page 107 MCP37210-200 AND MCP37D10-200 DS20005395B-page 108 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 124-Very Thin Leadless Array Package (TL) – 9x9x0.9 mm Body [VTLA] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E E/2 G4 X1 X2 G3 E T2 C2 G1 G5 X4 G2 SILK SCREEN W3 W2 C1 RECOMMENDED LAND PATTERN Units Dimension Limits Contact Pitch E Pad Clearance G1 Pad Clearance G2 Pad Clearance G3 Pad Clearance G4 Contact to Center Pad Clearance (X4) G5 Optional Center Pad Width T2 Optional Center Pad Length W2 W3 Optional Center Pad Chamfer (X4) Contact Pad Spacing C1 Contact Pad Spacing C2 Contact Pad Width (X124) X1 Contact Pad Length (X124) X2 MIN MILLIMETERS NOM 0.50 BSC MAX 0.20 0.20 0.20 0.20 0.30 6.60 6.60 0.10 8.50 8.50 0.30 0.30 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing No. C04-2193A 2015-2016 Microchip Technology Inc. DS20005395B-page 109 MCP37210-200 AND MCP37D10-200 NOTES: DS20005395B-page 110 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 APPENDIX A: REVISION HISTORY Revision B (April 2016) • Modified package types and device offers to reflect the availability of the TFBGA package. • Updated input leakage current at CLK input pin in Table 2-1. • Minor typographical changes. Revision A (April 2015) • Original Release of this Document. 2015-2016 Microchip Technology Inc. DS20005395B-page 111 MCP37210-200 AND MCP37D10-200 NOTES: DS20005395B-page 112 2015-2016 Microchip Technology Inc. MCP37210-200 AND MCP37D10-200 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. [X](1) Device Tape and Reel Option -XXX X Sample Temperature Rate Range /XX Package Device: MCP37210-200: 12-Bit Low-Power Single-Channel ADC MCP37D10-200: 12-Bit Low-Power Single-Channel ADC with digital down-converter option Tape and Reel Option: Blank T = Standard packaging (tube or tray) = Tape and Reel(1) Sample Rate 200 = 200 Msps Temperature Range: I = -40C to Package: TL Examples: a) b) c) a) b) c) +85C MCP37210-200I/TL: Industrial temperature, 124LD VTLA, 200 Msps MCP37210T-200I/TL: Tape and Reel, Industrial temperature, 124LD VTLA, 200 Msps MCP37210T-200I/TE: Tape and Reel, Industrial temperature, 121LD TFBGA, 200 Msps MCP37D10-200I/TL: Industrial temperature, 124LD VTLA, 200 Msps MCP37D10T-200I/TL: Tape and Reel, Industrial temperature, 124LD VTLA, 200 Msps MCP37D10-200I/TE: Industrial temperature, 121LD TFBGA, 200 Msps (Industrial) Note 1: TE = Terminal Very Thin Leadless Array Package 9x9x0.9 mm Body (VTLA), 124-Lead = Ball Plastic Thin Profile Fine Pitch Ball Grid Array 8x8 mm Body (TFBGA), 121-Lead 2015-2016 Microchip Technology Inc. Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS20005395B-page 113 MCP37210-200 AND MCP37D10-200 NOTES: DS20005395B-page 114 2015-2016 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2015-2016 Microchip Technology Inc. Trademarks The Microchip name and logo, the Microchip logo, AnyRate, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, ETHERSYNCH, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker, Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2015-2016, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. 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