TDA7100 Single-Sided PCB Application Note Revision 1.0, 2011-07-27 Wireless Sense & Control Edition 2011-07-27 Published by Infineon Technologies AG 81726 Munich, Germany © 2011 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Single-Sided PCB TDA7100 TDA7100 Single-Sided PCB Revision History: 2011-07-27, Revision 1.0 Previous Revision: none Page Subjects (major changes since last revision) 29 Explanation regarding the Absolute Maximum Ratings Trademarks of Infineon Technologies AG AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, EconoPACK™, CoolMOS™, CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OptiMOS™, ORIGA™, PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™, SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™. Other Trademarks Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™, PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited. Last Trademarks Update 2011-02-24 Application Note 3 Revision 1.0, 2011-07-27 Single-Sided PCB TDA7100 Table of Contents Table of Contents Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Circuit Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 PCB-Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4 Bill of Materials of Single-Sided PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Application Note 4 Revision 1.0, 2011-07-27 Single-Sided PCB TDA7100 Introduction 1 Introduction In a RF circuit design, no matter whether it is a receiver, transmitter or transceiver, the layout always has a significant influence on the performance of the application. Performance parameter affected by the layout can include EMI, EMC, spurious radiation, reliability of the over production spread, temperature, supply voltage and sensitivity of the design to its environment (e.g. FOB handheld-effect ...). Therefore a proper compact layout is essential for the reliable device functionality. That’s why Infineon always recommends a compact layout with short lines and as much electrical/physical separation of RF circuit from other circuit blocks as possible. In particular it is important to get good separation between the crystal oscillator circuit and RF circuits. It is also very important to separate the clock and the crystal oscillator to minimize coupling of noise and especially of harmonics, showing same frequency, as the crystal of clock output into the crystal input. In some applications, single sided PCB may be desired to reduce cost. While a single sided design reduces cost, it also creates additional design limitations that may affect performance as described above. However, in many applications with less stringent requirements (e.g. non-automotive) performance may still be acceptable. The PCB shown in this App.-Note (circuit diagram, layout and BOM) shows one example of how a single sided design could be implemented. This example given in this App.-Note is a proposal, but the final customer design has to be verified by the designer to make sure their application complies with the respective government regulations. Application Note 5 Revision 1.0, 2011-07-27 Bat., Supply VS FSKDTA 7 ASKDTA 6 PWDN 10 VS 2 VS C7 68nF On PAOUT 9 L1 tbd. nH RF Loop Antenna Application Note 6 COSC 5 Crystal C6 13.56 MHz 22pF C5 15pF Ground FSKDTA XTAL Osc 1 CLKOUT :16 φ Det 3 GND LF VCO :2 TDA7100 Transmitter :64 Power AMP L2 tbd nH R1 22Ω VS PAGND 8 C1 tbd pF C3 tbd pF Infineon Technologies C4 1nF DATE: 07.07. 2011 Document Number: TITLE: TDA7100 Single-Sided PCB Antenna Matching Circuit C2 tbd. pF Circuit Diagram Single-Sided-PCB with TDA7100 Power Supply Figure 1 OR Circuit Diagram FSKOUT 4 2 ASKDTA Single-Sided PCB TDA7100 Circuit Diagram Also, in addition to the specific layout shown, please note that due to their higher harmonic larger amplitude contend, steep ASKDTA and FSKDTA data signal edges produce the undesirable effect of a wider spectrum or Revision 1.0, 2011-07-27 Single-Sided PCB TDA7100 Circuit Diagram Occupied Bandwidth (OBW). To avoid these unnecessary steep edges, it is recommended to insert a low pass filter in the ASKDTA and FSKDTA line somewhere before the TDA7100 ASKDTA and FSKDTA inputs. Application Note 7 Revision 1.0, 2011-07-27 Single-Sided PCB TDA7100 PCB-Layout 3 PCB-Layout Figure 2 Top Layer of Single-Sided-PCB of TDA7100 Application Note 8 Revision 1.0, 2011-07-27 Single-Sided PCB TDA7100 Bill of Materials of Single-Sided PCB 4 Bill of Materials of Single-Sided PCB Table 1 Bill of Materials Ref Value Specification R1 22 Ω 0603, ± 5% L1 tbd. nH Coilcraft SIMID 0603CS 82NXJL, ± 2% L2 tbd. nH Coilcraft SIMID 0603CS 82NXJL, ± 2% C1 tbd. pF 0603, COG, ± 0.1 pF C2 tbd. pF 0603, COG, ± 0.1 pF C3 tbd. pF 0603, COG, ± 0.1pF C4 1 nF 0603, COG, ± 5% C5 15 pF 0603, COG, ± 5% C6 22 pF 0603, COG, ± 5% C7 68 nF 0603, XR7, ± 5% Q1 fRF/32 AEL HC49S 13.56875 MHz, CL=12 pF, X13M568750L002 X1 4-pole pin connector 4-pole pin connector, 2,54mm IC1 TDA7100 Infineon Application Note 9 Revision 1.0, 2011-07-27 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG