Reliability Data Report Product Family R461 LTC1743 \ LTC1744 \ LTC2301 \ LTC2302 \ LTC2305 \ LTC2306 \ LTC2308 \ LTC2309 \ LTC2440 \ LTC2442 \ LTC2444 \ LTC2445 \ LTC2446 \ LTC2447 \ LTC2448 \ LTC2449 \ LTC2450 \ LTC2451 \ LTC2452 \ LTC2453 \ LTC2460 \ LTC2461 \ LTC2462 \ LTC2463 \ LTC2470 \ LTC2471 \ LTC2472 \ LTC2473 \ LTC2480 \ LTC2481 \ LTC2482 \ LTC2483 \ LTC2484 \ LTC2485 \ LTC2486 \ LTC2487 \ LTC2488 \ LTC2489 \ LTC2490 \ LTC2492 \ LTC2493 \ LTC2494 \ LTC2495 \ LTC2496 \ LTC2497 \ LTC2498 \ LTC2499 \ LTC2600 \ LTC2601 \ LTC2602 \ LTC2604 \ LTC2605 \ LTC2606 \ LTC2607 \ LTC2609 \ LTC2610 \ LTC2611 \ LTC2612 \ LTC2614 \ LTC2615 \ LTC2616 \ LTC2617 \ LTC2619 \ LTC2620 \ LTC2621 \ LTC2622 \ LTC2624 \ LTC2525 \ LTC2626 \ LTC2627 \ LTC2629 \ LTC2630 \ LTC2631 \ LTC2632 \ LTC2633 \ LTC2634 \ LTC2635 \ LTC2636 \ LTC2637 \ LTC2640 \ LTC2641 \ LTC2642 \ LTC2644 \ LTC2645 \ LTC2654 \ LTC2655 \ LTC2656 \ LTC2657 Reliability Data Report Report Number: R461 Report generated on: Mon Aug 17 10:25:22 PDT 2015 OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE OLDEST DATE NEWEST DATE K DEVICE HRS CODE CODE (+125°C) 1 No. of FAILURES 2,3 QFN/DFN SSOP/TSSOP SOIC/MSOP 1760 1073 782 0421 0213 0416 1010 0928 1352 1434 1034 573 0 0 0 SOT Totals 240 3,855 0802 - 1030 - 427 3,468 0 0 HIGHLY ACCELERATED STRESS TEST AT +130 DEG C / 85% RH PACKAGE TYPE SAMPLE SIZE OLDEST DATE NEWEST DATE K DEVICE HRS No. of FAILURES 4 CODE CODE (+85°C) QFN/DFN 296 0817 1206 570 0 Totals 296 - - 570 0 K DEVICE HRS No. of FAILURES PRESSURE COOKER TEST AT 15 PSIG , +121 DEG C PACKAGE TYPE SAMPLE SIZE QFN/DFN SSOP/TSSOP SOIC/MSOP 2626 1253 1228 SOT Totals 4655 9,762 OLDEST DATE NEWEST DATE CODE CODE 0440 0226 0628 1404 1408 1412 113 190 158 0 0 0 0710 - 1422 - 202 663 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE CYCLES TEMP CYCLE FROM -65 TO 150 DEG C PACKAGE TYPE SAMPLE SIZE QFN/DFN 2431 0440 1404 588 0 SSOP/TSSOP SOIC/MSOP SOT 2126 1415 3857 0226 0628 0715 1408 1412 1413 693 652 614 0 0 0 Totals 9,829 - - 2,547 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES THERMAL SHOCK FROM -65 TO 150 DEG C PACKAGE TYPE SAMPLE SIZE CODE CODE CYCLES QFN/DFN SSOP/TSSOP 2268 1670 0440 0329 1404 1408 432 281 0 0 SOIC/MSOP SOT Totals 1417 3869 9,224 0630 0713 - 1412 1413 - 653 614 1,980 0 0 0 (1) Assumes Activation Energy = 0.7 Electron Volts (2) Failure Rate Equivalent to +55 °C, 60% Confidence Level =3.42 FITS (3) Mean Time Between Failure in Years = 33411.13 (4) Assumes 20X Acceleration from 85 °C to +130 °C Note 1: 1 FIT = 1 Failure in One Billion Hours. Note 2: HAST, Temp Cycle & Thermal Shock are subjected to J-STD-020 MSL Preconditioning Reliability Data Report Report Number: R461 Report generated on: Mon Aug 17 10:25:22 PDT 2015 HIGH TEMPERATURE BAKE AT 150 DEG C PACKAGE TYPE SAMPLE SIZE QFN/DFN Totals 454 454 OLDEST DATE NEWEST DATE K DEVICE HRS No. of FAILURES CODE CODE 1002 - 1404 - 454 454 0 0 OLDEST DATE NEWEST DATE K DEVICE HRS No. of FAILURES HIGH TEMPERATURE BAKE AT 175 DEG C PACKAGE TYPE SAMPLE SIZE CODE CODE QFN/DFN SOIC/MSOP 154 50 0945 0804 0947 0810 154 50 0 0 SOT Totals 74 278 1305 - 1334 - 74 278 0 0