Radiation Hardened Dual, Inverting Power MOSFET Drivers HS-4423RH, HS-4423EH, HS-4423BRH, HS-4423BEH Features The Radiation Hardened HS-4423RH, HS-4423EH, HS-4423BRH, HS-4423BEH are inverting, dual, monolithic high-speed MOSFET drivers designed to convert TTL level signals into high current outputs at voltages up to 18V. • QML qualified per MIL-PRF-38535 requirements • Electrically screened to DLA SMD # 5962-99511 • EH version acceptance tested to 50krad(Si) (LDR) The inputs of these devices are TTL compatible and can be directly driven by our HS-1825ARH PWM device or by our ACS/ACTS and HCS/HCTS type logic devices. The fast rise times and high current outputs allow very quick control of high gate capacitance power MOSFETs in high frequency applications. The high current outputs minimize power losses in MOSFETs by rapidly charging and discharging the gate capacitance. The output stage incorporates a low voltage lock-out circuit that puts the outputs into a three-state mode when the supply voltage drops below 10V for the HS-4423RH, HS-4423EH and 7.5V for the HS-4423BRH and HS-4423BEH. Constructed with the Intersil dielectrically isolated Rad Hard Silicon Gate (RSG) BiCMOS process, these devices are immune to Single Event Latch-up and have been specifically designed to provide highly reliable performance in harsh radiation environments • Radiation environment - High dose rate (50-300rad(Si)/s). . . . . . . . . . . 300krad(Si) - Latch-up immune - Low dose rate immune • IPEAK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >2A (typ) • Matched rise and fall times (CL = 4300pF) . . . . . . . . 75ns (max) • Low voltage lock-out feature - HS-4423RH, HS-4423EH, . . . . . . . . . . . . . . . . . . . . . <10.0V - HS-4423BRH, HS-4423BEH . . . . . . . . . . . . . . . . . . . . . <7.5V • Wide supply voltage range . . . . . . . . . . . . . . . . . . . 12V to 18V • Prop delay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250ns (max) • Consistent delay times with VCC changes • Low power consumption - 40mW with inputs high - 20mW with inputs low • Low equivalent input capacitance . . . . . . . . . . . . . 3.2pF (typ) • ESD protected. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4000V Applications • Switching power supplies • DC/DC converters • Motor controllers Pin Configuration HS-4423RH, HS-4423EH, HS-4423BRH, HS-4423BEH (FLATPACK CDFP4-F16) TOP VIEW NC 1 16 NC IN A 2 15 OUT A NC 3 14 OUT A GND A 4 13 VCC GND B 5 12 VCC NC 6 11 OUT B IN B 7 10 OUT B NC 8 9 NC NOTE: Pins 4 and 5, 10 and 11, 12 and 13, 14 and 15 are double-bonded to their same electrical points on the die. February 11, 2014 FN4564.5 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2002, 2014. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners. HS-4423RH, HS-4423EH, HS-4423BRH, HS-4423BEH Ordering Information ORDERING SMD NUMBER (Note 2) PART NUMBER (Note 1) TEMPERATURE RANGE (°C) PACKAGE (RoHS Compliant) PKG. DWG. # 5962F9951101VXC HS9-4423RH-Q -55 to +125 16 Ld Flatpack K16.A 5962F9951101QXC HS9-4423RH-8 -55 to +125 16 Ld Flatpack K16.A HS9-4423RH/PROTO HS9-4423RH/PROTO -55 to +125 16 Ld Flatpack K16.A 5962F9951102VXC HS9-4423BRH-Q -55 to +125 16 Ld Flatpack K16.A 5962F9951102QXC HS9-4423BRH-8 -55 to +125 16 Ld Flatpack K16.A 5962F9951103VXC HS9-4423EH-Q -55 to +125 16 Ld Flatpack K16.A 5962F9951104VXC HS9-4423BEH-Q -55 to +125 16 Ld Flatpack K16.A HS9-4423BRH/PROTO HS9-4423BRH/PROTO -55 to +125 16 Ld Flatpack K16.A 5962F9951101V9A HS0-4423RH-Q -55 to +125 Die 5962F9951103V9A HS0-4423EH-Q -55 to +125 Die NOTES: 1. These Intersil Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. 2. Specifications for Rad Hard QML devices are controlled by the Defense Logistics Agency Land and Maritime (DLA). The SMD numbers listed in the “Ordering Information” table must be used when ordering. 2 FN4564.5 February 11, 2014 HS-4423RH, HS-4423EH, HS-4423BRH, HS-4423BEH Die Characteristics DIE DIMENSIONS: Backside Finish: 4890µm x 3370µm (193 mils x 133 mils) Thickness: 483µm ± 25.4µm (19 mils ± 1 mil) INTERFACE MATERIALS: Silicon ASSEMBLY RELATED INFORMATION: Substrate Potential: Glassivation: Unbiased (DI) Type: PSG (Phosphorous Silicon Glass) Thickness: 8.0kÅ ± 1.0kÅ ADDITIONAL INFORMATION: Worst Case Current Density: Top Metallization: <2.0 x 105 A/cm2 Type: AlSiCu Thickness: 16.0kÅ ± 2kÅ Transistor Count: Substrate: 125 Radiation Hardened Silicon Gate, Dielectric Isolation Metallization Mask Layout HS-4423RH, HS-4423EH, HS-4423BRH, HS-4423BEH GND (4) GND (5) IN A (2) IN B (7) OUT B (10) OUT A (15) OUT B (11) OUT A (14) VCC (12) VCC (13) For additional products, see www.intersil.com/en/products.html Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 3 FN4564.5 February 11, 2014