UESD16V8S4C Quad Line 12V ESD Protection Diode Array UESD16V8S4C SOT23-6 General Description The UESD16V8S4C of TVS diode array is designed to protect sensitive electronics from damage or latch-up due to ESD, for high voltage applications where board space is at a premium. It is unidirectional device and may be used on lines where the signal polarities are above ground, each device will protect up to four lines. TVS diodes are solid-state devices feature large cross-sectional area junctions for conducting high transient currents, specifically for transient suppression. It offers desirable characteristics for board level protection including fast response time, low operating, low clamping voltage, and no device degradation. The UESD16V8S4C may be used to meet the immunity requirements of IEC 61000-4-2, level 4. The small package makes them ideal for use in portable electronics such as cell phones, PDA’s, notebook computers, and digital cameras. Applications Features Cellular Handsets & Accessories Telecom Equipment Notebooks & Handhelds Portable Instrumentation Industrial PC Industrial Automation Top View 6 1 6 2 5 3 4 5 UCJ Marking Pin 1 1 4 M Pin Configurations Transient Protection for Data & Power Lines to IEC 61000-4-2 (ESD) ±15kV (Air), ±8kV (Contact) Protect Four I/O Lines Ultra-Small SOT23-6 Package Working Voltage: 12V Low Leakage Current Low Operating and Clamping Voltage Solid-State Silicon Avalanche Technology 2 3 M: Month Code UESD16V8S4C SOT23-6 Ordering Information Part Number Working Voltage Packaging Type Channel Marking Code Shipping Qty UESD16V8S4C 12.0V SOT23-6 4 UCJ 3000pcs/7 Inch Tape & Reel ________________________________________________________________________ http://www.union-ic.com Rev.04 Jun.2016 1/6 UESD16V8S4C Absolute Maximum Ratings Rating Peak Pulse Power (tP=8/20μs) Maximum Peak Pulse Current (tP=8/20μs) Lead Soldering Temperature Operating Temperature Storage Temperature Symbol PPK IPP TL TJ TSTG Value 140 5.9 260 (10 sec.) -55 to +125 -55 to +150 Unit Watts Amps °C °C °C Symbol Definition Parameter Maximum Reverse Peak Pulse Current Clamping Voltage @ Ipp Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM Breakdown Voltage @ IT Test Current Forward Current Forward Voltage @ IF Peak Power Dissipation Max. Capacitance @ VR=0V, f=1MHz Symbol IPP VC VRWM IR VBR IT IF VF PPK C ________________________________________________________________________ http://www.union-ic.com Rev.04 Jun.2016 2/6 UESD16V8S4C Electrical Characteristics (T=25°C, Device for 12.0V Reverse Stand-Off Voltage) Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamping Voltage Symbol Junction Capacitance Conditions Min Typ VRWM 16 Max Unit 12 V 18 V VBR IT=1mA IR VRWM=12V, T=25°C 0.5 μA VC IPP=5.9A, tp=8/20μs 23 V CJ VR=0V, f=1MHz 30 pF 20 Applications Information UESD16V8S4C ESD protection diode is designed to protect quad data, I/O, or power supply line. The device is unidirectional and may be used on lines where the signal polarity is above ground. The cathode should be placed towards the line that is to be protected. Device Connection for Protection of Quad Data Lines The Quad TVS Diode Array is designed to protect up to four unidirectional data lines. The device is connected as follows: Unidirectional protection of four I/O lines is achieved by connecting pins 1, 3, 4 and 6 to the data lines. Pin 2 is connected to ground. The ground connection should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. Circuit Diagram 1 3 4 2 Protection of Four Unidirectional Lines 6 I/O1 I/O2 1 6 2 5 3 4 NC I/O3 I/O4 Circuit Board Layout Recommendations for Suppression of ESD Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. ________________________________________________________________________ http://www.union-ic.com Rev.04 Jun.2016 3/6 UESD16V8S4C Use ground planes whenever possible. For multilayer printed-circuit boards, use ground vias. Keep parallel signal paths to a minimum. Avoid running protection conductors in parallel with unprotected conductor. Minimize all printed-circuit board conductive loops including power and ground loops. Avoid using shared transient return paths to a common ground point. ________________________________________________________________________ http://www.union-ic.com Rev.04 Jun.2016 4/6 UESD16V8S4C Package Information UESD16V8S4C SOT23-6 Outline Drawing θ D b L Symbol 5 1 2 4 E E1 6 3 e1 c Top View End View A1 A2 A e Side View A A1 A2 b c D E E1 e e1 L θ DIMENSIONS MILLIMETERS INCHES Min Typ Max Min Typ Max 1.013 1.15 1.40 0.040 0.045 0.055 0.00 0.05 0.10 0.000 0.002 0.004 1.00 1.10 1.30 0.039 0.043 0.051 0.30 0.50 0.012 0.020 0.10 0.15 0.20 0.004 0.006 0.008 2.82 3.10 0.111 0.122 1.50 1.60 1.70 0.059 0.063 0.067 2.60 2.80 3.00 0.102 0.110 0.118 0.95REF 0.037REF 1.90REF 0.075REF 0.30 0.60 0.012 0.024 0° 8° 0° 8° Land Pattern 2.35 0.56 1.20 NOTES: 1. Compound dimension: 2.92×1.60； 2. Unit: mm; 3. General tolerance ±0.05mm unless otherwise specified; 4. The layout is just for reference. 0.95 0.95 UCJ M Tape and Reel Orientation ________________________________________________________________________ http://www.union-ic.com Rev.04 Jun.2016 5/6 UESD16V8S4C GREEN COMPLIANCE Union Semiconductor is committed to environmental excellence in all aspects of its operations including meeting or exceeding regulatory requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to reduce the use of hazardous substances and/or emissions. All Union components are compliant with the RoHS directive, which helps to support customers in their compliance with environmental directives. For more green compliance information, please visit: http://www.union-ic.com/index.aspx?cat_code=RoHSDeclaration IMPORTANT NOTICE The information in this document has been carefully reviewed and is believed to be accurate. Nonetheless, this document is subject to change without notice. Union assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update or to keep current the contained information, or to notify a person or organization of any update. Union reserves the right to make changes, at any time, in order to improve reliability, function or design and to attempt to supply the best product possible. Union Semiconductor, Inc Add: Unit 606, No.570 Shengxia Road, Shanghai 201210 Tel: 021-51093966 Fax: 021-51026018 Website: www.union-ic.com ________________________________________________________________________ http://www.union-ic.com Rev.04 Jun.2016 6/6